Patents by Inventor Qingwen Deng

Qingwen Deng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12131108
    Abstract: A method for providing an IC design is disclosed. The method includes receiving and synthesizing a behavioral description of an IC design; generating, based on the synthesized behavioral description, a layout for the IC design; performing at least a timing analysis on the layout; accessing, based on the timing analysis, a first cell library including a plurality of transistor-based cells, each having one or more transistors and associated with a respective first delay value; accessing, based on the timing analysis, a second cell library including a plurality of non-transistor-based cells, each having no transistor and associated with a respective second delay value; and updating the layout by at least one of inserting one or more of the plurality of transistor-based cells or inserting one or more of the plurality of non-transistor-based cells.
    Type: Grant
    Filed: November 22, 2023
    Date of Patent: October 29, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Kenan Yu, Qingwen Deng
  • Publication number: 20240354486
    Abstract: Systems and methods include receiving a functional integrated circuit design and generating a plurality of place and route (PnR) layouts based on the received functional integrated circuit design and one or more integrated circuit floorplans may be generated. One or more fuzzy logic rules may be applied to analyze attributes associated with each of the generated PnR layouts, and a PnR layout of the plurality of PnR layouts having an area utilization complying with the one or more fuzzy logic rules may be generated.
    Type: Application
    Filed: June 28, 2024
    Publication date: October 24, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chao Tong, Qingwen Deng
  • Patent number: 12112991
    Abstract: A system on wafer assembly structure and an assembly method thereof. The system on wafer assembly structure comprises: a wafer layer, a dielectric layer and a circuit board layer sequentially stacked, and each provided with a bonding region, a testing region and an alignment region, respectively, a first assembly, and a second assembly, wherein the first assembly is arranged on one side of the wafer layer far away from the dielectric layer, and comprises a bearing portion and at least one latch portion connected with each other, and the bearing portion is detachably connected with the wafer layer. The second assembly is at least partially arranged around the first assembly. The second assembly has a hole portion for accommodating a latch portion, and the inner diameter of the hole portion is larger than the outer diameter of the latch portion.
    Type: Grant
    Filed: October 30, 2023
    Date of Patent: October 8, 2024
    Assignee: ZHEJIANG LAB
    Inventors: Qingwen Deng, Kun Zhang, Ruyun Zhang
  • Patent number: 12050853
    Abstract: Systems and methods include receiving a functional integrated circuit design and generating a plurality of place and route (PnR) layouts based on the received functional integrated circuit design and one or more integrated circuit floorplans may be generated. One or more fuzzy logic rules may be applied to analyze attributes associated with each of the generated PnR layouts, and a PnR layout of the plurality of PnR layouts having an area utilization complying with the one or more fuzzy logic rules may be generated.
    Type: Grant
    Filed: July 21, 2023
    Date of Patent: July 30, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chao Tong, Qingwen Deng
  • Patent number: 11983481
    Abstract: The present disclosure relates to software-defined methods and apparatuses for designing a wafer-level switching system, including: determining wafer-level switching system layout constraints; constructing a target wafer-level switching system and determining parameters, and designing a logical topology of a switching network; designing a layout of the switching chiplets on the wafer substrate; respectively designing interface structures of external chiplets and internal chiplets; configuring a switching mode and an enable state of each port of the switching chiplets; ending the process when the target logical topology can be achieved by the wafer-level switching system; otherwise, reconstructing a logical topology of a switching network and mapping it to the substrate.
