Abstract: Provided in the present application are a chip packaging structure and a preparation method therefor. The chip packaging structure comprises a substrate, a chip, an insulating layer, a capacitor structure and a packaging layer. According to the chip packaging structure and the packaging method therefor provided in the present application, a capacitor structure is packaged on a surface and a lateral wall of a chip, such that the capacitor structure is applied in packaging, thereby improving the level of integration of the chip. In the present application, a first electrode layer, a second electrode layer and a capacitive dielectric layer all extend along a surface on a side of a chip facing away from a substrate and along a lateral wall of the chip. Therefore, a larger relative area of the first electrode layer and the second electrode layer can be obtained, which can improve the capacity of a capacitor.

Abstract: An abrasive water jet nozzle for strengthening, including a chamber, providing a mixing space; and a strengthening mixing assembly, providing a strengthening mixing of water with an abrasive entering the chamber, wherein the strengthening mixing assembly includes a fluid passage and a water stopper block, wherein the water stopper block is located at an eccentric position on one side of the chamber, and an outlet of the fluid passage faces the water stopper block. The provided abrasive water jet nozzle is capable of fully mixing high speed water with the abrasive particles after the high speed water entering the mixing chamber, so as to ensure the uniformity of the strengthening effect, and the formed abrasive water jet is a large circular fan-shaped jet, which can greatly improve the strengthening quality of the abrasive water jet.