Patents by Inventor Qingyi ZHAO

Qingyi ZHAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • TYPE OF TRIPLE NETWORK COOLING HYDROGEL WITH HIGH COMPRESSIVE AND ELASTIC
    Publication number: 20240043729
    Abstract: The invention provides triple crosslinked cooling hydrogel compositions of high tensile strength, high compressibility, high elasticity, and long cooling period and methods of making the compositions. The compositions are useful in clothing and equipment for wear in high solar radiation environments and high temperature environments.
    Type: Application
    Filed: July 12, 2023
    Publication date: February 8, 2024
    Inventors: Yuyan WANG, Tianqi ZHOU, Zhixiong HOU, Rui LUO, Ling LIN, Zheng GU, Peng ZHOU, Le LIU, Qingyi ZHAO, Marc DUDELZAK
  • Printed circuit board and mobile device
    Patent number: 10582613
    Abstract: A printed circuit board includes: a board body including one or more wiring layers; a control chip and a target electronic component arranged on one of the one or more the wiring layers on a surface of the board body; a target wiring layer where the target electronic component is placed including a copper absent area around the target electronic component, and a ground backflow connection arranged around the target electronic component to electrically connect a copper area which is formed by the copper absent area with a primary copper area on the target wiring layer.
    Type: Grant
    Filed: October 9, 2018
    Date of Patent: March 3, 2020
    Assignee: Hisense Mobile Communications Technology Co., Ltd
    Inventor: Qingyi Zhao
  • Printed Circuit Board And Mobile Device
    Publication number: 20190045628
    Abstract: A printed circuit board includes: a board body including one or more wiring layers; a control chip and a target electronic component arranged on one of the one or more the wiring layers on a surface of the board body; a target wiring layer where the target electronic component is placed including a copper absent area around the target electronic component, and a ground backflow connection arranged around the target electronic component to electrically connect a copper area which is formed by the copper absent area with a primary copper area on the target wiring layer.
    Type: Application
    Filed: October 9, 2018
    Publication date: February 7, 2019
    Inventor: Qingyi ZHAO