Abstract: The present disclosure provides a strengthened glass and a glass strengthening method, and an electronic device housing. Two opposing sides of the strengthened glass have surface compressive stress layers, and a third stress layer is sandwiched between the two surface compressive stress layers. The third stress layer includes a compressive stress region and multiple tensile stress regions spaced apart within the compressive stress region, the multiple tensile stress regions are extended in a thickness direction of the strengthened glass, and each of the tensile stress regions is surrounded by the compressive stress region. A sum of thicknesses of the surface compressive stress layers and a thickness of the compressive stress region located between two adjacent tensile stress regions is equal to a thickness of the strengthened glass.