Publication number: 20100186217
Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration.
Type:
Application
Filed:
February 26, 2010
Publication date:
July 29, 2010
Applicant:
DELPHI TECHNOLOGIES, INC.
Inventors:
CHRIS R. SNIDER, VINEET GUPTA, JOSEPH K. HUNTZINGER, MICHAEL G. COADY, CURTIS ALLEN STAPERT, KEVIN EARL MEYER, TIMOTHY D. GARNER, JEFFREY T. BELL, ROBERT L. VADAS, DONALD G. MOESCHBERGER, ALLEN E. OBERLIN, PAUL C. BURTON, DAN D. CARMAN, GARY L. STAHL, JOHN MICHAEL MATLY, RICK L. HATCHER, EDGAR GLENN HASSLER, QUAN N. NGUYEN, WILLIAM R. REED, KIP R. PIEL, JERRY J. WENDLING, TIM A. KENWORTHY, PAUL A. UGLUM, MICHAEL E. FYE, PHILIP M. SCOTT
Patent number: 7733659
Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration.
Type:
Grant
Filed:
August 15, 2007
Date of Patent:
June 8, 2010
Assignee:
Delphi Technologies, Inc.
Inventors:
Chris R. Snider, Vineet Gupta, Joseph K. Huntzinger, Michael G. Coady, Curtis Allen Stapert, Kevin Earl Meyer, Timothy D. Garner, Jeffrey T. Bell, Robert L. Vadas, Donald G. Moeschberger, Allen E. Oberlin, Paul C. Burton, Dan D. Carman, Gary L. Stahl, John Michael Matly, Rick L. Hatcher, Edgar Glenn Hassler, Quan N. Nguyen, William R. Reed, Kip R. Piel, Jerry J. Wendling, Tim A. Kenworthy, Paul A. Uglum, Michael E. Fye, Philip M. Scott