Abstract: A coated metal alloy substrate for an electronic device, a process for producing a coated metal alloy substrate for an electronic device and a housing for an electronic device, comprising a coated metal alloy substrate wherein the coated metal alloy CA substrate comprises at least one chamfered edge (1) and comprises: a passivation layer (2) deposited on the at least one chamfered edge (1); an electrophoretic deposition layer (3) deposited on the passivation layer (2); and a hydrophobic layer (4) deposited on the electrophoretic deposition layer (3).

Abstract: A coated metal alloy substrate, a process for producing a coated metal alloy substrate, and an electronic device having a housing comprising a coated metal alloy substrate are described. The coated metal alloy substrate comprises an electrolytic sealing layer on the metal alloy substrate, and an electrophoretic deposition layer deposited on the electrolytic sealing layer.

Abstract: In one example, an electronic device housing may include a substrate, a micro-arc oxidation layer formed on a surface of the substrate, and an electroless plating layer formed on the micro-arc oxidation layer. Example electroless plating layer may be one of an electroless tin plating layer and an electroless silver plating layer. Further, the electronic device housing may include an electrophoretic deposition layer formed on the electroless plating layer.

Abstract: The present disclosure is drawn to a cutting fluid for use in computer numerical control milling. The cutting fluid can include from about 10 wt % to about 90 wt % of a C2 to C6 alcohol; from about 0.1 wt % to about 20 wt % of a chelating agent; from about 0.5 wt % to about 15 wt % of a metal ion selected from aluminum ion, chromium ion, nickel ion, tin ion, zinc ion, or a combination thereof; and from about 8.5 wt % to about 88.5 wt % water. The cutting fluid can have a surface tension that can range from about 22 dynes/cm to about 55 dynes/cm.