Patents by Inventor Qiuquan Guo

Qiuquan Guo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200331050
    Abstract: The present disclosure provides a one pot process for co-electrodeposition of Zn—Ni layers on steel substrates involving pretreating a steel substrate and then immersing the steel substrate into an aqueous electrolyte containing at least salts of Ni and Zn with the salts of Ni and Zn being present in concentrations to give a ratio of Ni to Zn in a range from about 1:1 to about 1000:1, the aqueous electrolyte including a buffer to give the aqueous electrolyte a pH in a range from about 3 to about 6. This is followed by electroplating a Zn—Ni layer onto the steel substrate by applying a voltage between the steel substrate as cathode and an anode electrode also immersed in the aqueous electrolyte, the applied voltage being selected to give a current density in a range from about 8 mA/mm2 to about 50 mA/mm2. The electroplating is performed with the aqueous electrolyte heated to a temperature in a range from about 20° C. to about 50° C.
    Type: Application
    Filed: October 10, 2018
    Publication date: October 22, 2020
    Inventors: JUN YANG, ZHIFENG DING, MAHDI HESARI, PATRICK THERRIEN, QIUQUAN GUO, DARRIN OGLAN
  • Patent number: 10660217
    Abstract: Provided herein is a method to printed electronics, and more particularly related to printed electronics on flexible, porous substrates. The method includes applying a coating compound comprising poly (4-vinylpyridine) (P4VP) and SU-8 dissolved in an organic alcohol solution to one or more surface of a flexible, porous substrate, curing the porous substrate at a temperature of at least 130° C. such that the porous substrate is coated with a layer of said coating compound, printing a jet of a transition metal salt catalyst solution onto one or more printing sides of the flexible, porous substrate to deposit a transition metal salt catalyst onto the one or more printing sides, and submerging the substrate in an electroless metal deposition solution to deposit the metal on the flexible, porous substrate, wherein the deposited metal induces the formation of one or more three-dimensional metal-fiber conductive structures within the flexible, porous substrate.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: May 19, 2020
    Inventors: Jun Yang, Tengyuan Zhang, Qiuquan Guo
  • Patent number: 10472448
    Abstract: Three dimensional printed objects having surface coatings, such as a hydrophobic coating or metalized surface, 3D printed substrates having an outer surface that can be tuned by application of such a coating, and methods for the fabrication of such objects and substrates are described. A surface initiator is incorporated into the 3D substrate during layer-by-layer printing, and the surface coated by surface-initiated atom transfer radical polymerization (SI-ATRP).
    Type: Grant
    Filed: August 8, 2014
    Date of Patent: November 12, 2019
    Assignee: The University of Western Ontario
    Inventors: Jun Yang, Xiaolong Wang, Xiaobing Cai, Qiuquan Guo
  • Publication number: 20190104618
    Abstract: A solvent-free method for fabricating conductors is disclosed. A thick patterned layer up to 13 microns containing metal precursor and reducing agent precursor are initially deposited onto a substrate using laser printing technology. The deposited patterned precursor materials are then irradiated with a newly developed high energy intense pulsed light (IPL) system in order to transform the deposited materials to thick conductive metal patterns. The easy metallization of printed patterns makes this invention an especially effective method for massive production of flexible printed circuits.
    Type: Application
    Filed: March 7, 2017
    Publication date: April 4, 2019
    Inventors: Jun YANG, Tengyuan ZHANG, Qiuquan GUO
  • Publication number: 20180352661
    Abstract: Provided herein is a method to printed electronics, and more particularly related to printed electronics on flexible, porous substrates. The method includes applying a coating compound comprising poly (4-vinylpyridine) (P4VP) and SU-8 dissolved in an organic alcohol solution to one or more surface of a flexible, porous substrate, curing the porous substrate at a temperature of at least 130° C. such that the porous substrate is coated with a layer of said coating compound, printing a jet of a transition metal salt catalyst solution onto one or more printing sides of the flexible, porous substrate to deposit a transition metal salt catalyst onto the one or more printing sides, and submerging the substrate in an electroless metal deposition solution to deposit the metal on the flexible, porous substrate, wherein the deposited metal induces the formation of one or more three-dimensional metal-fiber conductive structures within the flexible, porous substrate.
    Type: Application
    Filed: May 30, 2018
    Publication date: December 6, 2018
    Inventors: Jun YANG, Tengyuan ZHANG, Qiuquan GUO
  • Publication number: 20150079362
    Abstract: Three dimensional printed objects having surface coatings, such as a hydrophobic coating or metalized surface, 3D printed substrates having an outer surface that can be tuned by application of such a coating, and methods for the fabrication of such objects and substrates are described. A surface initiator is incorporated into the 3D substrate during layer-by-layer printing, and the surface coated by surface-initiated atom transfer radical polymerization (SI-ATRP).
    Type: Application
    Filed: August 8, 2014
    Publication date: March 19, 2015
    Inventors: Jun Yang, Xiaolong Wang, Xiaobin Cai, Qiuquan Guo