Patents by Inventor Qizhuo Zhuo

Qizhuo Zhuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11304346
    Abstract: A method for shielding a system-in-package (SIP) assembly from electromagnetic interference (EMI) includes laminating a pre-form EMI shielding film onto the assembly in a single lamination process. The EMI shielding film may be moldable in a vacuum lamination process to cover the SIP assembly and to substantially fill trenches formed in the assembly between adjacent component modules. The SIP assembly is accordingly shielded from EMI through the application of a single EMI shielding film.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: April 12, 2022
    Assignee: Henkel AG & Co. KGaA
    Inventors: Xuan Hong, Daniel Maslyk, Qizhuo Zhuo, Juliet Grace Sanchez
  • Patent number: 10985108
    Abstract: Provided herein are conductive formulations which are useful for applying conductive material to a suitable substrate; the resulting coated articles have improved EMI shielding performance relative to articles coated with prior art formulations employing prior art methods. In accordance with certain aspects of the present invention, there are also provided methods for filling a gap in an electronic package to achieve electromagnetic interference (EMI) shielding thereof, as well as the resulting articles shielded thereby. Specifically, invention methods utilize capillary flow to substantially fill any gaps in the coating on the surface of an electronic package. Effective EMI shielding has been demonstrated with very thin coating thickness.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: April 20, 2021
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: Xuan Hong, Xinpei Cao, Derek Wyatt, Qizhuo Zhuo, Elizabeth Hoang
  • Publication number: 20210092884
    Abstract: A method for shielding a system-in-package (SIP) assembly from electromagnetic interference (EMI) includes laminating a pre-form EMI shielding film onto the assembly in a single lamination process. The EMI shielding film may be moldable in a vacuum lamination process to cover the SIP assembly and to substantially fill trenches formed in the assembly between adjacent component modules. The SIP assembly is accordingly shielded from EMI through the application of a single EMI shielding film.
    Type: Application
    Filed: September 30, 2020
    Publication date: March 25, 2021
    Inventors: Xuan Hong, Daniel Maslyk, Qizhuo Zhuo, Juliet Grace Sanchez
  • Patent number: 10937740
    Abstract: Provided herein are conductive formulations which are useful for applying conductive material to a suitable substrate; the resulting coated articles have improved EMI shielding performance relative to articles coated with prior art formulations employing prior art methods. In accordance with certain aspects of the present invention, there are also provided methods for filling a gap in an electronic package to achieve electromagnetic interference (EMI) shielding thereof, as well as the resulting articles shielded thereby. Specifically, invention methods utilize capillary flow to substantially fill any gaps in the coating on the surface of an electronic package. Effective EMI shielding has been demonstrated with very thin coating thickness.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: March 2, 2021
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: Xuan Hong, Xinpei Cao, Derek Wyatt, Qizhuo Zhuo, Elizabeth Hoang
  • Patent number: 10858523
    Abstract: Provided herein are highly conductive compositions (having a volume resistivity no greater than 1×10?3 Ohms·cm) using silver flake, powder or suspension in solvent for electromagnetic interference (EMI) applications. This high conductivity will allow the use of very thin films for EMI shielding protection, which in turn will be helpful to reduce package sizes. In some embodiments, the coating composition is applied on the device surface by suitable means, e.g., by an electrostatic spray process, air spray process, ultrasonic spray process, spin coating process, or the like.
    Type: Grant
    Filed: January 24, 2018
    Date of Patent: December 8, 2020
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: Junbo Gao, Qizhuo Zhuo, Xinpei Cao, Glenda Castaneda
  • Patent number: 10834858
    Abstract: A method for shielding a system-in-package (SIP) assembly from electromagnetic interference (EMI) includes laminating a pre-form EMI shielding film onto the assembly in a single lamination process. The EMI shielding film may be moldable in a vacuum lamination process to cover the SIP assembly and to substantially fill trenches formed in the assembly between adjacent component modules. The SIP assembly is accordingly shielded from EMI through the application of a single EMI shielding film.
