Patents by Inventor Quanming Li

Quanming Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250227882
    Abstract: A heat dissipation system and a power device. The heat dissipation system may include a power module and a condenser. The power module may include a base and a power component, the base has a first chamber, and the first chamber is filled with a refrigerant. The power component is disposed on a first surface of the base, and the power component is in thermally conductive contact with the first surface. Heat generated by the power component may be transferred from the first surface to the first chamber, and is further conducted to the refrigerant, and the refrigerant may be heated and vaporized into vapor. In addition, the condenser communicates with the first chamber, and the vaporized refrigerant may enter the condenser. The refrigerant condensed into a liquid state by the condenser may flow back to the first chamber.
    Type: Application
    Filed: March 26, 2025
    Publication date: July 10, 2025
    Applicant: Huawei Digital Power Technologies Co., Ltd.
    Inventors: Jiyang LI, Guohua FAN, Zhiling LIU, Quanming LI
  • Publication number: 20250227899
    Abstract: A heat dissipation system may include a power module, an evaporator, and a condenser. The power module includes a thermally conductive substrate and a power component, and the power component is fastened to a first surface of the thermally conductive substrate. The evaporator has an evaporation chamber, and the evaporation chamber is filled with a refrigerant. At least one sidewall of the evaporator is provided with a window, the thermally conductive substrate is embedded into the window, at least a part of surfaces of the thermally conductive substrate is immersed in the refrigerant, and the first surface is located on an outer side of the evaporation chamber. The condenser communicates with the evaporation chamber, and the vaporized refrigerant may enter the condenser. The refrigerant condensed into a liquid state by the condenser may flow back to the evaporation chamber.
    Type: Application
    Filed: March 27, 2025
    Publication date: July 10, 2025
    Applicant: Huawei Digital Power Technologies Co., Ltd.
    Inventors: Jiyang LI, Guohua FAN, Zhiling LIU, Quanming LI
  • Patent number: 12337674
    Abstract: A powertrain includes: a motor control unit (1) including a housing (11) and a first functional unit (12) disposed in the housing (11) and capable of generating heat during operation; and a heat exchanger (2) disposed in the housing (11), where the heat exchanger (2) includes a first circulation channel (21) for a first cooling medium to circulate and a second circulation channel (22) for a second cooling medium to circulate. The first circulation channel (21) has a first external cooling surface (P1), and the first circulation channel (21) conducts heat with the first functional unit (12) at the first external cooling surface (P1); and/or the first circulation channel (21) has a second external cooling surface (P2), and the first circulation channel (21) conducts heat with an inner surface of the housing (11) at the second external cooling surface (P2).
    Type: Grant
    Filed: October 17, 2022
    Date of Patent: June 24, 2025
    Assignee: HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
    Inventors: Hao Wu, Jun Chen, Quanming Li
  • Publication number: 20250153559
    Abstract: This disclosure provides a powertrain and a mechanical device. The powertrain includes a heat exchanger, an electronic assembly, and a motor. The electronic assembly includes a first housing, the motor includes a second housing, the first housing is fastened to the second housing, and the heat exchanger is also fastened to the first housing, so that both the heat exchanger and the electronic assembly and both the electronic assembly and the motor are fastened as a whole. The electronic assembly includes an electronic component, and the electronic component is disposed in an accommodation cavity of the first housing. The heat exchanger includes a first flow channel, and the first flow channel is configured to transmit a cooling working medium. This embodiment can improve integration of the powertrain and heat dissipation effect of the powertrain.
    Type: Application
    Filed: January 16, 2025
    Publication date: May 15, 2025
    Applicant: Huawei Digital Power Technologies Co., Ltd.
    Inventors: Shaobo Yang, Quanming Li, Heng Wang
  • Patent number: 12272808
    Abstract: A temperature control apparatus and a temperature control system include at least one liquid storage device for storing liquid, at least two liquid supply devices, and a controller. Each liquid supply device is connected to the at least one liquid storage device through a first multiport valve to obtain liquid and is connected to a temperature regulating device through a second multiport valve. The controller is configured to control the first multiport valve and the second multiport valve that are connected to the controller to be conducted or not to be conducted. When the first multiport valve and the second multiport valve are conducted, each liquid supply device outputs the obtained liquid to the temperature regulating device. The temperature regulating device regulates a temperature of the liquid injected by each liquid storage device, and then supplies the liquid to at least one battery system.
