Patents by Inventor Quang Nguyen
Quang Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250137768Abstract: A shotgun magazine carrier for a competition shotgun to be attached to a competition belt or tactical belt. The carrier will fully attach to the magazine, so much so that it will remain on the magazine as it is installed onto the shotgun. The magazine will be configured such that it will remain in place as the competitor moves around the course whether in the mounted belt position or on the shotgun itself. The carrier consists of two parts, which can be made of metal or plastic, held together around the magazine with one or more fasteners. One of the two metal parts will be bent at a ninety-degree angle, in a clip shape, in order to fit directly over the competition or tactical belt securely next to the body of the user. The carrier will remain securely in place when in movement and during loading of the magazine.Type: ApplicationFiled: October 28, 2023Publication date: May 1, 2025Inventor: Quang Nguyen
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Publication number: 20250131066Abstract: According to some embodiments, systems and methods are provided, comprising a classification data store that contains electronic records associated with entity classifications; and the back-end application computer server, coupled to the classification data store, including: a computer processor; and a memory coupled to the computer processor and storing instructions that, when executed by the computer processor, cause the back-end application computer server to: receive a name and an address associated with the name; receive third-party data associated with the name; classify the name as an enterprise type using a classification tool and the third-party data, the classification tool including a trained hybrid machine learning (ML) model; a communication port coupled to the back-end application computer server to facilitate an exchange of data with a remote device via a distributed communication network to support interactive user interface displays that include information about the classification.Type: ApplicationFiled: October 20, 2023Publication date: April 24, 2025Inventors: Veronica Anne Beaupre, Xunchi Chen, Cristina I. Gheorghe, Hieu Quang Nguyen, Thomas J. Sibley, III
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Publication number: 20250130779Abstract: Systems, methods, and software are disclosed herein for an iterative process of visualization generation. In an implementation, a computing device receives a user request to generate a visualization. The computing device submits a first prompt to a foundation model to obtain code for generating an instance of the visualization requested by the user. The computing device generates an instance of the visualization using the code. The computing device submits the instance of the visualization to an image model to obtain a description of the instance and submits a second prompt to the foundation model to obtain an evaluation of the instance of the visualization with respect to the visualization requested by the user, including the description produced by the image model.Type: ApplicationFiled: October 19, 2023Publication date: April 24, 2025Inventor: Thong Quang NGUYEN
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Publication number: 20250117647Abstract: A method that may be computer implemented converts a tensor value from a first format to a second format and trains a neural network. The method determines a maximum exponent code in the first format and subtracts a first bias to obtain the highest needed exponent. It determines a second bias from the highest available code (HAC) in the second format and the HNE, and converts the tensor value from the first format to the second format by using the second bias instead of the first bias. The method uses the second format to train the neural network. The method may round the mantissa of the tensor value in the first format to obtain a rounded mantissa of the tensor value for the second format.Type: ApplicationFiled: October 5, 2023Publication date: April 10, 2025Applicant: SambaNova Systems, Inc.Inventors: Valentina Popescu, Jeffrey S. Brooks, Ram SIVARAMAKRISHNAN, Matthew William Ashcraft, Vinh Quang Nguyen, Gang Liu, Raghu PRABHAKAR, Yongning SHENG
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Patent number: 12256824Abstract: An integral nail polish stirring system includes an integral nail polish stirring cap that with a cap button that when pressed causes a stirring shaft to rotate within the nail polish to stir the nail polish. The cap button has a helical drive shaft extending down into a cap cavity and through a drive platform aperture in a rotating drive platform that rotates the rotating drive platform when the cap button is pressed. The stirring shaft extends from the rotating drive platform opposite the cap button. A spring in the actuation chamber between the cap button and the rotating drive platform returns the cap button to a ready position. The stirring shaft may have a mixing paddle, or an applicator configured thereon. The an integral nail polish stirring cap may be interchanged between nail polish containers.Type: GrantFiled: July 26, 2024Date of Patent: March 25, 2025Inventor: Quang Nguyen
