Abstract: An optical cable handling device includes an opto-electronic module with an optical fiber, an optical fiber winding tray to receive the optical fiber, and a guide coupling the module and tray. The guide contains a track to thread the fiber from the module to the tray, wherein the guide comprises a guide bottom surface tangent to the module bottom surface and a guide top surface tangent to the tray bottom surface. This configuration aids in efficiently threading and winding the optical fiber, providing a predetermined bend radius for the fiber during the process. The device also includes a heat sink for heat management. The disclosed method involves securing an optical fiber by providing a winding tray, coupling a guide, and rotating the tray to spool the fiber onto the tray.

Abstract: A system for sealing EMI leakage from an optical fiber array belt includes a clamp made of a first conductive material, the clamp having a substantially U-shaped chamber; and a sealant having first and second ends to receive the optical fiber array belt in between. The clamp is movable from an upper portion of the sealant to a predetermined position on the sealant, thereby closing the first and second ends of the sealant to establish an electrical connection; and wherein the sealant prevents EMI leakage from the optical fiber array belt.

Abstract: The present application is directed a short distance free space optical communication link system. The system includes optical transmitter, receiver, beam expander, Rx lens and auxiliary alignment system.

Abstract: Optical transceivers with optical packaging designs to reduce inside transceiver components, simplify the fabrication, and improve the optical alignment and other optical transceiver characteristics.

Abstract: Embodiments of the present description relate to mechanisms for transferring heat through a microelectronic substrate from a photonic device to a heat dissipation device. In one embodiment, the microelectronic substrate may comprise a highly thermally conductive dielectric material. In another embodiment, the microelectronic substrate may comprise a conductive insert within the microelectronic substrate wherein the photonic device is in thermal contact with the conductive insert proximate one surface of the microelectronic substrate and the heat dissipation device is thermal contact with the conductive insert proximate an opposing surface of the microelectronic substrate.

Abstract: Embodiments of the present description relate to mechanisms for transferring heat through a microelectronic substrate from a photonic device to a heat dissipation device. In one embodiment, the microelectronic substrate may comprise a highly thermally conductive dielectric material. In another embodiment, the microelectronic substrate may comprise a conductive insert within the microelectronic substrate wherein the photonic device is in thermal contact with the conductive insert proximate one surface of the microelectronic substrate and the heat dissipation device is thermal contact with the conductive insert proximate an opposing surface of the microelectronic substrate.

Abstract: The invention relates to an electro-static variable optical attenuator suitable for use in a small form factor pluggable module. A short cladding suppressing fiber, such as a double clad optical fiber, dissipates attenuated light coupled to the cladding to reduce modal interference in the output light, while also reducing PDL and WDL introduced by the off set attenuation mechanism.

Abstract: The invention relates to an electro-static variable optical attenuator suitable for use in a small form factor pluggable module. A short cladding suppressing fiber, such as a double clad optical fiber, dissipates attenuated light coupled to the cladding to reduce modal interference in the output light, while also reducing PDL and WDL introduced by the off set attenuation mechanism.

Abstract: A technique for hermetically sealing an optical component in a metal package is described. Variations of the technique are described in which optical communication between the optical component and the outside environment is achieved with a ribbon fibre.

Abstract: A technique for hermetically sealing an optical component in a metal package is described. Variations of the technique are described in which optical communication between the optical component and the outside environment is achieved with a ribbon fibre.