    Type: Grant
    Filed: April 26, 2022
    Date of Patent: April 8, 2025
    Assignee: Huawei Digital Power Technologies Co., Ltd.
    Inventors: Hao Meng, Quanming Li
  • Patent number: 12263758
    Abstract: Embodiments of this application disclose a vehicle thermal management system and method. The system includes a refrigeration cycle system, a coolant cycle system, and a control device, where the coolant cycle system includes a coolant cycle frontend radiator, a power assembly heat dissipation system, a battery pack heat dissipation system, a primary path water pump, a bypass water pump, and a valve bank system. In the system, the refrigeration cycle system is connected to the primary path water pump. Furthermore, in the system, the power assembly heat dissipation system and the battery pack heat dissipation system share the refrigeration cycle system and the coolant cycle frontend radiator by using the primary path water pump, the bypass water pump, and a combination of the valve bank system.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: April 1, 2025
    Assignee: HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
    Inventors: Quanming Li, Jun Chen, Chaopeng Liu
  • Publication number: 20250060043
    Abstract: A multi-port valve includes a valve body and a valve core, the valve core is located in an accommodation cavity of the valve body and is rotatably coupled to the valve body, and a rotation center line of the valve core is an axis line. A first interface and a second interface that couple with each other through the accommodation cavity are disposed on the valve body, and the first interface and the second interface are distributed on two opposite sides of the axis line. The valve core includes a first port, a second port, and a first channel that communicates the first port with the second port, the first channel penetrates the valve core, a part of the axis line is located in the first channel, the first port can communicate with the first interface, and the second port can communicate with the second interface.
    Type: Application
    Filed: August 13, 2024
    Publication date: February 20, 2025
    Inventors: Ming Fung Wong, Quanming Li, Lin Du, Linfeng Lu
  • Publication number: 20250058601
    Abstract: A thermal management integrated module includes a water-side component, a refrigerant component, and a heat exchanger. The water-side component and the refrigerant component are respectively located on two opposite sides of the heat exchanger. The water-side component includes a water path substrate. A plumbing of the water path substrate is configured to accommodate a first medium. The refrigerant component includes a refrigerant substrate. A plumbing of the refrigerant substrate is configured to accommodate a second medium. The heat exchanger is located in a gap space formed by the water path substrate and the refrigerant substrate. Both the plumbing of the water path substrate and the plumbing of the refrigerant substrate communicate with a plumbing of the heat exchanger. The water-side component has a first external connection port. The first external connection port is configured to connect to a water tank in the thermal management system through a coolant hose.
    Type: Application
    Filed: August 14, 2024
    Publication date: February 20, 2025
    Applicant: Huawei Digital Power Technologies Co., Ltd.
    Inventors: Linfeng LU, Quanming LI, Ming Fung WONG
  • Patent number: 12134303
    Abstract: A temperature control system includes: a first cooling circuit, where a first cooling medium is circulated in the first cooling circuit, and the first cooling circuit is configured to cool a first structural unit; a second cooling circuit, where a second cooling medium is circulated in the second cooling circuit, and the second cooling circuit is configured to cool a second structural unit; and a heat exchanger, separately connected to the first cooling circuit and the second cooling circuit, and configured to perform heat exchange between the first cooling medium and the second cooling medium, where the first cooling circuit includes a bypass branch, and the bypass branch is connected in parallel to the heat exchanger. According to the temperature control system, heat dissipation efficiency for an inverter and an overall heat dissipation capability for a powertrain are improved.
    Type: Grant
    Filed: September 27, 2022
    Date of Patent: November 5, 2024
    Assignee: Huawei Digital Power Technologies Co., Ltd.
    Inventors: Jiangang Wang, Shaobo Yang, Jun Chen, Quanming Li
  • Publication number: 20240300300
    Abstract: The technology of this application relates to a heat exchange system. The heat exchange system includes a multi-way valve, an air duct, and at least one heat exchanger disposed in the air duct. The heat exchange is provided with an air channel through which air passes, a water inlet and a water outlet of the at least one heat exchanger communicate with the multi-way valve through a water pipe group, a refrigerant inlet of the at least one heat exchanger communicates with a refrigerant outlet of the at least one heat exchanger through a refrigerant pipe group, and an electronic expansion valve is disposed on the refrigerant pipe group. The multi-way valve is further configured to communicate with a heat exchange unit, and when heat exchange is performed on the heat exchange unit, the multi-way valve makes the heat exchange unit, the multi-way valve, the water pipe group, and the heat exchanger be in one circulation loop.
