Patents by Inventor Qiong Liao

Qiong Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240159748
    Abstract: A molecular marker for diagnosing primary biliary cholangitis and a method for detecting same are provided. The anti-human multimer immunoglobulin receptor antibody is adopted as the primary biliary cholangitis diagnosis molecular marker so as to prepare the diagnosis reagent; the human multimer immunoglobulin receptor antibody is remarkably increased in serum of PBC AMA-M2 subtype positive and negative patients, which indicates that in the attack of PBC, the serum anti-human multimer immunoglobulin receptor antibody specifically targets human multimer immunoglobulin receptors on small and medium bile ducts in the liver, thereby causing damage to the small and medium bile ducts.
    Type: Application
    Filed: April 20, 2022
    Publication date: May 16, 2024
    Applicants: THE FIRST HOSPITAL AFFILIATED TO PLA ARMY MEDICAL UNIVERSITY, XIANGYA HOSPITAL CENTRAL SOUTH UNIVERSITY
    Inventors: Jin CHAI, Huiwen WANG, Qian LI, Qiong PAN, Min LIAO, Jintao XIAO, Yan GUO, Xiuru MAO, Shifang PENG, Xiaowei LIU, Cane TANG
  • Patent number: 10249442
    Abstract: A method for manufacturing a solid electrolyte aluminum-electrolytic capacitor, includes: (1) welding a capacitor core of a capacitor onto an iron bar, applying a voltage for chemical treatment, and thereafter, washing and drying the capacitor core; (2) impregnating the dried capacitor core in a dispersion B for 1˜30 minutes; (3) removing the capacitor core, creating a vacuum and then impregnating the capacitor core in the dispersion B for 1˜10 minutes; (4) while in the dispersion B, breaking the vacuum and performing pressurization for 1˜10 minutes; (5) while in the dispersion B, performing depressurization to atmospheric pressure, for 1˜10 minutes; (6) placing the capacitor core in a temperature of 50˜100° C. and drying for 20˜60 minutes, and then in a temperature of 110˜200° C. and drying for 20˜60 minutes; (7) impregnating the dried capacitor core in a dispersion C for 1˜30 minutes; (8) placing the capacitor core in a temperature of 65˜100° C.
    Type: Grant
    Filed: August 20, 2018
    Date of Patent: April 2, 2019
    Assignee: Zhaoqing Beryl Electronic Technology Co., Ltd.
    Inventors: Yongpeng Liu, Yanbin Ma, Ping Zheng, Wei Luo, Dirong Wu, Qiong Liao, Yong Yuan, Huifeng Li, Weiqiao Wu
  • Publication number: 20180366274
    Abstract: The present invention discloses a method for manufacturing a high-voltage solid electrolyte aluminum-electrolytic capacitor, including: (1) Welding a capacitor core onto an iron bar, applying a voltage for chemical treatment, and after the chemical treatment, washing and drying the capacitor core; (2) impregnating the dried capacitor core in a dispersion A for 1˜30 minutes; (3) removing the capacitor core out of the dispersion A, creating a vacuum and then impregnating the capacitor core in the dispersion A for 1˜10 minutes; (4) keeping the capacitor core in the dispersion A, breaking the vacuum and then performing pressurization, and keeping the pressurized state for 1˜10 minutes; (5) keeping the capacitor core in the dispersion A, performing depressurization to an atmospheric pressure, and keeping the atmospheric pressure for 1˜10 minutes; (6) taking the capacitor core out, placing the capacitor core in a temperature of 65˜100° C.
    Type: Application
    Filed: August 20, 2018
    Publication date: December 20, 2018
    Applicant: Zhaoqing Beryl Electronic Technology Co., Ltd.
    Inventors: Yongpeng Liu, Yanbin Ma, Ping Zheng, Wei Luo, Dirong Wu, Qiong Liao, Yong Yuan, Huifeng Li, Weiqiao Wu
  • Patent number: 10090111
    Abstract: The present invention discloses a method for manufacturing a high-voltage solid electrolyte aluminum-electrolytic capacitor, including: (1) Welding a capacitor core onto an iron bar, applying a voltage for chemical treatment, and after the chemical treatment, washing and drying the capacitor core; (2) impregnating the dried capacitor core in a dispersion A for 1˜30 minutes; (3) removing the capacitor core out of the dispersion A, creating a vacuum and then impregnating the capacitor core in the dispersion A for 1˜10 minutes; (4) keeping the capacitor core in the dispersion A, breaking the vacuum and then performing pressurization, and keeping the pressurized state for 1˜10 minutes; (5) keeping the capacitor core in the dispersion A, performing depressurization to an atmospheric pressure, and keeping the atmospheric pressure for 1˜10 minutes; (6) taking the capacitor core out, placing the capacitor core in a temperature of 65˜100° C.