    Type: Grant
    Filed: July 12, 2023
    Date of Patent: May 14, 2024
    Assignee: ZHEJIANG LAB
    Inventors: Zhiquan Wan, Shunbin Li, Ruyun Zhang, Weihao Wang, Qingwen Deng
  • Publication number: 20240086605
    Abstract: A method for providing an IC design is disclosed. The method includes receiving and synthesizing a behavioral description of an IC design; generating, based on the synthesized behavioral description, a layout for the IC design; performing at least a timing analysis on the layout; accessing, based on the timing analysis, a first cell library including a plurality of transistor-based cells, each having one or more transistors and associated with a respective first delay value; accessing, based on the timing analysis, a second cell library including a plurality of non-transistor-based cells, each having no transistor and associated with a respective second delay value; and updating the layout by at least one of inserting one or more of the plurality of transistor-based cells or inserting one or more of the plurality of non-transistor-based cells.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kenan Yu, Qingwen Deng
  • Publication number: 20240020455
    Abstract: The present disclosure relates to software-defined methods and apparatuses for designing a wafer-level switching system, including: determining wafer-level switching system layout constraints; constructing a target wafer-level switching system and determining parameters, and designing a logical topology of a switching network; designing a layout of the switching chiplets on the wafer substrate; respectively designing interface structures of external chiplets and internal chiplets; configuring a switching mode and an enable state of each port of the switching chiplets; ending the process when the target logical topology can be achieved by the wafer-level switching system; otherwise, reconstructing a logical topology of a switching network and mapping it to the substrate.
    Type: Application
    Filed: July 12, 2023
    Publication date: January 18, 2024
    Inventors: Zhiquan WAN, Shunbin LI, Ruyun ZHANG, Weihao WANG, Qingwen DENG
  • Patent number: 11853667
    Abstract: A method for providing an integrated circuit design is disclosed. The method includes receiving and synthesizing a behavioral description of an integrated circuit design. The method includes generating, based on the synthesized behavioral description, a layout by placing and routing a plurality of transistor-based cells. The method includes selectively accessing a cell library that includes a plurality of non-transistor-based cells, each of the plurality of non-transistor-based cells associated with a respective delay value. The method includes updating the layout by inserting one or more of the plurality of non-transistor-based cells.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Kenan Yu, Qingwen Deng
  • Publication number: 20230359806
    Abstract: Systems and methods include receiving a functional integrated circuit design and generating a plurality of place and route (PnR) layouts based on the received functional integrated circuit design and one or more integrated circuit floorplans may be generated. One or more fuzzy logic rules may be applied to analyze attributes associated with each of the generated PnR layouts, and a PnR layout of the plurality of PnR layouts having an area utilization complying with the one or more fuzzy logic rules may be generated.
    Type: Application
    Filed: July 21, 2023
    Publication date: November 9, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chao Tong, Qingwen Deng
  • Patent number: 11748552
    Abstract: Systems and methods include receiving a functional integrated circuit design and generating a plurality of place and route (PnR) layouts based on the received functional integrated circuit design and one or more integrated circuit floorplans may be generated. One or more fuzzy logic rules may be applied to analyze attributes associated with each of the generated PnR layouts, and a PnR layout of the plurality of PnR layouts having an area utilization complying with the one or more fuzzy logic rules may be generated.
    Type: Grant
    Filed: July 18, 2022
    Date of Patent: September 5, 2023
    Inventors: Chao Tong, Qingwen Deng
  • Patent number: 11705437
    Abstract: An interconnection structure of a system on wafer and a PCB based on a TSV process and a method for manufacturing the same. The structure comprises a bottom structural part and a top structural part, the upper surface of the bottom structural part is provided with a plurality of positioning holes; the lower surface of the top structural part is provided with positioning pins; the upper surface of the bottom structural part is provided with a bottom groove, and a system on wafer is arranged in the bottom groove; the lower surface of the system on wafer is connected with the bottom groove; the lower surface of the top structural part is provided with a top groove, and a PCB preformed die is connected in the top groove, and the other end of the PCB preformed die is connected with the system on wafer by an elastic connector.
