Patents by Inventor Quan Bai

Quan Bai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12115669
    Abstract: Disclosed is a variable-parameter stiffness identification and modeling method for an industrial robot. An effective working space of a robot is divided into a plurality of cubic regions. For an operating task in a certain machining region, different loads are applied to an end effector at multiple positions and multiple postures in the region, and robot joint stiffness in this section is identified and acquired according to the relationship between the loads and an end deformation, thereby realizing accurate stiffness control of the robot in different operating sections during a machining process.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: October 15, 2024
    Assignee: NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS
    Inventors: Wei Tian, Jiachen Jiao, Wenhe Liao, Bo Li, Lin Zhang, Guangyu Cui, Quan Bai
  • Publication number: 20240171291
    Abstract: A system, device and method for optimization of a radiated transmission matrix by the selecting probe antennae and applying a compensation network in the test system are described. Among other benefits, the anechoic chamber in which the DUT is disposed is comparatively small and inexpensive. The time-consuming process of inverse matrix tuning or isolation level checking that plagues known systems, device and methods of testing DUT is substantially avoided. Because of small size of shield box and probe antenna selection algorithm, low path loss and acceptable power in testing can be realized.
    Type: Application
    Filed: September 28, 2023
    Publication date: May 23, 2024
    Inventors: Huaizhi Yang, Ya Jing, Jin-Ming Zhao, Zi Quan Bai
  • Publication number: 20240159865
    Abstract: A system is provided for measuring a power radiated pattern of an incident radio frequency (RF) signal indicating spatial distribution characteristics of a device under test (DUT). The system includes multiple antenna elements arranged in an array, where the antenna elements include antennas and diodes coupled to the antennas, respectively. Each antenna has a radar cross-section (RCS) that is too small for the antenna elements to operate in a reflect mode. Each diode is zero biased, such that the diodes receive the incident RF signal through the antennas to which the diodes are respectively coupled, and rectify the incident RF signal to DC voltages that are proportional to power of the incident RF signal, enabling the antenna elements to operate in a detect mode.
    Type: Application
    Filed: September 8, 2023
    Publication date: May 16, 2024
    Inventors: Zhu Wen, Xiong Bin Liao, Li Cao, Zi Quan Bai, Sheng Qi Zhang
  • Patent number: 11846727
    Abstract: A system and method are provided for emulating echo signals in response to a LiDAR signal. The method includes updating a current position of a moving emulated target according to a 3D simulation scene at a current frame, the simulation scene including a dynamic model of the target; estimating a next position of the target at a next frame of the simulation scene by updating motion transforms for the dynamic model using motion keys; performing ray tracing by launching rays in parallel, assigning different pulse times to the rays to simulate timing of corresponding light pulses of the LiDAR signal, estimating positions of the target at the different pulse times using interpolation, and identifying intersections of the rays with the estimated positions of as positions of hits of the rays; transmitting emulated echo signals to the LiDAR sensor indicating the positions of the hits; and updating the simulation scene.
    Type: Grant
    Filed: December 1, 2021
    Date of Patent: December 19, 2023
    Assignee: KEYSIGHT TECHNOLOGIES, INC.
    Inventors: Li Qiu, Lee A. Barford, Zi-Quan Bai
  • Publication number: 20220206117
    Abstract: A system and method are provided for emulating echo signals in response to a LiDAR signal. The method includes updating a current position of a moving emulated target according to a 3D simulation scene at a current frame, the simulation scene including a dynamic model of the target; estimating a next position of the target at a next frame of the simulation scene by updating motion transforms for the dynamic model using motion keys; performing ray tracing by launching rays in parallel, assigning different pulse times to the rays to simulate timing of corresponding light pulses of the LiDAR signal, estimating positions of the target at the different pulse times using interpolation, and identifying intersections of the rays with the estimated positions of as positions of hits of the rays; transmitting emulated echo signals to the LiDAR sensor indicating the positions of the hits; and updating the simulation scene.
    Type: Application
    Filed: December 1, 2021
    Publication date: June 30, 2022
    Inventors: Li Qiu, Lee A. Barford, Zi-Quan Bai
  • Publication number: 20210347045
    Abstract: Disclosed is a variable-parameter stiffness identification and modeling method for an industrial robot. An effective working space of a robot is divided into a plurality of cubic regions. For an operating task in a certain machining region, different loads are applied to an end effector at multiple positions and multiple postures in the region, and robot joint stiffness in this section is identified and acquired according to the relationship between the loads and an end deformation, thereby realizing accurate stiffness control of the robot in different operating sections during a machining process.
    Type: Application
    Filed: October 8, 2019
    Publication date: November 11, 2021
    Applicant: NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS
    Inventors: Wei TIAN, Jiachen JIAO, Wenhe LIAO, Bo LI, Lin ZHANG, Guangyu CUI, Quan BAI
  • Publication number: 20080268281
    Abstract: The invented shield components are used for a plasma processing system to adhere deposition materials or process residuals during wafer processing, thus preventing excessive wafer contamination, even when exposed to high temperatures. One embodiment of the invented shields consists of a reaction barrier layer to separate the underlying substrate from the overlying spray coating to prevent solid-state chemical reaction between the substrate and the coating. Another embodiment of the invented shields consists of a substrate and a coating with a substrate-coating combination chosen to allow no new solid-state phase to form at the interface. The invented shields have well-bonded materials interfaces that preserve thermal and mechanical stability under high temperature conditions in a plasma processing system for the containment of deposition contaminates.
    Type: Application
    Filed: April 27, 2007
    Publication date: October 30, 2008
    Inventors: Quan Bai, Patrick Rymer, Jose Gonzalez, Gary Groshong