Patents by Inventor Qiutao Wang

Qiutao Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ultrasonic detection and tensile calibration test method for bonding strength grade
    Patent number: 11733210
    Abstract: An ultrasonic detection and tensile calibration test method for bonding strength grade comprising bonding an upper substrate block to bonding groove(s) to form a theoretical bonding area, and applying a downward actual tensile force to a lower substrate block; obtaining an actual bonding area of the theoretical bonding area; calculating a first actual bonding strength by using the actual tensile force and the actual bonding area, and comparing the first actual bonding strength with a second actual bonding strength calculated to verify the correctness of the theoretical bonding area as a calibrated bonding strength; forming a bond strength table in which the theoretical bonding areas, the actual bonding areas and the first actual bonding strengths are in one-to-one correspondence; and using the actual bonding area to find the actual bonding strength corresponding to the actual bonding area from the bonding area bonding strength table.
    Type: Grant
    Filed: July 1, 2021
    Date of Patent: August 22, 2023
    Assignee: BEIJING INSTITUTE OF TECHNOLOGY
    Inventors: Chunguang Xu, Lei He, Dingguo Xiao, Qiutao Wang
  • ULTRASONIC DETECTION AND TENSILE CALIBRATION TEST METHOD FOR BONDING STRENGTH GRADE
    Publication number: 20220003719
    Abstract: An ultrasonic detection and tensile calibration test method for bonding strength grade comprising bonding an upper substrate block to bonding groove(s) to form a theoretical bonding area, and applying a downward actual tensile force to a lower substrate block; obtaining an actual bonding area of the theoretical bonding area; calculating a first actual bonding strength by using the actual tensile force and the actual bonding area, and comparing the first actual bonding strength with a second actual bonding strength calculated to verify the correctness of the theoretical bonding area as a calibrated bonding strength; forming a bond strength table in which the theoretical bonding areas, the actual bonding areas and the first actual bonding strengths are in one-to-one correspondence; and using the actual bonding area to find the actual bonding strength corresponding to the actual bonding area from the bonding area bonding strength table.
    Type: Application
    Filed: July 1, 2021
    Publication date: January 6, 2022
    Inventors: Chunguang Xu, Lei He, Dingguo Xiao, Qiutao Wang