Patents by Inventor Quang Nguyen

Quang Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240117855
    Abstract: Apparatuses, systems, and methods for a damper for a printed circuit board assembly (PCBA). One example apparatus can include a PCBA of a solid state drive (SSD) and a damper configured to contact the PCBA, contact an enclosure of the SSD, and damp shock impulses applied to the SSD.
    Type: Application
    Filed: October 10, 2022
    Publication date: April 11, 2024
    Inventors: Kaleb A. Wilson, Bradley R. Bitz, Mark A. Tverdy, Quang Nguyen, Christopher Glancey, Jagadeesh B. Ginjupalli, Pridhvi Dandu
  • Publication number: 20240111619
    Abstract: Systems and methods related to serial communication devices are provided. An example integrated circuit (IC) device includes interface circuitry coupled to a two-wire serial communication bus having a serial clock (SCL) line and a serial data (SDA) bus line. The IC device further includes bus stuck recovery circuitry to monitor for a local SDA fault condition at the IC device based on a number of clock cycles during which an internal SDA signal (e.g., generated by the IC device) drives the SDA bus line to a first signal state, the clock cycles based on a clock signal received from the SCL line; and responsive to the local SDA fault condition, release the SDA bus line independent of the internal SDA signal, where the SDA bus line is in a second signal state different from the first signal state based on the release.
    Type: Application
    Filed: September 30, 2022
    Publication date: April 4, 2024
    Applicant: Analog Devices, Inc.
    Inventors: Ran TAO, Johan H. MANSSON, Khiem Quang NGUYEN, Long Thanh PHAM, Shane P. KEATING
  • Publication number: 20240087215
    Abstract: A system for generating an advanced surround view for a vehicle includes a plurality of cameras to generate image data. Sensors are configured to determine kinematic data of the vehicle. Kinematic data are also obtained by a visual odometry module and/or a deep-vision mechanism. A processor is configured to process image data captured by the plurality of cameras to generate a 360-degree surround view layer representative of a surrounding area. The processor is further configured to construct an improved bicycle kinematic model for processing kinematic data to generate an under-chassis layer representative of an area under the vehicle. The processor is further configured to generate a 3D vehicle model layer and overlay objects layer. Display screens display a GUI of combined scene of the 360-degree surround view layer, under-chassis layer, 3D vehicle model layer and overlay objects layer as would be viewed from a virtual camera viewpoint.
    Type: Application
    Filed: October 26, 2023
    Publication date: March 14, 2024
    Inventors: Dai Thanh PHAN, Phuc Thien NGUYEN, Chi Thanh NGUYEN, Duc Chan VU, Truong Trung Tin NGUYEN, Dang Quang NGUYEN, Hai Hung BUI
  • Patent number: 11899786
    Abstract: An event can be analyzed for association with a security violation. Characters or other values of event data (e.g., command-line text) associated with the event can be provided sequentially to a trained representation mapping to determine respective representation vectors. Respective indicators can be determined by applying the vectors to a trained classifer. A token in the event data can be located based on the indicators. The event's can be determined to be associated with a security violation based on the token satisfying a token-security criterion. The representation mapping can be trained by adjusting model parameters so the trained representation predicts, based on a character of training command-line text, an immediately following character in the training command-line text. The classifier can be determined based on the trained representation mapping and classification training data indicating whether respective portions of training event data are associated with security violations.
    Type: Grant
    Filed: July 10, 2019
    Date of Patent: February 13, 2024
    Assignee: CrowdStrike, Inc.
    Inventors: Cory-Khoi Quang Nguyen, Jaron Michael Bradley, William Leon Charles Pauley
  • Publication number: 20240039547
    Abstract: Embodiments of the disclosure provide improved mismatch shaping for a digital to analog converter, the method including splitting an original input of a circuit into a plurality of time interleaved data streams; element rotation selection (ERS) logic to process the plurality of time interleaved data streams; and directing one of the plurality of time interleaved data streams to the ERS logic according to a decision of a data-weighted sigma-delta (SD) modulator. In other example implementations, the method can further include multiplexing one of the plurality of time interleaved data streams to be provided to a barrel shifter. In yet other examples, the method can include monitoring a difference between the plurality of time interleaved data streams as a basis for the directing such that a data sample rate for the digital to analog converter is reduced over a time interval.
