Patents by Inventor Quan-Qun SU

Quan-Qun SU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer coating system and method of manufacturing chip package
    Patent number: 10388541
    Abstract: A wafer coating system includes a wafer chuck, a flowing insulating material sprayer and a wafer tilting lifting pin. The wafer chuck has a carrier part and a rotating part, which the carrier part is mounted on the rotating part to carry a wafer, and the rotating part is configured to rotate with a predetermined axis. The flowing insulating material sprayer is above the wafer chuck and configured to spray a flowing insulating material to the wafer, and the wafer tilting lifting pin is configured to form a first acute angle between the wafer and direction of gravity.
    Type: Grant
    Filed: April 13, 2016
    Date of Patent: August 20, 2019
    Assignee: XINTEC INC.
    Inventors: Yu-Tung Chen, Quan-Qun Su, Chuan-Jin Shiu, Chien-Hui Chen, Hsiao-Lan Yeh, Yen-Shih Ho
  • WAFER COATING SYSTEM AND METHOD OF MANUFACTURING CHIP PACKAGE
    Publication number: 20160307779
    Abstract: A wafer coating system includes a wafer chuck, a flowing insulating material sprayer and a wafer tilting lifting pin. The wafer chuck has a carrier part and a rotating part, which the carrier part is mounted on the rotating part to carry a wafer, and the rotating part is configured to rotate with a predetermined axis. The flowing insulating material sprayer is above the wafer chuck and configured to spray a flowing insulating material to the wafer, and the wafer tilting lifting pin is configured to form a first acute angle between the wafer and direction of gravity.
    Type: Application
    Filed: April 13, 2016
    Publication date: October 20, 2016
    Inventors: Yu-Tung CHEN, Quan-Qun SU, Chuan-Jin SHIU, Chien-Hui CHEN, Hsiao-Lan YEH, Yen-Shih HO