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Publication number: 20250079371Abstract: Semiconductor die assemblies with flexible interconnects, and associated methods and systems are disclosed. The semiconductor die assembly includes a package substrate and a semiconductor die attached to the package substrate through the flexible interconnects. The flexible interconnects include one or more rigid sections and one or more flexible sections, each of which is disposed next to the rigid sections. The flexible sections may include malleable materials with relatively low melting temperatures (e.g., having relatively low modulus at elevated temperatures) such that the flexible interconnects can have reduced flexural stiffness during the assembly process. The malleable materials of the flexible interconnects, through plastic deformation in response to stress generated during the assembly process, may facilitate portions of the flexible interconnects to shift so as to reduce transfer of the stress to other parts of the semiconductor die assembly-e.g., circuitry of the semiconductor die.Type: ApplicationFiled: November 20, 2024Publication date: March 6, 2025Inventors: Christopher Glancey, Shams U. Arifeen, Koustav Sinha, Quang Nguyen
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Patent number: 12236530Abstract: A three-dimensional shape descriptor extractor is implemented by collecting surface data from a three-dimensional shape as learning data and training a set of a prescribed encoder and a prescribed decoder by using the learning data, wherein the training extracts a three-dimensional shape descriptor from the learning data by using the encoder, undoes the three-dimensional shape descriptor by using the decoder, evaluates a difference between a state before using the encoding and a state after using the decoding, and adjusts the encoder and the decoder so as to reduce the difference, and mesh data is collected from the three-dimensional shape as the surface data and made to have a prescribed scale, so as to train the encoder and the decoder.Type: GrantFiled: February 1, 2023Date of Patent: February 25, 2025Assignee: ASTRAEA SOFTWARE CO., LTD.Inventors: Phong Tran Quang Nguyen, Kouji Maruyama, Kiyofumi Shijo
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Publication number: 20250054341Abstract: Systems and methods for remotely starting a vehicle are described. An example system includes a control system operatively connected to the vehicle and to a remote or a host device. The control system receives vehicle data from the vehicle concerning safety and operating attributes associated with the vehicle, and compares the vehicle data relative to start up criteria associated with the vehicle to generate a start status. The control system controls remote access to start the vehicle based on the start status.Type: ApplicationFiled: June 7, 2024Publication date: February 13, 2025Inventors: Kayla Schulte, Quang Nguyen, Kevin Pfohl, Lane Whitaker, Mark Dolson, Troy Hohaus, Matthew Less
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Publication number: 20250043123Abstract: The present disclosure relates to compositions and elastomer cure processes. In at least one embodiment, a composition includes a phenol formaldehyde resin; a bisthiosulfate; and an elastomer comprising (1) a C4 to C7 isoolefin-derived monomer, a non-halogenated alkylstyrene monomer, and a halogenated alkylstyrene monomer, or (2) a C4 to C7 isoolefin-derived monomer and a halogenated diolefin. In at least one embodiment, a bromine-containing vulcanizate has a Mooney Viscosity (ML, 1+4@100° C.) of 75 to 92; a cross-linking level (MH-ML) of 10 dNm to 19 dNm; a modulus at 300% of 3 MPa to 10 MPa; a anergy at break of 3J to 5J.Type: ApplicationFiled: December 13, 2022Publication date: February 6, 2025Inventors: Paul Tu Quang NGUYEN, Sunny JACOB, Edward J. BLOK
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Publication number: 20250038491Abstract: The present disclosure is directed to a power distribution unit (PDU). The PDU includes an enclosure, which consists of a front panel, at least one side panel, and a rear panel. The PDU further includes at least one power output receptacle mounted on the enclosure, and at least one or more circuit breakers coupled to a breaker mount. The circuit breaker can have a DIN-Rail mount design and is in series with the corresponding power outlet receptacle. The breaker mount consists of a base surface, a mounting surface, and a top surface for attaching the breaker mount to the PDU. The mounting surface of the breaker mount includes a first mounting post and a second mounting post, to allow for a DIN-Rail mountable circuit breaker to be installed in the PDU.Type: ApplicationFiled: July 29, 2024Publication date: January 30, 2025Applicant: Vertiv CorporationInventors: Jesse Preuss, Quang Nguyen, Caleb Thomas
