Patents by Inventor Quentin HUBERT

Quentin HUBERT has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210018458
    Abstract: Moisture that is possibly present in an integrated circuit is detected autonomously by the integrated circuit itself. An interconnect region of the integrated circuit includes a metal level with a first track and a second track which are separated by a dielectric material. A detection circuit applies a potential difference between the first and second tracks. A current circulating in one of the first and second tracks in response to the potential difference is measured and compared to a threshold. If the current exceeds the threshold, this is indicative of the presence of moisture which renders said dielectric material less insulating.
    Type: Application
    Filed: July 14, 2020
    Publication date: January 21, 2021
    Applicant: STMicroelectronics (Rousset) SAS
    Inventors: Matthias VIDAL-DHO, Quentin HUBERT, Pascal FORNARA
  • Publication number: 20210005613
    Abstract: A capacitive element includes a trench extending vertically into a well from a first side. The trench is filled with a conductive central section clad with an insulating cladding. The capacitive element further includes a first conductive layer covering a first insulating layer that is located on the first side and a second conductive layer covering a second insulating layer that is located on the first conductive layer. The conductive central section and the first conductive layer are electrically connected to form a first electrode of the capacitive element. The second conductive layer and the well are electrically connected to form a second electrode of the capacitive element. The insulating cladding, the first insulating layer and the second insulating layer form a dielectric region of the capacitive element.
    Type: Application
    Filed: September 21, 2020
    Publication date: January 7, 2021
    Applicants: STMicroelectronics (Rousset) SAS, STMicroelectronics (Crolles 2) SAS
    Inventors: Abderrezak MARZAKI, Arnaud REGNIER, Stephan NIEL, Quentin HUBERT, Thomas CABOUT
  • Publication number: 20210005612
    Abstract: A capacitive element includes a trench extending vertically into a well from a first side. The trench is filled with a conductive central section clad with an insulating cladding. The capacitive element further includes a first conductive layer covering a first insulating layer that is located on the first side and a second conductive layer covering a second insulating layer that is located on the first conductive layer. The conductive central section and the first conductive layer are electrically connected to form a first electrode of the capacitive element. The second conductive layer and the well are electrically connected to form a second electrode of the capacitive element. The insulating cladding, the first insulating layer and the second insulating layer form a dielectric region of the capacitive element.
    Type: Application
    Filed: September 21, 2020
    Publication date: January 7, 2021
    Applicants: STMicroelectronics (Rousset) SAS, STMicroelectronics (Crolles 2) SAS
    Inventors: Abderrezak MARZAKI, Arnaud REGNIER, Stephan NIEL, Quentin HUBERT, Thomas CABOUT
  • Patent number: 10818669
    Abstract: A capacitive element includes a trench extending vertically into a well from a first side. The trench is filled with a conductive central section clad with an insulating cladding. The capacitive element further includes a first conductive layer covering a first insulating layer that is located on the first side and a second conductive layer covering a second insulating layer that is located on the first conductive layer. The conductive central section and the first conductive layer are electrically connected to form a first electrode of the capacitive element. The second conductive layer and the well are electrically connected to form a second electrode of the capacitive element. The insulating cladding, the first insulating layer and the second insulating layer form a dielectric region of the capacitive element.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: October 27, 2020
    Assignees: STMicroelectronics (Rousset) SAS, STMicroelectronics (Crolles 2) SAS
    Inventors: Abderrezak Marzaki, Arnaud Regnier, Stephan Niel, Quentin Hubert, Thomas Cabout
  • Patent number: 10770409
    Abstract: An integrated electronic circuit includes a semiconductor substrate with a semiconductor well that is isolated by a buried semiconductor region located under the semiconductor well. A vertical MOS transistor formed in the semiconductor well includes a source-drain region provided by the buried semiconductor region. Backside thinning of the semiconductor substrate is detected by biasing the vertical MOS transistor into an on condition to supply a current and then comparing that current to a threshold. Current less than a threshold is indicative that the semiconductor substrate has been thinned from the backside.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: September 8, 2020
    Assignee: STMicroelectronics (Rousset) SAS
    Inventors: Abderrezak Marzaki, Christian Rivero, Quentin Hubert
  • Publication number: 20190341390
    Abstract: In one embodiment, a non-volatile memory device includes a vertical state transistor disposed in a semiconductor substrate, where the vertical state transistor is configured to trap charges in a dielectric interface between a semiconductor well and a control gate. A vertical selection transistor is disposed in the semiconductor substrate. The vertical selection transistor is disposed under the state transistor, and configured to select the state transistor.