    Type: Application
    Filed: July 29, 2022
    Publication date: February 1, 2024
    Applicant: Analog Devices, Inc.
    Inventor: Khiem Quang NGUYEN
  • Publication number: 20240025761
    Abstract: Proposed is a lithium secondary battery cathode active material doped with B and Al. The cathode active material has a high specific capacity upon charging and discharging, a high capacity resilience, and a high capacity retention rate.
    Type: Application
    Filed: March 14, 2023
    Publication date: January 25, 2024
    Applicant: The Industry & Academic Cooperation in Chungnam National University (IAC)
    Inventors: Chunjoong KIM, Duc Quang Nguyen
  • Patent number: 11865066
    Abstract: A pedicure chair with a basin having an auto-fill system for depositing water into the basin while eliminating spillover is disclosed. The auto-fill system has a controller, a water supply valve, and a water level sensor. The water level sensor can be a proximity sensor attached to an external surface of the basin. The water level sensor can send a signal to a controller when the water level sensor detects a predetermined water level in the basin. The controller can be configured to shut on and off the water supply to the basin by sending a signal to actuate the water supply valve.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: January 9, 2024
    Assignee: CL CAPITAL INVESTMENTS GROUP LLC
    Inventors: Christopher L. Luong, Quang Nguyen, Long Luong
  • Patent number: 11870081
    Abstract: The invention relates to the method of preparing catalyst based on platinum (Pt), with a low Pt content, dispersed on carrier containing graphene quantum dots (Pt/GQDs or Pt/GO-GQDs) used for fuel cell with excellent activity in the electrochemical oxidation reaction of alcohol (for example, methanol, ethanol), applied as an anode catalyst for direct alcohol fuel cell (DAFC). At the same time, the invention also refers to the catalyst obtained by this method as an anode catalyst for DAFC.
    Type: Grant
    Filed: April 23, 2020
    Date of Patent: January 9, 2024
    Inventors: Thu Ha Thi Vu, Minh Quang Nguyen, Tho Thi Lam, Thao Thi Nguyen, Ngoc Bich Nguyen
  • Patent number: 11859300
    Abstract: Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. A method involves: (a) providing an electroplating solution to an electroplating system; (b) electroplating the metal onto the substrate while the substrate is held in a cathode chamber of an electroplating cell of electroplating system; (c) supplying the make-up solution to the electroplating system via a make-up solution inlet; and (d) supplying the secondary electroplating solution to the electroplating system via a secondary electroplating solution inlet. The secondary electroplating solution includes some or all components of the electroplating solution. At least one component of the secondary electroplating solution has a concentration that significantly deviates from its target concentration.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: January 2, 2024
    Assignee: Lam Research Corporation
    Inventors: Zhian He, Shantinath Ghongadi, Quan Ma, Hyungjun Hur, Cian Sweeney, Quang Nguyen, Rezaul Karim, Jingbin Feng
  • Publication number: 20230401630
    Abstract: Methods and systems for protecting seller privacy during an ecommerce transaction are disclosed. In one aspect, a method includes, receiving, via an online listing configuration interface for a first session, one or more candidate pick up times and specific pick up locations for an item, determining a generalized version of the one or more specific pick up locations, displaying, via a second session, an online listing for the item, displaying, via the second session, the one or more candidate pick up times and the generalized versions of the one or more specific pick up locations, receiving, via the second session, a selection of one of the candidate pick up times and one of the generalized versions of one of the specific pick up locations, in response to receiving payment for the item, displaying a specific pick up location corresponding to the selected one generalized version.
    Type: Application
    Filed: August 30, 2023
    Publication date: December 14, 2023
    Inventors: Hieu Van Nguyen, Huy Quang Nguyen, Tuan Thanh Phan, Hoang Trinh
  • Publication number: 20230370769
    Abstract: An electronic apparatus is provided. The electronic apparatus includes a sound module, a housing configured to receive the sound module is accommodated and which includes a first hole formed at the back surface thereof and communicating with the sound module, and a second hole formed at one side surface thereof and communicating with the first hole, and a sealing member which is attached to the back surface of the housing, wherein the sealing member includes a recess formed at least one of side surfaces opposite to each other.
