Patents by Inventor Quansheng Wu

Quansheng Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240075474
    Abstract: A biosensing platform for in-situ sampling and target detection based on upconversion luminescence, including: an upconversion luminescent paper-based microfluidic device, an upconversion luminescent biosensor, and a portable detection device based on smartphone imaging. The upconversion luminescent paper-based microfluidic device is configured to sample a to-be-detected substance in situ. The upconversion luminescent biosensor is configured to allow a target to specifically recognize the to-be-detected substance. The portable detection device is configured to detect a content of the to-be-detected substance. The upconversion luminescent biosensor is prepared as follows. (S1) An upconversion nanoparticle seed is prepared. (S2) Core-shell upconversion nanoparticles are prepared. (S3) Core-shell-shell upconversion nanoparticles (UCNPs) are prepared. (S4) The UCNPs is subjected to hydrophilic modification. (S5) The hydrophilically-modified UCNPs are modified with DNA.
    Type: Application
    Filed: October 31, 2023
    Publication date: March 7, 2024
    Inventors: Quansheng CHEN, Jizhong WU, Qin OUYANG, Wenya WEI, Huanhuan LI, Jingui ZHANG, Jinghao YU
  • Patent number: 7031114
    Abstract: A system and a method for bonding a slider to a suspension tongue are disclosed. A set of conductive fibers is embedded in a bonding adhesive binding the slider to the suspension tongue to improve conductivity between the slider and the suspension assembly. The bonding adhesive includes binder resin and silver powder. The slider is composed of aluminum oxide and titanium carbide. The set of conductive fibers is composed of carbon coated potassium titanic acid whisker. The set of conductive fibers range in length from 10 ?m to 20 ?m, and in diameter from 0.3 ?m to 0.6 ?m. The set of conductive fibers range in resistance from 0.01 ohm to 0.1 ohm. The set of conductive fibers is mixed with the bonding adhesive in a 1% to 4% mixing ratio.
    Type: Grant
    Filed: March 24, 2003
    Date of Patent: April 18, 2006
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Quansheng Wu, Binhua Tan, Ichiro Yagi
  • Patent number: 6947669
    Abstract: This application proposes a solution that makes access to the Optical Link State (OLS) information more efficient for use by upper level applications. Applications are independent of underlying routing protocols. This solution applies to all Link State based IGP protocols with the extension to optical networks, including OSPF and IS-IS.
    Type: Grant
    Filed: March 5, 2002
    Date of Patent: September 20, 2005
    Assignee: Meriton Networks Inc.
    Inventors: Quansheng Wu, Ling-Zhong Liu
  • Publication number: 20040070881
    Abstract: A system and a method for bonding a slider to a suspension tongue are disclosed. A set of conductive fibers is embedded in a bonding adhesive binding the slider to the suspension tongue to improve conductivity between the slider and the suspension assembly. The bonding adhesive includes binder resin and silver powder. The slider is composed of aluminum oxide and titanium carbide. The set of conductive fibers is composed of carbon coated potassium titanic acid whisker. The set of conductive fibers range in length from 10 &mgr;m to 20 &mgr;m. and in diameter from 0.3 &mgr;m to 0.6 &mgr;m. The set of conductive fibers range in resistance from 0.01 ohm to 0.1 ohm. The set of conductive fibers is mixed with the bonding adhesive in a 1% to 4% mixing ratio.
    Type: Application
    Filed: March 24, 2003
    Publication date: April 15, 2004
    Inventors: Quansheng Wu, Binhua Tan, Ichiro Yagi
  • Patent number: 6518230
    Abstract: A new solvent formulation is invented for removing cured adhesive and coating. It solves the problem that crosslink polymers only can be swelled, and a mechanical force has to be applied to remove the adhesive. The new solvent can dissolve the UV cured crosslink polymers very fast and clean the substrate meanwhile.
    Type: Grant
    Filed: March 16, 2001
    Date of Patent: February 11, 2003
    Assignee: Sae Magnetics (H.K.) Ltd.
    Inventors: Quansheng Wu, Yu Fu, Zhanqiu Tian
  • Publication number: 20020171886
    Abstract: This application proposes a solution for providing fast auto-recovery of the control plane network against a control link failure in an optical communications network. The described solution applies to both protected and unprotected control channels. If a control channel is protected, the solution is triggered only when the protection control channel cannot resume the connectivity. In a control link failure situation each node in a neighboring pair attempts to find an alternate control route before informing the network manager of the link failure. If an alternate route is established, the control plane is quickly re-established without involving system resources.
    Type: Application
    Filed: March 4, 2002
    Publication date: November 21, 2002
    Inventors: Quansheng Wu, Ling-Zhong Liu
  • Publication number: 20020126344
    Abstract: This application proposes a solution that makes access to the Optical Link State (OLS) information more efficient for use by upper level applications. Applications are independent of underlying routing protocols. This solution applies to all Link State based IGP protocols with the extension to optical networks, including OSPF and IS-IS.
    Type: Application
    Filed: March 5, 2002
    Publication date: September 12, 2002
    Inventors: Quansheng Wu, Ling-Zhong Liu
  • Publication number: 20020061826
    Abstract: A new solvent formulation is invented for removing cured adhesive and coating. It solves the problem that crosslink polymers only can be swelled, and a mechanical force has to be applied to remove the adhesive. The new solvent can dissolve the UV cured crosslink polymers very fast and clean the substrate meanwhile.
    Type: Application
    Filed: March 16, 2001
    Publication date: May 23, 2002
    Inventors: Quansheng Wu, Yu Fu, Zhanqiu Tian