Patents by Inventor Quan Dinh

Quan Dinh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230138816
    Abstract: A system configured to assist blockchain-based Internet of Things (IoT) applications connect with one another and share data securely and privately is described. The system includes an IoT network configured to interact with a blockchain network. The IoT network includes IoT systems, which include IoT devices that comprise sensors. The blockchain network includes a mainchain and sidechains. Each sidechain includes a consensus protocol that run on each node and is configured to increase data and synchronization between nodes. The consensus protocol utilizes a reasoning mechanism to enable each node to deduce states of events on other nodes, a gossip algorithm to synchronize data between nodes, and a vector clock algorithm in a knowledge graph deployed on every node to allow the event created during synchronization to be linked to the previous two events.
    Type: Application
    Filed: November 1, 2021
    Publication date: May 4, 2023
    Inventors: Binh Minh Nguyen, Huu-Hai-Quan Dinh, Thang Nguyen, Minh-Tri Hoang, Thanh-Chung Dao, Ba-Lam Do
  • Publication number: 20070118892
    Abstract: One embodiment of the present invention provides a system that associates a digital certificate with an enterprise profile. During operation, an identity store receives a digital certificate from a client. Next, the identity store searches for a mapping rule which determines if an enterprise profile is associated with the digital certificate, wherein the enterprise profile facilitates in identifying user capabilities. If a mapping rule is found, the identity store executes the mapping rule to determine if an enterprise profile is associated with the digital certificate. If so, the enterprise profile, which is associated with the digital certificate, is returned to the client.
    Type: Application
    Filed: November 21, 2005
    Publication date: May 24, 2007
    Inventors: Hari Sastry, Dipankar Thakuria, Quan Dinh
  • Publication number: 20010028554
    Abstract: An electronic module comprises (a) an electrical assembly of electrical components and a cap. The cap surrounds a portion of the electrical assembly of electrical components to form a pocket between a portion of the electrical assembly of electrical components and the cap. The cap has at least one sidewall, each of the at least one sidewalls having an end, one of at least one sidewalls proximately positioned to at least one electrical lead and having at least one notch positioned in the end, the pocket filled with an encapsulant. A process comprises providing a cap and filling the cap with encapsulant, placing an electrical assembly of electrical components in the cap filled with the preselected amount of encapsulant, and allowing the electrical assembly to seat to a proper depth.
    Type: Application
    Filed: February 6, 2001
    Publication date: October 11, 2001
    Applicant: Dallas Semiconductor Corporation
    Inventors: Joe Guillot, Michael Quan Dinh, Bill Roberts, Linda M. McLemore
  • Patent number: 6191955
    Abstract: An electronic module comprises (a) an electrical assembly of electrical components and a cap. The cap surrounds a portion of the electrical assembly of electrical components to form a pocket between a portion of the electrical assembly of electrical components and the cap. The cap has at least one sidewall, each of the at least one sidewalls having an end, one of at least one sidewalls proximately positioned to at least one electrical lead and having at least one notch positioned in the end, the pocket filled with an encapsulant. A process comprises providing a cap and filling the cap with encapsulant, placing an electrical assembly of electrical components in the cap filled with the preselected amount of encapsulant, and allowing the electrical assembly to seat to a proper depth.
    Type: Grant
    Filed: January 21, 1998
    Date of Patent: February 20, 2001
    Assignee: Dallas Semiconductor Corporation
    Inventors: Joe Guillot, Michael Quan Dinh, Bill Roberts, Linda M. McLemore
  • Patent number: 5749143
    Abstract: An electronic module comprises (a) an electrical assembly of electrical components and a cap. The cap surrounds a portion of the electrical assembly of electrical components to form a pocket between a portion of the electrical assembly of electrical components and the cap. The cap has at least one sidewall, each of the at least one sidewalls having an end, one of at least one sidewalls proximately positioned to at least one electrical lead and having at least one notch positioned in the end, the pocket filled with an encapsulant. A process comprises providing a cap and filling the cap with encapsulant, placing an electrical assembly of electrical components in the cap filled with the preselected amount of encapsulant, and allowing the electrical assembly to seat to a proper depth.
    Type: Grant
    Filed: August 12, 1996
    Date of Patent: May 12, 1998
    Assignee: Dallas Semiconductor Corporation
    Inventors: Joe Guillot, Michael Quan Dinh, Bill Roberts, Linda M. McLemore
  • Patent number: D484628
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: December 30, 2003
    Inventors: Bijan Bayat, Michael Quan Dinh
  • Patent number: D486599
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: February 10, 2004
    Inventors: Bijan Bayat, Michael Quan Dinh
  • Patent number: D490554
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: May 25, 2004
    Inventors: Bijan Bayat, Michael Quan Dinh
  • Patent number: D490555
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: May 25, 2004
    Inventors: Bijan Bayat, Michael Quan Dinh