    Type: Grant
    Filed: January 19, 2023
    Date of Patent: July 18, 2023
    Assignee: ZHEJIANG LAB
    Inventors: Qingwen Deng, Kun Zhang, Shunbin Li, Ruyun Zhang
  • Patent number: 11537773
    Abstract: A method for providing an integrated circuit design is disclosed. The method includes receiving and synthesizing a behavioral description of an integrated circuit design. The method includes generating, based on the synthesized behavioral description, a layout by placing and routing a plurality of transistor-based cells. The method includes selectively accessing a cell library that includes a plurality of non-transistor-based cells, each of the plurality of non-transistor-based cells associated with a respective delay value. The method includes updating the layout by inserting one or more of the plurality of non-transistor-based cells.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: December 27, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Kenan Yu, Qingwen Deng
  • Publication number: 20220366114
    Abstract: A method for providing an integrated circuit design is disclosed. The method includes receiving and synthesizing a behavioral description of an integrated circuit design. The method includes generating, based on the synthesized behavioral description, a layout by placing and routing a plurality of transistor-based cells. The method includes selectively accessing a cell library that includes a plurality of non-transistor-based cells, each of the plurality of non-transistor-based cells associated with a respective delay value. The method includes updating the layout by inserting one or more of the plurality of non-transistor-based cells.
    Type: Application
    Filed: July 26, 2022
    Publication date: November 17, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kenan Yu, Qingwen Deng
  • Publication number: 20220350951
    Abstract: Systems and methods include receiving a functional integrated circuit design and generating a plurality of place and route (PnR) layouts based on the received functional integrated circuit design and one or more integrated circuit floorplans may be generated. One or more fuzzy logic rules may be applied to analyze attributes associated with each of the generated PnR layouts, and a PnR layout of the plurality of PnR layouts having an area utilization complying with the one or more fuzzy logic rules may be generated.
    Type: Application
    Filed: July 18, 2022
    Publication date: November 3, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chao Tong, Qingwen Deng
  • Patent number: 11392748
    Abstract: Systems and methods include receiving a functional integrated circuit design and generating a plurality of place and route (PnR) layouts based on the received functional integrated circuit design and one or more integrated circuit floorplans may be generated. One or more fuzzy logic rules may be applied to analyze attributes associated with each of the generated PnR layouts, and a PnR layout of the plurality of PnR layouts having an area utilization complying with the one or more fuzzy logic rules may be generated.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: July 19, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chao Tong, Qingwen Deng
  • Publication number: 20210357561
    Abstract: A method for providing an integrated circuit design is disclosed. The method includes receiving and synthesizing a behavioral description of an integrated circuit design. The method includes generating, based on the synthesized behavioral description, a layout by placing and routing a plurality of transistor-based cells. The method includes selectively accessing a cell library that includes a plurality of non-transistor-based cells, each of the plurality of non-transistor-based cells associated with a respective delay value. The method includes updating the layout by inserting one or more of the plurality of non-transistor-based cells.
    Type: Application
    Filed: March 9, 2021
    Publication date: November 18, 2021
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kenan Yu, Qingwen Deng
  • Publication number: 20200104459
    Abstract: Systems and methods include receiving a functional integrated circuit design and generating a plurality of place and route (PnR) layouts based on the received functional integrated circuit design and one or more integrated circuit floorplans may be generated. One or more fuzzy logic rules may be applied to analyze attributes associated with each of the generated PnR layouts, and a PnR layout of the plurality of PnR layouts having an area utilization complying with the one or more fuzzy logic rules may be generated.
    Type: Application
    Filed: September 13, 2019
    Publication date: April 2, 2020
    Inventors: Chao Tong, Qingwen Deng
  • Patent number: 6760873
    Abstract: A built-in self test implementation for testing the speed and timing margins of the IO pins of a source synchronous IO interface (SSIO). The implementation preferably includes built-in self test logic including a pseudo-random pattern generator which is configured to generate input sequences. Buffers are connected to the IO pins, and the buffers are configured to receive the input sequences. The buffers are connected to multiple input signature registers, and the multiple input signature registers are configured to receive the input sequences from the pseudo-random pattern generator and generate signatures. Comparators are provided to compare the signatures to expected vector values and generate a pass/fail output signal. Preferably, at least one programmable delay cell is disposed between each buffer and the multiple input signature registers. The programmable delay cells provide that propagation delays can be set to perform timing margin tests.
    Type: Grant
    Filed: March 23, 2001
    Date of Patent: July 6, 2004
    Assignee: LSI Logic Corporation
    Inventors: Hong Hao, Keven B Hui, Qingwen Deng, Chung-Jen Yui