    Type: Grant
    Filed: March 3, 2015
    Date of Patent: October 2, 2018
    Assignee: Zhaoqing Beryl Electronic Technology Co., Ltd.
    Inventors: Yongpeng Liu, Yanbin Ma, Yong Yuan, Wei Luo, Ping Zheng, Qiong Liao, Huifeng Li, Dirong Wu, Weiqiao Wu
  • Patent number: 10074941
    Abstract: A high-speed connector includes an insulating body, an insulating cap, two terminal sets and two shielding sheets. The insulating body includes a body portion and a tongue plate. The tongue plate divides the interior of the body portion into two accommodating spaces. The insulating cap is fitted around the front end of the tongue plate of the insulating body. Each of the two terminal sets includes a terminal base and a plurality of terminals. The two shielding sheets are disposed on one side of each of the two terminal sets respectively. A plurality of ground ports is disposed on one side of each shielding sheet respectively, in which the plurality of ground ports contacts the plurality of ground terminals of the plurality of terminals of each terminal set so that the two shielding sheets form ground shielding with the ground terminals of each terminal set respectively.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: September 11, 2018
    Assignee: NEXTRONICS ENGINEERING CORP.
    Inventors: Hou-An Su, Hung-Wei Hsu, Chang-Fa Yang, Xiao-Qiong Liao, Mei-Jie Zhou
  • Publication number: 20180025846
    Abstract: A method for manufacturing high-voltage solid electrolyte aluminum-electrolytic capacitor: (1) welding a capacitor core onto an iron bar, applying a voltage for chemical treatment, and then, washing and drying; (2) impregnating the core in dispersion A for 1˜30 minutes; (3) removing the core from dispersion A, creating vacuum and impregnating the core in dispersion A for 1˜10 minutes; (4) keeping the core in dispersion A, breaking the vacuum and performing pressurization, and keeping pressurized state for 1˜10 minutes; (5) keeping the core in the dispersion A, performing depressurization to atmospheric pressure, and keeping atmospheric pressure for 1˜10 minutes; (6) taking the core out, placing in a 65˜100° C. temperature of and drying it for 20˜60 minutes, and then placing in a 135˜165° C. temperature of and drying for 20˜60 minutes; (7) repeating (3) to (6) at least once; and (8) putting the core in an aluminum cover and sealing it, and performing aging treatment.
    Type: Application
    Filed: March 3, 2015
    Publication date: January 25, 2018
    Applicant: Zhaoqing Beryl Electronic Technology Co., Ltd.
    Inventors: Yongpeng Liu, Yanbin Ma, Yong Yuan, Wei Luo, Ping Zheng, Qiong Liao, Huifeng Li, Dirong Wu, Weiqiao Wu
  • Patent number: 8197282
    Abstract: A small form-factor pluggable (SFP) connector structure is disclosed. The SFP connector structure comprises an insulating body, a plurality of first terminals, a plurality of second terminals, and a metal cover. Two card entry slots are formed vertically on the insulating body. Dovetail structures are formed on the sides of the insulating body. The first and second terminals are disposed on the insulating body and extend into the card entry slots. The metal cover is over the insulating body. Thus, the SFP connectors can be connected in parallel without tolerance variation, hence achieving better alignment. A SFP connector assembly is also disclosed.
    Type: Grant
    Filed: April 12, 2011
    Date of Patent: June 12, 2012
    Assignee: Nextronics Engineering Corp.
    Inventors: Hou-An Su, Hai-Wen Yang, Xiao-Qiong Liao
  • Publication number: 20120027363
    Abstract: An optical electronic connecting device with dual modules includes a first module and a second module. The first module meets the specification of a Small Form-Factor Pluggable connector. The first module includes a first main body, a plurality of first terminals, and a first metallic casing. The second module meets the specification of a RJ connector. The second module includes a second main body, a plurality of second terminals, and a second metallic casing. The first module and the second module are stacked together and respectively have a metallic casing. The optical electronic connecting device with dual modules has a simplified configuration, can be produced easily with lower cost, and therefore can be sold at lower price.
    Type: Application
    Filed: July 28, 2010
    Publication date: February 2, 2012
    Applicant: NEXTRONICS ENGINEERING CORP.
    Inventors: HOU-AN SU, HAI-WEN YANG, XUAN LUO, XIAO-QIONG LIAO, HAI-YANG XIAO