Abstract: The invention provides an AC/DC conversion device for intelligent green-power operation and maintenance in power transmission and transformation projects, including a cabinet, an assembling panel, an inverter, a driving mechanism and a controller. A door is mounted at the front portion of the cabinet in a fixed and sealed manner, and the assembling panel is fixedly mounted on the back wall of the cabinet inside the cabinet. The assembling panel, the inverter, the driving mechanism and the controller are all provided inside the cabinet, which provides desirable dust-proof effects, preventing the case where the inverter, the driving mechanism and the controller are interfered by the dust, so that this device is suitable for outdoor usage. The driving mechanism and the controller work in coordination, so that the inverter can be switched off in time when it burns out and smokes, thereby substantially reducing the risk of fire hazards.

Abstract: The invention provides an AC/DC conversion device for intelligent green-power operation and maintenance in power transmission and transformation projects, including a cabinet, an assembling panel, an inverter, a driving mechanism and a controller. A door is mounted at the front portion of the cabinet in a fixed and sealed manner, and the assembling panel is fixedly mounted on the back wall of the cabinet inside the cabinet. The assembling panel, the inverter, the driving mechanism and the controller are all provided inside the cabinet, which provides desirable dust-proof effects, preventing the case where the inverter, the driving mechanism and the controller are interfered by the dust, so that this device is suitable for outdoor usage. The driving mechanism and the controller work in coordination, so that the inverter can be switched off in time when it burns out and smokes, thereby substantially reducing the risk of fire hazards.

Abstract: A system is disclosed. The system includes at least one physical memory device to store scaling correction logic and one or more processors coupled with the at least one physical memory device to execute the scaling correction logic to receive first measured print image data associated with printed test marks on a first print medium from a first side of a first page image of a print job and second measured print image data associated with printed test marks on the first print medium from a second side of the first page image, generate a first side scaling factor based on the first measured print image data and a second side scaling factor based on the second measured print image data, generate a first page scaling factor including the first side scaling factor and the second side scaling factor and generate a scaling factor correction based on the page scaling factor.

Abstract: A system for sharing sensor data between a vehicle and a plurality of remote system generally includes a vehicle communication system, a three-dimensional (3D) sensor, and a controller. The controller is programmed to generate an initial 3D point cloud using the 3D sensor, generate an occupancy grid map based on the initial 3D point cloud, and select a producer remote system to provide data for a cell of the occupancy grid map classified as a first blindspot. The controller is further programmed to send a data request to the producer remote system using the vehicle communication system, receive data from the producer remote system including information about the cell of the occupancy grid map classified as the first blindspot, generate a merged 3D point cloud by merging the data received from the producer remote system with the initial 3D point cloud, and identify objects using the merged 3D point cloud.

Abstract: The present disclosure provides a microfluidic substrate, a microfluidic chip and a micro total analysis system. The microfluidic substrate includes a substrate and an ultrasonic structure on the substrate. The ultrasonic structure is configured to generate ultrasonic waves during a droplet splitting process to vibrate a droplet.

Abstract: The systems and methods described herein are for monitoring the tightness of bolts. The systems and methods may be used with a mechanism to apply a percussive tap and with a recording or monitoring device for detecting and recording the acoustic signals that are generated by the percussive tap. The acoustic signals generated by percussive taps applied to bolts in various looseness states are analyzed and a machine learning model is developed that allows for determining bolt looseness based on the acoustic signals.

Abstract: The present disclosure relates to a display substrate, a display device and a manufacturing method of the display substrate. The display substrate includes: a stretchable base including a plurality of opening patterns distributed along a surface of the stretchable base, wherein each of the plurality of opening patterns includes a plurality of opening areas, a plurality of bridge areas configured to enclose a first island area are formed between adjacent opening areas among the plurality of opening areas, and each of the plurality of opening patterns is configured to enclose a plurality of second island areas with at least two adjacent opening patterns; a plurality of display units respectively arranged on the first island area and the plurality of second island areas; and a plurality of signal lines respectively connected between the plurality of display units and respectively arranged in the plurality of bridge areas.

Abstract: A system for sharing sensor data between a vehicle and a plurality of remote system generally includes a vehicle communication system, a three-dimensional (3D) sensor, and a controller. The controller is programmed to generate an initial 3D point cloud using the 3D sensor, generate an occupancy grid map based on the initial 3D point cloud, and select a producer remote system to provide data for a cell of the occupancy grid map classified as a first blindspot. The controller is further programmed to send a data request to the producer remote system using the vehicle communication system, receive data from the producer remote system including information about the cell of the occupancy grid map classified as the first blindspot, generate a merged 3D point cloud by merging the data received from the producer remote system with the initial 3D point cloud, and identify objects using the merged 3D point cloud.

Abstract: The present disclosure relates to a semiconductor packaging method. The method includes: providing a first wafer; and performing a wafer stacking operation a plurality of times. The wafer stacking operation includes: forming a first to-be-bonded wafer in the shape of a boss, where the first to-be-bonded wafer includes a base and a protrusion from the base, and orientating the protrusion toward a second to-be-bonded wafer and bonding the protrusion to the second to-be-bonded wafer; forming a first dielectric layer on a surface of the protrusion; and performing second trimming on an edge region of the protrusion and an edge region of the second to-be-bonded wafer, so that the remainder of the second to-be-bonded wafer after the second trimming is in the shape of a boss, and using the remainder of the wafer stack after the second trimming as the first to-be-bonded wafer for next wafer stacking.