    Type: Grant
    Filed: November 12, 2019
    Date of Patent: November 10, 2020
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: Xuan Hong, Daniel Maslyk, Qizhuo Zhuo, Juliet Grace Sanchez
  • Patent number: 10741503
    Abstract: Provided herein are conductive formulations wherein graphene has been added into the metal system, thereby reducing curing shrinkage and improving flexibility, without significantly affecting the EMI shielding performance thereof. In accordance with certain aspects of the present invention, there are also provided methods for filling a gap in an electronic package to achieve electromagnetic interference (EMI) shielding thereof, as well as the resulting articles shielded thereby. In certain aspects of the present invention, there are also provided articles prepared using invention formulations and methods.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: August 11, 2020
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: Xuan Hong, Juliet G. Sanchez, Xinpei Cao, Qizhuo Zhuo
  • Publication number: 20200084924
    Abstract: A method for shielding a system-in-package (SIP) assembly from electromagnetic interference (EMI) includes laminating a pre-form EMI shielding film onto the assembly in a single lamination process. The EMI shielding film may be moldable in a vacuum lamination process to cover the SIP assembly and to substantially fill trenches formed in the assembly between adjacent component modules. The SIP assembly is accordingly shielded from EMI through the application of a single EMI shielding film.
    Type: Application
    Filed: November 12, 2019
    Publication date: March 12, 2020
    Inventors: Xuan Hong, Daniel Maslyk, Qizhuo Zhuo, Juliet Grace Sanchez
  • Publication number: 20190206805
    Abstract: Provided herein are conductive formulations wherein graphene has been added into the metal system, thereby reducing curing shrinkage and improving flexibility, without significantly affecting the EMI shielding performance thereof. In accordance with certain aspects of the present invention, there are also provided methods for filling a gap in an electronic package to achieve electromagnetic interference (EMI) shielding thereof, as well as the resulting articles shielded thereby. In certain aspects of the present invention, there are also provided articles prepared using invention formulations and methods.
    Type: Application
    Filed: March 8, 2019
    Publication date: July 4, 2019
    Inventors: Xuan HONG, Juliet G. SANCHEZ, Xinpei CAO, Qizhuo ZHUO
  • Publication number: 20190096822
    Abstract: Provided herein are conductive formulations which are useful for applying conductive material to a suitable substrate; the resulting coated articles have improved EMI shielding performance relative to articles coated with prior art formulations employing prior art methods. In accordance with certain aspects of the present invention, there are also provided methods for filling a gap in an electronic package to achieve electromagnetic interference (EMI) shielding thereof, as well as the resulting articles shielded thereby. Specifically, invention methods utilize capillary flow to substantially fill any gaps in the coating on the surface of an electronic package. Effective EMI shielding has been demonstrated with very thin coating thickness.
    Type: Application
    Filed: November 13, 2018
    Publication date: March 28, 2019
    Inventors: Xuan Hong, Xinpei Cao, Derek Wyatt, Qizhuo Zhuo, Elizabeth Hoang
  • Publication number: 20180056449
    Abstract: Provided herein are sinterable films and pastes as conductive die attach materials having advantageous properties for use in die semiconductor packages. Also provided are formulations useful for the preparation of such films and pastes, as well as methods for making such formulations. In additional aspects of the present invention, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, the invention relates to articles comprising such sintering films and pastes adhered to a suitable substrate therefor.