    Type: Application
    Filed: May 16, 2024
    Publication date: September 12, 2024
    Inventors: Zhi YUAN, Haipeng LI, Chaopeng LIU, Quanming LI
  • Publication number: 20240300292
    Abstract: A heat exchanger is provided. The heat exchanger includes a first flow collector including a first chamber and a second chamber, a second flow collector, and a heat exchange core. The first and second chambers have first and second flow distribution openings respectively. The second flow collector includes a third chamber and a fourth chamber. The third and the fourth chambers have third and fourth flow distribution openings respectively. The heat exchange core includes heat exchange units, which are disposed between the first and second flow collector. The heat exchange unit includes a fin and a flow guiding member. The flow guiding member forms a first and a second flow channel. Two ends of the first flow channel are respectively connected to the first and the third flow distribution opening. Two ends of the second flow channel are respectively connected to the second and the fourth flow distribution opening.
    Type: Application
    Filed: May 16, 2024
    Publication date: September 12, 2024
    Inventors: Zhi YUAN, Quanming LI, Haipeng LI
  • Patent number: 12046912
    Abstract: Embodiments of this application provide a wireless charger, and relate to the field of charging device technologies. The wireless charger includes a wireless charging module, a first fan, a housing including a contact plate used for contact with the rear surface of the terminal device, and an air intake vent disposed at a position that is of the housing and that is close to the first fan, and an airflow guide structure disposed on a side that is of the housing and that is adjacent to the contact plate. The airflow guide structure extends toward the display surface of the terminal device.
    Type: Grant
    Filed: September 19, 2022
    Date of Patent: July 23, 2024
    Inventors: Hao Wu, Quanming Li, Jun Chen, Li He
  • Patent number: 11963336
    Abstract: This application provides a film-like heat dissipation member, a bendable display apparatus, and a terminal device. The film-like heat dissipation member includes a heat dissipation layer. Composition and a structure of the heat dissipation layer are designed, so that a cutting-plane length of the heat dissipation layer changes in a surface bending process, can be bent repeatedly, and can implement uniform temperatures on two sides of the bendable display apparatus and the terminal device, thereby improving heat dissipation capabilities of the bendable display apparatus and the terminal device.
    Type: Grant
    Filed: July 7, 2022
    Date of Patent: April 16, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Huipeng Wu, Quanming Li, Guo Yang
  • Patent number: 11901775
    Abstract: A rotor includes a rotor iron core, a rotor shaft, and a fastening plate. The rotor iron core includes a first and a second end, and extends along an axial direction. The first fastening plate is fastened to at least the first or second end, and includes a through hole and a first runner. An inlet of the first runner communicates with the through hole. An outlet of the first runner is on a surface of a side of the fastening plate. The rotor shaft includes a second runner and a third runner in the rotor shaft. An inlet of the second runner is at one end of the at least one end of the rotor shaft. An outlet of the second runner communicates with an inlet of the third runner. An outlet of the third runner communicates with the inlet of the first runner.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: February 13, 2024
    Assignee: HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
    Inventors: Jiangang Wang, Quanming Li, Tingyu Xie
  • Patent number: 11839055
    Abstract: A heat-conducting assembly includes a middle frame and a heat-conducting structure. The middle frame is plate-shaped, having a first side surface and a second side surface that are opposite to each other, and being provided with a first through hole through which the first side surface communicates with the second side surface. The heat-conducting structure includes a heat dissipation part and a conducting part. The heat dissipation part is fastened to the second side surface, and the conducting part extends into the first through hole. The conducting part includes a conductor being connected to the heat dissipation part and a heat insulator which is fastened in the first through hole through the heat insulator, and is in contact with a heat source, which is close to one end that is of the first through hole and that is located on the first side surface.