    Type: Application
    Filed: April 23, 2019
    Publication date: November 7, 2019
    Inventors: Quentin Hubert, Abderrezak Marzaki, Julien Delalleau
  • Publication number: 20190067291
    Abstract: A capacitive element includes a trench extending vertically into a well from a first side. The trench is filled with a conductive central section clad with an insulating cladding. The capacitive element further includes a first conductive layer covering a first insulating layer that is located on the first side and a second conductive layer covering a second insulating layer that is located on the first conductive layer. The conductive central section and the first conductive layer are electrically connected to form a first electrode of the capacitive element. The second conductive layer and the well are electrically connected to form a second electrode of the capacitive element. The insulating cladding, the first insulating layer and the second insulating layer form a dielectric region of the capacitive element.
    Type: Application
    Filed: August 24, 2018
    Publication date: February 28, 2019
    Applicants: STMicroelectronics (Rousset) SAS, STMicroelectronics (Crolles 2) SAS
    Inventors: Abderrezak MARZAKI, Arnaud REGNIER, Stephan NIEL, Quentin HUBERT, Thomas CABOUT
  • Publication number: 20190043814
    Abstract: An integrated electronic circuit includes a semiconductor substrate with a semiconductor well that is isolated by a buried semiconductor region located under the semiconductor well. A vertical MOS transistor formed in the semiconductor well includes a source-drain region provided by the buried semiconductor region. Backside thinning of the semiconductor substrate is detected by biasing the vertical MOS transistor into an on condition to supply a current and then comparing that current to a threshold. Current less than a threshold is indicative that the semiconductor substrate has been thinned from the backside.
    Type: Application
    Filed: August 1, 2018
    Publication date: February 7, 2019
    Applicant: STMicroelectronics (Rousset) SAS
    Inventors: Abderrezak MARZAKI, Christian RIVERO, Quentin HUBERT
  • Patent number: 9472271
    Abstract: A method for pre-programming a matrix of phase-change memory cells, including a phase-change material positioned between two conducting electrodes and able to be reversely electrically modified so as to vary the resistivity of the memory cell. A dielectric layer is provided with the memory cell having an original resistive state at the end of the memory cell production process. A pre-programming of the matrix is executed prior to mounting a component containing the matrix on a support. A breakdown voltage is applied to a selection of memory cells so that, for each one of the selected cells, the layer of the dielectric material breaks down to bring the cell from the original resistive state to a second resistive state.
    Type: Grant
    Filed: February 7, 2014
    Date of Patent: October 18, 2016
    Assignees: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, Institut Polytechnique de Grenoble
    Inventors: Quentin Hubert, Carine Jahan
  • Publication number: 20140233307
    Abstract: A method for pre-programming a matrix of phase-change memory cells, including a phase-change material positioned between two conducting electrodes and able to be reversely electrically modified so as to vary the resistivity of the memory cell. A dielectric layer is provided with the memory cell having an original resistive state at the end of the memory cell production process. A pre-programming of the matrix is executed prior to mounting a component containing the matrix on a support. A breakdown voltage is applied to a selection of memory cells so that, for each one of the selected cells, the layer of the dielectric material breaks down to bring the cell from the original resistive state to a second resistive state.
    Type: Application
    Filed: February 7, 2014
    Publication date: August 21, 2014
    Applicants: Institut Polytechnique de Grenoble, COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT
    Inventors: Quentin HUBERT, Carine JAHAN