Abstract: A method of manufacturing a metal wire, a method of manufacturing a metal wire grid, a wire grid polarizer, and an electronic device are provided. The method of manufacturing a metal wire includes: forming a metal material layer on a base substrate; etching the metal material layer by using a composite gas including an etching gas and a coating reaction gas to form the metal wire and a protective coating layer on a surface of the metal wire.

Abstract: A PIN device includes: a first doped layer, a second doped layer, and an intrinsic layer between the first doped layer and the second doped layer, where the second doped layer includes a body portion and an electric field isolating portion at least partially enclosing the body portion; and the electric field isolating portion is doped differently from the body portion.

Abstract: An array substrate and a method for manufacturing the same, a method and assembly for detecting light, and a display device are provided. The array substrate includes: a base substrate having a pixel region; a light detecting unit, a switch unit, and a light emitting unit that are located in the pixel region, where the light emitting unit and the light detecting unit share the switch unit.

Abstract: The present disclosure is related to an array substrate. The array substrate may include a base substrate; a plurality or light-emitting devices on the base substrate; a photosensitive device between the light-emitting devices and the base substrate; and a refractive layer between the photosensitive device and the light-emitting devices. The refractive layer may be at a distance from the photosensitive device, and the refractive layer may cover at least a gap region between the adjacent light-emitting devices. A refractive index of the refractive layer may be larger than a refractive index of a film layer in the gap region between the refractive layer and the photosensitive device, and an orthographic protection of the photosensitive device on the base substrate may at least partially overlap an orthographic projection of the light-emitting devices on base substrate.

Abstract: A light-emitting unit and a method for manufacturing the same are provided. The light-emitting unit includes a first semiconductor layer, a light-emitting layer and a second semiconductor layer that are distributed in a stacking manner. At least one of the first semiconductor layer or the second semiconductor layer is at least in contact with a part of layer surfaces and a part of side of the light-emitting layer, the first semiconductor layer is insulated from the second semiconductor layer, and one of the first semiconductor layer and the second semiconductor layer is an N-type semiconductor layer, and the other is a P-type semiconductor layer. The present disclosure is conducive to increasing the light-emitting area and the light extraction efficiency of the light-emitting unit.

Abstract: The present disclosure provides a polarizing device and a method for preparing the same, a display substrate, and a display device. The polarizing device includes: a base substrate, a metal wire grid, and an anti-reflection layer, in which the metal wire grid is arranged on the base substrate, the anti-reflection layer is arranged on the surface of the metal wire grid away from the base substrate, and the anti-reflection layer is a carbon film layer.

Abstract: The present application discloses a semiconductor apparatus, a pixel circuit and a control method thereof. The semiconductor apparatus comprises: an active layer; a first insulating layer; a first gate and a second gate overlapping with a portion of the active layer with the first insulating layer interposed therebetween, respectively; a first electrode, a second electrode and a third electrode, the first electrode and the second electrode are electrically connected with a first portion and a second portion of the active layer, respectively, the third electrode is used to be electrically connected with a photosensitive device, wherein the third electrode is electrically connected with the first gate or the second gate; or the third electrode is electrically connected with a third portion of the active layer.

Abstract: An array substrate is provided. The array substrate includes a display area having a first array of subpixels; and a partially transparent area having a second array of subpixels. The partially transparent area includes a plurality of light emitting regions spaced apart from each other by a substantially transparent non-light emitting region. The second array of subpixels is limited in the plurality of light emitting regions. The array substrate further includes a plurality of photosensors and a plurality of first thin film transistors in the substantially transparent non-light emitting region. A respective one of the plurality of photosensors includes a first polarity semiconductor layer, a second polarity semiconductor layer, and an intrinsic semiconductor layer connecting the first polarity semiconductor layer and the second polarity semiconductor layer.

Abstract: Disclosed is a continuous and forced asphalt mixing production method, which relates to the technical field of concrete processing and includes the following steps of: heating a cold aggregate to obtain a hot aggregate, hot mixing and/or cold mixing the milled materials to obtain recycled materials; blending the hot aggregate, the recycled materials, the powder materials and the asphalt to obtain a premix; temporarily storing the premix in a pre-stirring storage bin and then stirring the premix in a forced stirring cylinder, temporarily storing the obtained finished product materials in a finished product storage bin; in the finished product material loading area, unloading into a storage tank of a finished product material conveying vehicle.

Abstract: The present disclosure provides a semiconductor device and a method for manufacturing the same, and it relates to a field of semiconductor technology. The semiconductor device includes a substrate, a semiconductor layer, a dielectric layer, a source, a drain, and a gate, wherein a first face of the gate close to a side of the drain and close to the semiconductor layer has a first curved face. A gate trench corresponding to the gate is provided on the dielectric layer, a material of the gate being filled in the gate trench, and at least a part of a second face of the gate trench in contact with the gate is a second curved face which extends from a surface of the dielectric layer away from the semiconductor layer toward the semiconductor layer.

Abstract: Disclosed is a valve mechanical linkage system. A valve comprises a main valve and a secondary valve; the system comprises a first transmission mechanism and a second transmission mechanism; the first transmission mechanism is connected with the main valve and used for converting the up-and-down reciprocating motion of the main valve into a rotational reciprocating motion; the first transmission mechanism and the second transmission mechanism are connected by means of a coupling (4), and the rotational force of the rotational reciprocating motion is transferred to the second transmission mechanism by means of the coupling (4); the second transmission mechanism is connected with the secondary valve, and achieves on-off control on the secondary valve by converting the rotational reciprocating motion into the up-and-down reciprocating motion.