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Patent number: 12211814Abstract: Semiconductor devices having interconnect structures with conductive elements configured to mitigate thermomechanical stresses, and associated systems and methods, are disclosed herein. In one embodiment, a semiconductor package includes a semiconductor die and a pillar structure coupled to the semiconductor die. The pillar structure can include a plurality of conductive elements made of a first conductive material having a first elastic modulus. The pillar structure can further include a continuous region of a second conductive material at least partially surrounding the plurality of conductive elements. The second conductive material can have a second elastic modulus less than the first elastic modulus.Type: GrantFiled: June 21, 2023Date of Patent: January 28, 2025Assignee: Micron Technology, Inc.Inventors: Shams U. Arifeen, Quang Nguyen, Christopher Glancey, Koustav Sinha, Chan H. Yoo
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Publication number: 20250014959Abstract: A microelectronic device includes a semiconductor die operatively coupled to a base structure. The device further includes an encapsulant substantially surrounding the semiconductor die. The device also includes one or more recesses vertically extending from an upper surface of the encapsulant to one or more locations at or proximate to an upper surface of the base structure.Type: ApplicationFiled: June 7, 2024Publication date: January 9, 2025Inventors: Manish Nayini, Koustav Sinha, Christopher Glancey, Quang Nguyen
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Publication number: 20240407080Abstract: Systems, apparatuses, and methods related to a printed circuit board (PCB) with a plurality of layers are described. Embodiments of the present technology can include low coefficient of thermal expansion (CTE) strips, such as material with a CTE value of less than a threshold level, added into the core layer of the PCB. The added low CTE strips can lower the overall CTE mismatch between the PCB and the mounted components.Type: ApplicationFiled: May 1, 2024Publication date: December 5, 2024Inventors: Quang Nguyen, Koustav Sinha, Christopher Glancey
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Publication number: 20240378399Abstract: A data processing system implements receiving a natural language query from a client device, the query including a textual description of one or more actions to be performed using an application on the client device, generating a prompt for a large language model (LLM) based on the natural language query; providing the prompt to the LLM to obtain program code, which when executed, causes the application to perform the one or more actions, the first program code being implemented in a domain specific language (DSL) designed to facilitate program synthesis via the LLM; analyzing a syntax of the first program code to identify syntax errors in the first program code; correcting the syntax errors in the program code to generate corrected program code; and causing the client device to execute the program code to perform the one or more actions in the application on the client device.Type: ApplicationFiled: May 10, 2023Publication date: November 14, 2024Applicant: Microsoft Technology Licensing, LLCInventors: Apurva Sandeep GANDHI, Thong Quang NGUYEN, Ameya Shyam BHATAWDEKAR, Huitian JIAO, Robert STEEN, Ajitesh KISHORE
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Patent number: 12121494Abstract: A pedicure chair with a basin for receiving a quantity of water therein. An autofill system can be incorporated with the basin to automatically manage spillover. The auto fill system can have a controller, a water supply valve, and a water level sensor. The water level sensor can be a proximity sensor attached externally of the basin. The water level sensor can send a signal to a controller when the water level sensor detects a predetermined water level in the basin. The controller is configured to shut off the water supply to the basin by sending a signal to actuate the water supply valve. A steamer can be used with the pedicure chair to provide heat and a therapeutic steam bath.Type: GrantFiled: September 15, 2020Date of Patent: October 22, 2024Assignee: Lexor, Inc.Inventors: Christopher L. Luong, Quang Nguyen, Long Luong