    Type: Application
    Filed: July 25, 2023
    Publication date: November 16, 2023
    Inventors: Van Phuc DONG, Van Quang NGUYEN, The Quan NGUYEN, Xuan Sinh NGO
  • Publication number: 20230335522
    Abstract: Semiconductor devices having interconnect structures with conductive elements configured to mitigate thermomechanical stresses, and associated systems and methods, are disclosed herein. In one embodiment, a semiconductor package includes a semiconductor die and a pillar structure coupled to the semiconductor die. The pillar structure can include a plurality of conductive elements made of a first conductive material having a first elastic modulus. The pillar structure can further include a continuous region of a second conductive material at least partially surrounding the plurality of conductive elements. The second conductive material can have a second elastic modulus less than the first elastic modulus.
    Type: Application
    Filed: June 21, 2023
    Publication date: October 19, 2023
    Inventors: Shams U. Arifeen, Quang Nguyen, Christopher Glancey, Koustav Sinha, Chan H. Yoo
  • Patent number: 11783407
    Abstract: Methods and systems for protecting seller privacy during an ecommerce transaction are disclosed. In one aspect, a method includes, receiving, via an online listing configuration interface for a first session, one or more candidate pick up times and specific pick up locations for an item, determining a generalized version of the one or more specific pick up locations, displaying, via a second session, an online listing for the item, displaying, via the second session, the one or more candidate pick up times and the generalized versions of the one or more specific pick up locations, receiving, via the second session, a selection of one of the candidate pick up times and one of the generalized versions of one of the specific pick up locations, in response to receiving payment for the item, displaying a specific pick up location corresponding to the selected one generalized version.
    Type: Grant
    Filed: July 7, 2022
    Date of Patent: October 10, 2023
    Assignee: EBAY INC.
    Inventors: Hieu Van Nguyen, Huy Quang Nguyen, Tuan Thanh Phan, Hoang Trinh
  • Publication number: 20230290738
    Abstract: Semiconductor systems having anti-warpage frames (and associated systems, devices, and methods) are described herein. In one embodiment, a semiconductor system includes (a) a printed circuit board (PCB) having a first side and a second side opposite the first side, and (b) at least one memory device attached to the PCB at the first side of the PCB. The semiconductor system further includes a frame structure attached to the PCB at the first side of the PCB and proximate the at least one memory device. The frame structure can be configured to resist warpage of the PCB, for example, when the semiconductor system is heated to attach the at least one memory device to the PCB.
    Type: Application
    Filed: March 9, 2022
    Publication date: September 14, 2023
    Inventors: Quang Nguyen, Christopher Glancey, Koustav Sinha
  • Publication number: 20230274170
    Abstract: Aspects of the present disclosure provide systems, methods, and computer-readable storage media that support ontology driven processes to create digital twins that extend the capabilities of knowledge graphs. A dataset including an ontology and domain data corresponding to a domain associated with the ontology is obtained. A knowledge graph is constructed based on the ontology and the domain data is incorporated into the knowledge graph. The knowledge graph is exploited to derive random variables of a probabilistic graph model. The random variables may be associated with probability distributions, which may include unknown parameters. A learning process is executed to learn the unknown parameters and obtain a joint distribution of the probabilistic graph model, which may enable querying of the probabilistic graph model in a probabilistic and deterministic manner.
    Type: Application
    Filed: February 25, 2022
    Publication date: August 31, 2023
    Inventors: Zaid Tashman, Matthew Kujawinski, Neda Abolhassani, Sanjoy Paul, Thien Quang Nguyen, Eric Annong Tang, Jessica Huey-Jen Yeh
  • Publication number: 20230264170
    Abstract: A composition is provided for removal of a target substance from a fluid stream. The composition may be used to remove polyfluorinated alkyl substances (PFAS) from water. The composition comprises a support material comprising an alumina; and a sorbent molecule that comprises a core polymer; wherein the core polymer is covalently linked to the support material; and wherein the sorbent molecule further comprises one or more covalently linked sorbent groups. Processes for removal of target substances such as PFAS are also provided.
