Patents by Inventor Qiufa LUO

Qiufa LUO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11982650
    Abstract: A method for testing an interfacial tribochemical reaction between a diamond wafer and active metal abrasive or metal oxide abrasive is provided. A surface of a diamond indenter used in a nano scratch tester is coated with a layer of the active metal abrasive or the metal oxide abrasive with uniform and controllable thickness by magnetron sputtering, and an interface interaction between the layer of the active metal abrasive or the metal oxide abrasive and the diamond wafer is controlled by a scratch test of the diamond wafer. Chemical components of an interaction section on a surface of the diamond wafer are analyzed by the scanning probe micro Raman spectrometer.
    Type: Grant
    Filed: August 7, 2023
    Date of Patent: May 14, 2024
    Assignee: HUAQIAO UNIVERSITY
    Inventors: Xipeng Xu, Jing Lu, Qiufa Luo, Yueqin Wu, Dekui Mu, Zhiping Xue
  • Publication number: 20230384194
    Abstract: A method for testing an interfacial tribochemical reaction between a diamond wafer and active metal abrasive or metal oxide abrasive is provided. A surface of a diamond indenter used in a nano scratch tester is coated with a layer of the active metal abrasive or the metal oxide abrasive with uniform and controllable thickness by magnetron sputtering, and an interface interaction between the layer of the active metal abrasive or the metal oxide abrasive and the diamond wafer is controlled by a scratch test of the diamond wafer. Chemical components of an interaction section on a surface of the diamond wafer are analyzed by the scanning probe micro Raman spectrometer.
    Type: Application
    Filed: August 7, 2023
    Publication date: November 30, 2023
    Inventors: Xipeng XU, Jing LU, Qiufa LUO, Yueqin WU, Dekui MU, Zhiping XUE
  • Publication number: 20230339064
    Abstract: An integrated device for grinding and polishing a diamond and a method thereof are provided. The integrated device for grinding and polishing the diamond comprises a base device and a grinding and polishing device, the base device comprises a base configured rotate around a Z-axis, the base comprises a fixture configured to clamp the diamond, the grinding and polishing device comprises a shaft disposed along the Z-axis, the outer polishing wheel surrounds the inner grinding wheel, the shaft drives the inner grinding wheel and the outer polishing wheel to rotate together, an upper and lower position relationship between the inner grinding wheel and the outer polishing wheel along the Z-axis is configured to be adjusted, and the diamond on the fixture is ground and polished by rotations of the inner grinding wheel and the outer polishing wheel, feeding, and a rotation of the base.
    Type: Application
    Filed: June 30, 2023
    Publication date: October 26, 2023
    Inventors: Jing LU, Hailang Wen, Qiufa Luo, Chen Li, Tengfeng AI
  • Publication number: 20220288741
    Abstract: Carbon atoms of a single-crystal diamond and active abrasives are used to produce a chemical reaction to form carbides under a specific grinding condition of no higher than a graphitization temperature, and a hard abrasive is used to remove the carbides.
    Type: Application
    Filed: April 25, 2022
    Publication date: September 15, 2022
    Inventors: Jing LU, Xipeng XU, Yanhui WANG, Qiufa LUO, Zhongqiang MA
  • Publication number: 20220241927
    Abstract: Forming an amorphous carbon layer due to lattice distortion of carbon atoms on a surface layer of a single-crystal diamond under a mechanical shear function of a hard abrasive, and generating a chemical reaction between the amorphous carbon layer on the surface layer and the reactive abrasive to achieve quickly removing carbon atoms on the surface layer of the single-crystal diamond due to a local high temperature between abrasive grains and the single-crystal diamond caused by friction at a high speed.
    Type: Application
    Filed: April 25, 2022
    Publication date: August 4, 2022
    Inventors: Jing LU, Xipeng XU, Yanhui WANG, Qiufa LUO, Ping XIAO
  • Patent number: 10577525
    Abstract: Disclosed is a composite abrasive with hard core and soft shell, comprising hard abrasive core with grain diameter in a range of 0.1˜1 ?m and a soft oxide shell with thickness in a range of 5˜100 nm, the grain size of the oxide of the soft oxide shell is in a range of 5˜20 nm, the composite abrasive is obtained from aqueous solution of oxide inorganic salt precursor and the hard abrasive by dispersing, constant temperature reflux hydrolyzing, solid-liquid separating, washing and drying. The component abrasive with hard core and soft shell of the present invention can improve the manufacturing efficiency and the surface quality during the ultraprecise manufacturing of the sapphire substrate.
    Type: Grant
    Filed: November 3, 2016
    Date of Patent: March 3, 2020
    Assignee: HUAQIAO UNIVERSITY
    Inventors: Jing Lu, Xipeng Xu, Dayu Zhang, Yongchao Xu, Qiufa Luo
  • Publication number: 20170121580
    Abstract: Disclosed is a composite abrasive with hard core and soft shell, comprising hard abrasive core with grain diameter in a range of 0.1˜1 ?m and a soft oxide shell with thickness in a range of 5˜100 nm, the grain size of the oxide of the soft oxide shell is in a range of 5˜20 nm, the composite abrasive is obtained from aqueous solution of oxide inorganic salt precursor and the hard abrasive by dispersing, constant temperature reflux hydrolyzing, solid-liquid separating, washing and drying. The component abrasive with hard core and soft shell of the present invention can improve the manufacturing efficiency and the surface quality during the ultraprecise manufacturing of the sapphire substrate.
    Type: Application
    Filed: November 3, 2016
    Publication date: May 4, 2017
    Applicant: HUAQIAO UNIVERSITY
    Inventors: Jing LU, Xipeng XU, Dayu ZHANG, Yongchao XU, Qiufa LUO