Abstract: An optical sensing device and a method for manufacturing the same are provided. The optical sensing device comprises a substrate, an optical acting area, a filter layer and a carbonized sidewall. The optical acting area is disposed on the substrate. The filter layer covers the optical acting area and selectively allows only a light beam with a specific wavelength to pass therethrough and be received by the optical acting area while blocking the light beams with other wavelengths. The carbonized sidewall covers the sidewall of the filter layer and a portion of the sidewall of the substrate to prevent the light beams with the other wavelengths from being received by the optical acting area through the sidewall of the substrate.

Abstract: A disposal method for a polyester-containing release film including the following steps is provided: providing a release film, which includes a base material and a release layer, wherein at least a material of the base includes polyester, and providing an acid washing step or an alkali washing step to the release film for removing the release layer, and to obtain a polyester-containing solid material.

Abstract: A thermoplastic polyester elastomer conjugate fiber including a core and a sheath is provided. A volume ratio of the core to the sheath is in a range of 4:6 to 6:4.

Abstract: A visible light shielding structure is provided. The visible light shielding structure includes a metal foil layer, two adhesive layers, and two synthesized paper layers. The metal foil layer has a first surface and a second surface opposite to the first surface. The two adhesive layers are disposed on the first surface and the second surface of the metal foil layer, respectively. The two synthesized paper layers are disposed on the two adhesive layers, respectively. Each of the two synthesized paper layers is a polypropylene based resin layer.

Abstract: A release film for high-capacity multilayer ceramic capacitor (MLCC) 0.5-0.8 ?m ceramic slurry and a production method thereof. The release film includes at least three layers of co-extruded polyester resin having a layer A, a layer B and a layer C, and stretching the same in longitudinal and transverse directions. In addition, the layer B includes recycled polyester resin, the layers A and C include new polyester resin raw materials, and a releasing agent having a phenyl releasing control agent. The production method for the release film includes coating a releasing agent on one or both sides of a polyester film, and winding into a roll after drying and hardening.

Abstract: An eco-friendly synthetic paper and a method for manufacturing the same are provided. The eco-friendly synthetic paper includes a light-shielding adhesive layer and two polypropylene-based resin layers. The light-shielding adhesive layer has a first surface and a second surface opposite to the first surface. The two polypropylene-based resin layers are respectively attached to the first surface and the second surface of the light-shielding adhesive layer. The light-shielding adhesive layer contains an adhesive component and a black colorant. The adhesive component is present in an amount between 35.9 wt % and 63.1 wt % of the total weight of the light-shielding bonding layer, and the black colorant is present in an amount between 12.9 wt % and 21.7 wt % of the total weight of the light-shielding bonding layer.

Abstract: A liquid crystal polymer film, and a composite film of liquid crystal polymer and polyimide and a manufacturing method thereof are provided. The liquid crystal polymer film includes 63 wt % to 74 wt % of p-hydroxybenzoic acid, 21 wt % to 26 wt % of 6-hydroxy-2-naphthoic acid, and 5 wt % to 11 wt % of p-hydroxycinnamic acid. The composite film is manufactured by thermocompressing a single layer or multi layers of liquid crystal polymer film and polyimide film so that the composite film can have high flatness and the surface roughness Sa of the composite film is ranging from 0.1 ?m to 10 ?m. In the production process of the composite film, the composite film is rolled up and attached to a copper foil to form a high frequency substrate with good processability. After peeling the polyimide film, the liquid crystal polymer film can be thermocompressed to form a four-layered, six-layered, eight-layered or eight-layered high frequency substrate.

Abstract: An optical clear adhesive (OCA) and a manufacturing method thereof are provided. The OCA is a three-layer laminated structure including an OCA transparent film, a high release film coated on a lower surface of the OCA transparent film and a light release film coated on an upper surface of the OCA transparent. The high release film and the light release film contain 0.01 to 3 wt % of UV absorber. After UV light irradiation, the OCA transparent film has a suitable peeling force between the light release film and the high release film.

Abstract: A release film for high-capacity multilayer ceramic capacitor (MLCC) 0.5-0.8 ?m ceramic slurry and a production method thereof. The release film includes at least three layers of co-extruded polyester resin having a layer A, a layer B and a layer C, and stretching the same in longitudinal and transverse directions. In addition, the layer B includes recycled polyester resin, the layers A and C include new polyester resin raw materials, and a releasing agent having a phenyl releasing control agent. The production method for the release film includes coating a releasing agent on one or both sides of a polyester film, and winding into a roll after drying and hardening.

Abstract: An electrical connector for electrically connecting a chip module to a circuit board includes a body, having a plurality of accommodating slots penetrating the body, where a slot wall of at least one of the accommodating slots protrudes inward to form a boss, and the boss has a stopping corner; and a plurality of conductive terminals, correspondingly accommodated in the accommodating slots. At least one of the conductive terminals has an inclined portion, formed by tapering one side of the conductive terminal, wherein the inclined portion is adjacent to the stopping corner, the inclined portion is not parallel to a top surface of the boss, and the inclined portion is at least partially located above the stopping corner and configured to limit the conductive terminal from moving downward.