    Type: Application
    Filed: November 3, 2017
    Publication date: March 1, 2018
    Inventors: Pukun ZHU, Shashi GUPTA, Louis RECTOR, Qizhuo ZHUO
  • Patent number: 9230888
    Abstract: A semiconductor assembly comprises a semiconductor wafer, an adhesive coating disposed on the back side of the wafer, and a bare dicing tape, preferably UV radiation transparent. The assembly is prepared by the method comprising (a) providing a semiconductor wafer, (b) disposing a wafer back side coating on the semiconductor wafer, (c) partially curing the wafer back side coating to the extent that it adheres to the back side of the wafer and remains tacky, and (d) contacting the bare dicing tape to the partially cured and tacky wafer back side coating, optionally with heat and pressure.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: January 5, 2016
    Assignee: Henkel IP & Holding GmbH
    Inventors: Gyanendra Dutt, Qizhuo Zhuo, Elizabeth Hoang, Stephen Ruatta
  • Publication number: 20140225283
    Abstract: A semiconductor assembly comprises a semiconductor wafer, an adhesive coating disposed on the back side of the wafer, and a bare dicing tape, preferably UV radiation transparent. The assembly is prepared by the method comprising (a) providing a semiconductor wafer, (b) disposing a wafer back side coating on the semiconductor wafer, (c) partially curing the wafer back side coating to the extent that it adheres to the back side of the wafer and remains tacky, and (d) contacting the bare dicing tape to the partially cured and tacky wafer back side coating, optionally with heat and pressure.
    Type: Application
    Filed: March 15, 2013
    Publication date: August 14, 2014
    Applicant: HENKEL CORPORATION
    Inventors: Gyanendra Dutt, Qizhuo Zhuo, Elizabeth Hoang, Stephen Ruatta
  • Patent number: 8759422
    Abstract: An adhesive composition comprising elastomeric polymer, epoxy resin, reactive diluent, and filler, is suitable for use within the electronics industry, and in particular for wafer back side coating adhesives. The elastomeric polymer is a mixture of a vinyl elastomer and an epoxy elastomer; the reactive diluent is a combination of two or more diluents, one of which must have carbon to carbon unsaturation, providing cross-linking within the composition after cure; and the filler is a non-conductive filler.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: June 24, 2014
    Assignee: Henkel IP & Holding GmbH
    Inventors: Eric C. Wang, Kevin Harris Becker, Qizhuo Zhuo
  • Patent number: 7422707
    Abstract: A conductive composition for coating a semiconductor wafer comprises conductive filler that has an average particle size of less than 2 microns and a maximum particle size of less than 10 microns, a first resin that has a softening point between 80-260° C., solvent, curing agent, and a second resin, wherein at room temperature the first resin is substantially soluble in the solvent.
    Type: Grant
    Filed: January 10, 2007
    Date of Patent: September 9, 2008
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventor: Qizhuo Zhuo
  • Publication number: 20080166543
    Abstract: A conductive composition for coating a semiconductor wafer comprises conductive filler that has an average particle size of less than 2 microns and a maximum particle size of less than 10 microns, a first resin that has a softening point between 80-260 ° C., solvent, curing agent, and a second resin, wherein at room temperature the first resin is substantially soluble in the solvent.
    Type: Application
    Filed: November 16, 2007
    Publication date: July 10, 2008
    Inventor: Qizhuo Zhuo
  • Publication number: 20080164612
    Abstract: A conductive composition for coating a semiconductor wafer comprises conductive filler that has an average particle size of less than 2 microns and a maximum particle size of less than 10 microns, a first resin that has a softening point between 80-260° C., solvent, curing agent, and a second resin, wherein at room temperature the first resin is substantially soluble in the solvent.
    Type: Application
    Filed: January 10, 2007
    Publication date: July 10, 2008
    Inventor: Qizhuo Zhuo
  • Patent number: 6162849
    Abstract: This invention relates to a thermally conductive moldable polymer blend comprising a thermoplastic polymer having a tensile at yield of at least 10,000 psi; at least 60% by weight of a mixture of boron nitride powders having an average particle size of at least 50 microns; and a coupling agent. The composition displays a thermal conductivity of at least about 15 W/m.degree. K and it is capable of being molded using high speed molding techniques such as injection molding.
    Type: Grant
    Filed: January 11, 1999
    Date of Patent: December 19, 2000
    Assignee: Ferro Corporation
    Inventors: Qizhuo Zhuo, Ronald M. Harris, Dennis C. Skovran, Leo F. Lightner, Michael S. Randall, Vernon E. Stygar