    Type: Grant
    Filed: March 1, 2022
    Date of Patent: December 5, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Yongfu Sun, Guo Yang, Quanming Li
  • Publication number: 20230328936
    Abstract: A power converter, heat exchangers, heat sinks, and a photovoltaic power generation system, related to the field of heat dissipation. The power converter includes: a power semiconductor device, a magnetic element, a sealed cavity, and a heat dissipation cavity. The power semiconductor device and the magnetic element are disposed in the sealed cavity. The power semiconductor device dissipates heat through a first heat sink, and cooling fins of the first heat sink are located in the heat dissipation cavity. The magnetic element dissipates heat through a second heat sink, and cooling fins of the second heat sink are located in the heat dissipation cavity, Accordingly, reliability and heat dissipation effect of heat dissipation performed by the power converter are improved.
    Type: Application
    Filed: June 16, 2023
    Publication date: October 12, 2023
    Applicant: Huawei Digital Power Technologies Co., Ltd.
    Inventors: Faming SUN, Jun CHEN, Quanming LI, Xiaowei HUI
  • Patent number: 11778772
    Abstract: Embodiments of the present invention relate to a wireless charging device. The wireless charging device includes a housing, an induction coil, a ferrite, a printed circuit board (PCB), and a fan. The housing includes a first surface and a second surface, a protrusion is disposed on the first surface, and the protrusion is configured to: support a to-be-charged device, and leave a gap between the to-be-charged device and the first surface when the to-be-charged device is installed on the wireless charging device. At least one first air guiding opening and at least one second air guiding opening are disposed on the housing. When the fan runs, the first air guiding opening, the fan, and the second air guiding opening form an air duct that passes through the ferrite and the PCB.
    Type: Grant
    Filed: July 7, 2022
    Date of Patent: October 3, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jiajia Sui, Quanming Li, Guo Yang, Shuainan Lin
  • Publication number: 20230179131
    Abstract: A temperature prediction method and apparatus are provided. The method includes: determining a loss of a motor based on information about a motor controller, where the loss of the motor includes a first loss and a second loss, and the first loss is a loss generated by a fundamental wave component of a current of the motor (S210); and determining temperature of the motor based on the loss of the motor and a temperature prediction model (S220). According to the method, precision of temperature prediction of the motor can be improved.
    Type: Application
    Filed: January 27, 2023
    Publication date: June 8, 2023
    Inventors: Jiangang Wang, Fei Zhou, Tenghui Dong, Chong Zhu, Xi Zhang, Quanming Li, Jun Chen
  • Publication number: 20230107455
    Abstract: A motor includes a rotor, the rotor includes a rotor iron core, a first end cover, and a second end cover, and the first end cover and the second end cover are respectively connected to two ends of the rotor iron core. The first end cover is provided with a liquid inlet channel, the rotor iron core is provided with a liquid flow channel, and the first end cover or the second end cover is provided with a liquid outlet channel. The liquid inlet channel connects the liquid flow channel and space outside the rotor, the liquid outlet channel connects the liquid flow channel and the space outside the rotor, and an outlet of the liquid outlet channel faces a stator winding. Solutions of the embodiments can reduce processing costs while ensuring heat dissipation reliability of the rotor of the motor.
    Type: Application
    Filed: December 9, 2022
    Publication date: April 6, 2023
    Applicant: Huawei Digital Power Technologies Co., Ltd.
    Inventors: Jianxin HUANG, Jun CHEN, Quanming LI
  • Publication number: 20230096967
    Abstract: A heat dissipation apparatus and a photovoltaic inverter are related to the field of heat dissipation device technologies, to improve a heat dissipation capability of the heat dissipation apparatus. The heat dissipation apparatus includes at least two stacked fan layers, and each fan layer includes at least one fan. A heat dissipation channel in a radiator has a first inlet, and the first inlet communicates with each air exhaust vent in at least one fan layer by using an air duct component. Compared with a solution in which fans are arranged along a width direction of the radiator, the at least two fan layers are stacked, which may not be limited by a width of the radiator. More fans can be arranged in a hierarchical stacking manner, and more fans can increase an overall amount of exhausted air, thereby improving the heat dissipation capability of the heat dissipation apparatus.
    Type: Application
    Filed: December 2, 2022
    Publication date: March 30, 2023
    Inventors: Faming SUN, Quanming LI, Jun CHEN