Patents by Inventor Qirui CHEN

Qirui CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12334275
    Abstract: A negative-pressure packaging method for aluminum electrolytic capacitors including: penetratedly arranging a capacitor element in a seal; placing the capacitor element, the seal and a case at an inner chamber of an accommodating mechanism; sealing the accommodating mechanism; vacuumizing the accommodating mechanism to allow the inner chamber to be in a negative pressure state; subjecting the seal and the case to packaging, such that the seal is located at a first depth of the case; and subjecting the seal and the case to pressing, such that the seal is located at a second depth of the case, where the second depth is closer to a bottom of the case with respect to the first depth.
    Type: Grant
    Filed: October 19, 2022
    Date of Patent: June 17, 2025
    Assignee: CAPXON ELECTRONIC TECHNOLOGY CO., LTD
    Inventors: Qirui Chen, I-Chu Lin, Jiaxian Luo
  • Publication number: 20250022668
    Abstract: A multilayer polymer capacitor (MLPC), including a casing, a multilayer core, an electroplated positive terminal, a first electroplated negative terminal, and a second electroplated negative terminal. The casing includes a casing body and a cover plate. The casing body is provided with an accommodating cavity, whose bottom is provided with a through hole. The multilayer core is provided in the accommodating cavity. An anode lead-out part and a cathode lead-out part are provided at two ends of the accommodating cavity, respectively. The electroplated positive terminal and the first electroplated negative terminal are provided on outer side surfaces of two ends of the casing, respectively. The second electroplated negative terminal is provided on an outer bottom surface of the casing, and is electrically connected to the multilayer core.
    Type: Application
    Filed: September 29, 2024
    Publication date: January 16, 2025
    Inventors: CHENG-YI YANG, I-CHU LIN, YUAN-YU LIN, CHIN-TSUN LIN, Qirui CHEN, HSIU-WEN WU
  • Patent number: 11923148
    Abstract: A substrate-type multi-layer polymer capacitor (MLPC), including a casing, a core, a first electroplated terminal and a second electroplated terminal. The core is arranged in an inner cavity of the casing. The casing is formed by joining two first packaging plates with two second packaging plates. The first and second electroplated terminals are formed by electroplating. The first electroplated terminal is configured to cover one end of the casing to form an anode electrically led out from the core, and the second electroplated terminal is configured to the other end of the casing to form a cathode electrically led out from the core. The first packaging plate includes a substrate, an electrode plate and two metal plates. The first and second electroplated terminals are integrally sealed with the casing.
    Type: Grant
    Filed: July 7, 2022
    Date of Patent: March 5, 2024
    Assignee: CAPXON ELECTRONIC TECHNOLOGY CO., LTD.
    Inventors: Qirui Chen, I-Chu Lin, Qiwei Chen
  • Publication number: 20230038905
    Abstract: A negative-pressure packaging method for aluminum electrolytic capacitors including: penetratedly arranging a capacitor element in a seal; placing the capacitor element, the seal and a case at an inner chamber of an accommodating mechanism; sealing the accommodating mechanism; vacuumizing the accommodating mechanism to allow the inner chamber to be in a negative pressure state; subjecting the seal and the case to packaging, such that the seal is located at a first depth of the case; and subjecting the seal and the case to pressing, such that the seal is located at a second depth of the case, where the second depth is closer to a bottom of the case with respect to the first depth.
    Type: Application
    Filed: October 19, 2022
    Publication date: February 9, 2023
    Inventors: Qirui CHEN, Yizhu LIN, Jiaxian LUO
  • Publication number: 20220336152
    Abstract: A substrate-type multi-layer polymer capacitor (MLPC), including a casing, a core, a first electroplated terminal and a second electroplated terminal. The core is arranged in an inner cavity of the casing. The casing is formed by joining two first packaging plates with two second packaging plates. The first and second electroplated terminals are formed by electroplating. The first electroplated terminal is configured to cover one end of the casing to form an anode electrically led out from the core, and the second electroplated terminal is configured to the other end of the casing to form a cathode electrically led out from the core. The first packaging plate includes a substrate, an electrode plate and two metal plates. The first and second electroplated terminals are integrally sealed with the casing.
    Type: Application
    Filed: July 7, 2022
    Publication date: October 20, 2022
    Inventors: Qirui CHEN, Yizhu LIN, Qiwei CHEN