    Type: Application
    Filed: March 21, 2023
    Publication date: August 24, 2023
    Applicant: PURAFFINITY LTD
    Inventors: Octavia Ann BLACKBURN, Khai Duong Quang NGUYEN, Liberty Jocasta ROCKEY, Aiden Sinan MCGUIRK, Alex Michael JAMES, Nathan CLEMENCE, Simon Paul FOXON
  • Patent number: 11732215
    Abstract: A gellable vehicle surface cleaning composition is provided that includes a non-ionic surfactant combined with gelling components of an inorganic gel forming substance and at least one water soluble polymer in a ratio of the inorganic gel forming substance to the hydrophilic polymer of between 0.1-1:1. The non-ionic surfactant and the gelling components are provided in an aqueous solvent system. The aqueous solvent system includes a first solvent having a Kamlet-Taft solvent polarity ? (K-T ?) value of zero, a second solvent having a K-T ? 0.6-0.85 value, and water present at more than 50 total weight percent. A process of for cleaning a vehicle surface with a stain is also provided that includes the composition to the stain on the vehicle surface a composition and after allowing sufficient time for the composition to lift the stain, the stain and the composition are removed from the vehicle surface.
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: August 22, 2023
    Assignee: ILLINOIS TOOL WORKS INC.
    Inventors: Chi Quang Nguyen, John Isidoro Escoto, Jr., John Nemec
  • Publication number: 20230260943
    Abstract: Semiconductor die assemblies with flexible interconnects, and associated methods and systems are disclosed. The semiconductor die assembly includes a package substrate and a semiconductor die attached to the package substrate through the flexible interconnects. The flexible interconnects include one or more rigid sections and one or more flexible sections, each of which is disposed next to the rigid sections. The flexible sections may include malleable materials with relatively low melting temperatures (e.g., having relatively low modulus at elevated temperatures) such that the flexible interconnects can have reduced flexural stiffness during the assembly process. The malleable materials of the flexible interconnects, through plastic deformation in response to stress generated during the assembly process, may facilitate portions of the flexible interconnects to shift so as to reduce transfer of the stress to other parts of the semiconductor die assembly—e.g., circuitry of the semiconductor die.
    Type: Application
    Filed: February 17, 2022
    Publication date: August 17, 2023
    Inventors: Christopher Glancey, Shams U. Arifeen, Koustav Sinha, Quang Nguyen
  • Publication number: 20230257683
    Abstract: A vehicle hard surface cleaning composition is provided that includes a surfactant present from 0.1 to 8.0 total weight percent, a hydrotrope present from 0.1 to 3.0 total weight percent, a wetting agent present from 0.1 to 5.0 total weight percent, a protectant present from 0.01 to 17 total weight percent, and a diluent making up a remainder of the composition. A method of cleaning a vehicle hard surface include applying the composition thereto and washing the composition therefrom to leave a residue of graphene or graphene oxide.
    Type: Application
    Filed: August 30, 2022
    Publication date: August 17, 2023
    Applicant: Illinois Tool Works Inc.
    Inventors: Chi Quang Nguyen, John Isidoro Escoto, JR., Tze-Lee Phang
  • Patent number: 11728307
    Abstract: Semiconductor devices having interconnect structures with conductive elements configured to mitigate thermomechanical stresses, and associated systems and methods, are disclosed herein. In one embodiment, a semiconductor package includes a semiconductor die and a pillar structure coupled to the semiconductor die. The pillar structure can include a plurality of conductive elements made of a first conductive material having a first elastic modulus. The pillar structure can further include a continuous region of a second conductive material at least partially surrounding the plurality of conductive elements. The second conductive material can have a second elastic modulus less than the first elastic modulus.
    Type: Grant
    Filed: April 21, 2021
    Date of Patent: August 15, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Shams U. Arifeen, Quang Nguyen, Christopher Glancey, Koustav Sinha, Chan H. Yoo