Patents by Inventor Qiwei Shi

Qiwei Shi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11526980
    Abstract: The invention relates to a method for processing images obtained by a diffraction detector, of a crystalline or polycrystalline material, in which a first image of the material is acquired in a state of reference as well as a second image of the material in a deformed state. The invention is characterised in that, in a calculator, during a first step (E6, E12), a current elastic deformation gradient tensor Fe is given a value determined by calculation, during a second step (E7), the current displacement field induced by the tensor Fe is calculated, during a third step (E8), third digital values of a deformed image {hacek over (g)}(x)=g(x+u(x)) corrected by the current displacement field are calculated, and during an iterative algorithm, iterations of the second and third steps (E12, E7, E8) are carried out on modified values of the tensor r Fe until a convergence criterion is met in relation to the correction to the current value of Fe.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: December 13, 2022
    Inventors: Félix Latourte, Qiwei Shi, François Hild, Stéphane Roux
  • Patent number: 11083093
    Abstract: A modular electronics enclosure includes a rear frame, a first L-shaped piece and a second L-shaped piece joined to form a box-shaped shell having a floor, a ceiling, a rear wall and first and second opposed side walls that define an internal cavity. The first L-shaped piece includes a wall panel and a top panel that form the ceiling and the first side wall of the shell. The second L-shaped piece includes a wall panel and a bottom panel that form the floor and the second side wall of the shell. The rear frame forms the rear wall of the shell.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: August 3, 2021
    Assignee: CommScope Technologies LLC
    Inventors: Charles John Mann, Jiayong Wang, Qiwei Shi, Walter Mark Hendrix, Tri H. Nguyen
  • Publication number: 20200349690
    Abstract: The invention relates to a method for processing images obtained by a diffraction detector, of a crystalline or polycrystalline material, in which a first image of the material is acquired in a state of reference as well as a second image of the material in a deformed state. The invention is characterised in that, in a calculator, during a first step (E6, E12), a current elastic deformation gradient tensor Fe is given a value determined by calculation, during a second step (E7), the current displacement field induced by the tensor Fe is calculated, during a third step (E8), third digital values of a deformed image {hacek over (g)}(x)=g(x+u(x)) corrected by the current displacement field are calculated, and during an iterative algorithm, iterations of the second and third steps (E12, E7, E8) are carried out on modified values of the tensor r Fe until a convergence criterion is met in relation to the correction to the current value of Fe.
    Type: Application
    Filed: December 7, 2018
    Publication date: November 5, 2020
    Applicants: Electricite de France, Centre National de la Recherche Scientifique (CNRS), Ecole Normale Superieure De Cachan
    Inventors: Félix Latourte, Qiwei Shi, François Hild, Stéphane Roux
  • Publication number: 20200060027
    Abstract: A modular electronics enclosure includes a rear frame, a first L-shaped piece and a second L-shaped piece joined to form a box-shaped shell having a floor, a ceiling, a rear wall and first and second opposed side walls that define an internal cavity. The first L-shaped piece includes a wall panel and a top panel that form the ceiling and the first side wall of the shell. The second L-shaped piece includes a wall panel and a bottom panel that form the floor and the second side wall of the shell. The rear frame forms the rear wall of the shell.
    Type: Application
    Filed: June 3, 2019
    Publication date: February 20, 2020
    Inventors: Charles John Mann, Jiayong Wang, Qiwei Shi, Walter Mark Hendrix, Tri H. Nguyen