Abstract: An electrical connector for electrically connecting a chip module to a circuit board includes a body, having multiple accommodating slots, and multiple conductive terminals, correspondingly accommodated in the accommodating slots. Each conductive terminal includes: a base portion; an elastic arm, formed by extending upward from the base portion and used for abutting the chip module; a strip connecting portion, formed by extending upward from the base portion and used for being connected to a strip; an extending portion, formed by bending and extending from one side of the base portion, where the extending portion is located below the strip connecting portion and does not interfere with the accommodating slot; and a conducting portion, used for being electrically connected to the circuit board.

Abstract: An electrical connector includes a body, multiple terminals and a shell. The body includes a mating cavity defined by a top plate, a bottom plate and two side plates. The top plate and the bottom plate are respectively provided with multiple accommodating grooves, which include a wider first accommodating groove and a narrower second accommodating groove. Each terminal has an elastic portion accommodated in a corresponding accommodating groove. A first clearance is provided between the elastic portion and a side of the first accommodating groove close to the corresponding side plate. A second clearance is provided between the elastic portion and a side of the second accommodating groove close to the first accommodating groove. The first clearance is greater than the second clearance The shell has a top wall and two side walls. A mating port being defined by the front ends thereof is larger than the mating cavity.

Abstract: An electrical connector for electrically connecting a chip module to a circuit board includes a body, having a plurality of accommodating slots penetrating the body, where a slot wall of at least one of the accommodating slots protrudes inward to form a boss, and the boss has a stopping corner; and a plurality of conductive terminals, correspondingly accommodated in the accommodating slots. At least one of the conductive terminals has an inclined portion, formed by tapering one side of the conductive terminal, wherein the inclined portion is adjacent to the stopping corner, the inclined portion is not parallel to a top surface of the boss, and the inclined portion is at least partially located above the stopping corner and configured to limit the conductive terminal from moving downward.

Abstract: An electrical connector configured to electrically connect to a chip module includes: a body, provided with at least one accommodating hole, where the body has a protruding block provided to protrude upward from one side of the accommodating hole, and the protruding block is configured to support the chip module upward; and at least one terminal, correspondingly accommodated in the at least one accommodating hole. The terminal includes a base, accommodated in the accommodating hole; an elastic arm, formed by extending forward from the base, located at one side of the protruding block, and configured to be electrically connected with the chip module; and a through slot, running vertically through the elastic arm. The protruding block has a rear end. The base is located behind the rear end, and the through slot extends forward beyond the rear end.

Abstract: An electrical connector for electrically connecting a chip module to a circuit board includes a body, having multiple accommodating slots, and multiple conductive terminals, correspondingly accommodated in the accommodating slots. Each conductive terminal includes: a base portion; an elastic arm, formed by extending upward from the base portion and used for abutting the chip module; a strip connecting portion, formed by extending upward from the base portion and used for being connected to a strip; an extending portion, formed by bending and extending from one side of the base portion, where the extending portion is located below the strip connecting portion and does not interfere with the accommodating slot; and a conducting portion, used for being electrically connected to the circuit board.

Abstract: An electrical connector includes a body, multiple terminals and a shell. The body includes a mating cavity defined by a top plate, a bottom plate and two side plates. The top plate and the bottom plate are respectively provided with multiple accommodating grooves, which include a wider first accommodating groove and a narrower second accommodating groove. Each terminal has an elastic portion accommodated in a corresponding accommodating groove. A first clearance is provided between the elastic portion and a side of the first accommodating groove close to the corresponding side plate. A second clearance is provided between the elastic portion and a side of the second accommodating groove close to the first accommodating groove. The first clearance is greater than the second clearance The shell has a top wall and two side walls. A mating port being defined by the front ends thereof is larger than the mating cavity.

Abstract: An electrical connector configured to electrically connect to a chip module includes: a body, provided with at least one accommodating hole, where the body has a protruding block provided to protrude upward from one side of the accommodating hole, and the protruding block is configured to support the chip module upward; and at least one terminal, correspondingly accommodated in the at least one accommodating hole. The terminal includes a base, accommodated in the accommodating hole; an elastic arm, formed by extending forward from the base, located at one side of the protruding block, and configured to be electrically connected with the chip module; and a through slot, running vertically through the elastic arm. The protruding block has a rear end. The base is located behind the rear end, and the through slot extends forward beyond the rear end.

Abstract: A method for manufacturing a shielded connector includes: providing a body having an upper surface, a lower surface, a signal accommodating hole and a ground accommodating hole; plating a metal layer on the upper surface of the body and inner walls of the signal accommodating hole and the ground accommodating hole; forming an isolating region in the area around the signal accommodating hole to divide the metal layer into a first metal layer and a second metal layer; electrifying the first metal layer with an electroplating treatment so as to increase a thickness of the first metal layer, where the second metal layer is not thickened; partially removing the metal layer, so as to completely remove the second metal layer and decrease the thickness of the first metal layer; and installing a signal terminal and a ground terminal correspondingly in the signal accommodating hole and the ground accommodating hole, respectively.

Abstract: A release film is provided for supporting an ultrathin ceramic green sheet having a thickness of 0.5 to 1.0 ?m, and the release film due to containing modified organic particles and an antistatic agent has a slippery releasing surface with a low friction coefficient and hence excellent coatability and releasing properties; resulted in that when the release film is rolled up, the rolled surfaces do not adhere to each other, and when the ultrathin ceramic green sheet is peeled off from the release film, the ultrathin ceramic green sheet due to a relatively small electrostatic force being generated is without breaking; so that the release film contributes to increasing the yield of ultrathin ceramic green sheet.