Abstract: In the printed circuit board, normal pads that are not peeled off or damaged are first pads, Each first pad and a wire connected to the first pad have an integrated structure and are directly formed on a substrate. After a pad at a position on the substrate is peeled off, a second pad can be provided at the position, so as to replace the pad that was peeled off. The second pad comes into contact with the wire and is fixed to the wire by solder. The first pin of a component is lapped with the first pad and is fixed with the first pad by solder. The second pin of the component is lapped with the second pad and is fixed with the second pad by solder.

Abstract: The present disclosure provides a conductive agent and a module bonding method. In the method, a conductive agent is sprayed to a bonding region. The conductive agent comprising a liquid ultraviolet curable adhesive and conductive particles dispersed in the ultraviolet curable adhesive. A module layer is pre-pressed onto the bonding region with the conductive agent between the module layer and the bonding region. The conductive agent is cured by irradiating the conductive agent with ultraviolet rays and pressurizing the conductive agent, so that the module layer is electrically connected and bonded to the bonding region.

Abstract: The present disclosure provides a conductive agent and a module bonding method. In the method, a conductive agent is sprayed to a bonding region. The conductive agent comprising a liquid ultraviolet curable adhesive and conductive particles dispersed in the ultraviolet curable adhesive. A module layer is pre-pressed onto the bonding region with the conductive agent between the module layer and the bonding region. The conductive agent is cured by irradiating the conductive agent with ultraviolet rays and pressurizing the conductive agent, so that the module layer is electrically connected and bonded to the bonding region.