Patents by Inventor Qingjun Cai

Qingjun Cai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070047388
    Abstract: A fluidic micromixer comprises a plurality of fluid inlets in communication with a mixing chamber, the plurality of fluid inlets being adapted to introduce into the chamber a corresponding plurality of distinct fluid streams. The mixing chamber comprises at least one surface patterned to define hydrophobic and hydrophilic regions spaced apart along a principal direction of fluid flow within the chamber from the fluid inlets to a fluid outlet, the regions being adapted to induce fluid flow in a direction transverse to the principal direction of fluid flow to mix the fluid streams. At least one of the hydrophobic regions may comprise microstructures patterned on the at least one surface. Also disclosed are a method for fabricating the micromixer, a method of mixing a plurality of fluid streams by vortex mixing or instability mixing, and a system comprising the micromixer, fluid reservoirs and a pump for generating flow of fluids from the reservoirs to the micromixer.
    Type: Application
    Filed: September 26, 2005
    Publication date: March 1, 2007
    Inventors: Jeffrey DeNatale, Chung-Lung Chen, Qingjun Cai, Chialun Tsai
  • Publication number: 20060146496
    Abstract: A cooling apparatus, system, and method are provided. The cooling apparatus includes at least one printed circuit board having opposed major surfaces, and at least one electrical component or other heat source positioned on one major surface of the printed circuit board. The cooling apparatus also includes a pulsating heat pipe having at least a portion that is positioned to either extend along and proximate to one of the major surfaces or be embedded within the printed circuit board. As such, the pulsating heat pipe is capable of transferring heat from the printed circuit board.
    Type: Application
    Filed: January 6, 2005
    Publication date: July 6, 2006
    Inventors: Julie Asfia, Chung-Lung Chen, Qingjun Cai