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Publication number: 20240348562Abstract: A shared networking pipeline is implemented by a network interface device and shared by a plurality of host devices. A pool of shared buffers of a network interface device correspond to one or more stages in the pipeline and are configured to allocate entries to the plurality of host devices based on the respective shares of the shared packet processing pipeline. Data is buffered associated with traffic of a first one of the plurality of host devices in a first subset of shared buffers, where the traffic is to proceed from a first stage to a second stage in the shared packet processing pipeline, and the data is associated with processing of the traffic by the second stage. Forward progress of the traffic is to be prevented from the first stage to the second stage when the first subset of entries are occupied.Type: ApplicationFiled: June 28, 2024Publication date: October 17, 2024Applicant: Intel CorporationInventors: Yotam Nizri, Wing Cheung, Thang Quang Nguyen, Kenneth Keels, Noam Elati
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Patent number: 12119833Abstract: Embodiments of the disclosure provide improved mismatch shaping for a digital to analog converter, the method including splitting an original input of a circuit into a plurality of time interleaved data streams; element rotation selection (ERS) logic to process the plurality of time interleaved data streams; and directing one of the plurality of time interleaved data streams to the ERS logic according to a decision of a data-weighted sigma-delta (SD) modulator. In other example implementations, the method can further include multiplexing one of the plurality of time interleaved data streams to be provided to a barrel shifter. In yet other examples, the method can include monitoring a difference between the plurality of time interleaved data streams as a basis for the directing such that a data sample rate for the digital to analog converter is reduced over a time interval.Type: GrantFiled: July 29, 2022Date of Patent: October 15, 2024Assignee: Analog Devices, Inc.Inventor: Khiem Quang Nguyen
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Publication number: 20240339496Abstract: Implementations described herein relate to various semiconductor device assemblies. In some implementations, a semiconductor die includes a first main face and an opposing second main face, the first main face and the second main face being spaced apart from one another in a direction. The semiconductor die may include a plurality of side faces disposed substantially perpendicular to the first main face and the second main face, the plurality of side faces extending between the first main face and the second main face in the direction. The semiconductor die may include one of a first rounded edge or a first chamfered edge, the one of the first rounded edge or the first chamfered edge connecting at least one side face, of the plurality of side faces, to the first main face.Type: ApplicationFiled: April 2, 2024Publication date: October 10, 2024Inventors: Quang NGUYEN, Christopher GLANCEY, Koustav SINHA
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Patent number: 12097480Abstract: A composition is provided for removal of a target substance from a fluid stream. The composition may be used to remove polyfluorinated alkyl substances (PFAS) from water. The composition comprises a support material comprising an alumina; and a sorbent molecule that comprises a core polymer; wherein the core polymer is covalently linked to the support material; and wherein the sorbent molecule further comprises one or more covalently linked sorbent groups. Processes for removal of target substances such as PFAS are also provided.Type: GrantFiled: March 21, 2023Date of Patent: September 24, 2024Assignee: PURAFFINITY LTDInventors: Octavia Ann Blackburn, Khai Duong Quang Nguyen, Liberty Jocasta Rockey, Aiden Sinan McGuirk, Alex Michael James, Nathan Clemence, Simon Paul Foxon
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Patent number: 12091547Abstract: The present invention provides a tin-free, room temperature curable silicone elastomer composition, wherein the uncured composition is a putty. The silicone elastomer composition comprises a) an end-capped base polymer, wherein the base polymer comprises a polysiloxane or mixture of polysiloxanes, and wherein the end-capped base polymer comprises terminal di-(C1-4)alkoxy silyl groups; b) at least one amorphous filler; c) 15.1 to 60 parts by weight of at least one spherical filler for each 100 parts by weight of base polymer; and d) a curing catalyst consisting of one or more selected from the group consisting of organic titanates and organic zirconates. The terminal dialkoxy silyl groups of the base polymer can be dimethoxy silyl groups. The at least one amorphous filler can be selected from the group consisting of fumed silica, fumed alumina, carbon black, precipitated silica, precipitated calcium carbonate, surface-treated calcium carbonate and mixtures thereof.Type: GrantFiled: November 19, 2021Date of Patent: September 17, 2024Assignee: tesa SEInventors: Tobias Winkler, Christof-Gottfried Hoelger, Paraskevi Christogianni, Thomas Dowden, Priti Ariscrisna, Elliot Allen, Mark Buckingham, Reya Shamsah, Anna Blades, Alice Dowden, Khai Duong Quang Nguyen, Julien Gautrot