Patents by Inventor Qinrong Yu

Qinrong Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200328814
    Abstract: Optical transceivers with optical packaging designs to reduce inside transceiver components, simplify the fabrication, and improve the optical alignment and other optical transceiver characteristics.
    Type: Application
    Filed: April 29, 2020
    Publication date: October 15, 2020
    Inventors: Xiaobing Luo, Zining Huang, Zhigang Zhou, Terrence Kerr, Qinrong Yu
  • Patent number: 9397471
    Abstract: Embodiments of the present description relate to mechanisms for transferring heat through a microelectronic substrate from a photonic device to a heat dissipation device. In one embodiment, the microelectronic substrate may comprise a highly thermally conductive dielectric material. In another embodiment, the microelectronic substrate may comprise a conductive insert within the microelectronic substrate wherein the photonic device is in thermal contact with the conductive insert proximate one surface of the microelectronic substrate and the heat dissipation device is thermal contact with the conductive insert proximate an opposing surface of the microelectronic substrate.
    Type: Grant
    Filed: November 14, 2014
    Date of Patent: July 19, 2016
    Assignee: Intel Corporation
    Inventors: Zhihua Li, Qing Tan, Qinrong Yu
  • Publication number: 20160141831
    Abstract: Embodiments of the present description relate to mechanisms for transferring heat through a microelectronic substrate from a photonic device to a heat dissipation device. In one embodiment, the microelectronic substrate may comprise a highly thermally conductive dielectric material. In another embodiment, the microelectronic substrate may comprise a conductive insert within the microelectronic substrate wherein the photonic device is in thermal contact with the conductive insert proximate one surface of the microelectronic substrate and the heat dissipation device is thermal contact with the conductive insert proximate an opposing surface of the microelectronic substrate.
    Type: Application
    Filed: November 14, 2014
    Publication date: May 19, 2016
    Applicant: INTEL CORPORATION
    Inventors: Zhihua LI, Qing TAN, Qinrong YU
  • Patent number: 8737778
    Abstract: The invention relates to an electro-static variable optical attenuator suitable for use in a small form factor pluggable module. A short cladding suppressing fiber, such as a double clad optical fiber, dissipates attenuated light coupled to the cladding to reduce modal interference in the output light, while also reducing PDL and WDL introduced by the off set attenuation mechanism.
    Type: Grant
    Filed: December 23, 2011
    Date of Patent: May 27, 2014
    Assignee: JDS Uniphase Corporation
    Inventors: Zhongjian Wang, Michael Ayliffe, Qinrong Yu, Niki Liu, Rongtang Fan
  • Publication number: 20130163923
    Abstract: The invention relates to an electro-static variable optical attenuator suitable for use in a small form factor pluggable module. A short cladding suppressing fiber, such as a double clad optical fiber, dissipates attenuated light coupled to the cladding to reduce modal interference in the output light, while also reducing PDL and WDL introduced by the off set attenuation mechanism.
    Type: Application
    Filed: December 23, 2011
    Publication date: June 27, 2013
    Inventors: Zhongjian Wang, Michael Ayliffe, Qinrong Yu, Niki Liu, Rongtang Fan
  • Patent number: 6763173
    Abstract: A technique for hermetically sealing an optical component in a metal package is described. Variations of the technique are described in which optical communication between the optical component and the outside environment is achieved with a ribbon fibre.
    Type: Grant
    Filed: August 21, 2002
    Date of Patent: July 13, 2004
    Assignee: MetroPhotonics Inc.
    Inventors: Qinrong Yu, Jean-Paul Noël
  • Publication number: 20040037535
    Abstract: A technique for hermetically sealing an optical component in a metal package is described. Variations of the technique are described in which optical communication between the optical component and the outside environment is achieved with a ribbon fibre.
    Type: Application
    Filed: August 21, 2002
    Publication date: February 26, 2004
    Inventors: Qinrong Yu, Jean-Paul Noel