Patents by Inventor Quentin Lewis Hibben

Quentin Lewis Hibben has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low temperature curable adhesive compositions
    Patent number: 9416300
    Abstract: The present disclosure is concerned with improved curable adhesive compositions for anchoring elements in a structural body that exhibit low temperature versus standard temperature degree of cures that are at least 50% or higher. The compositions include, in a first portion, a reactive resin, an acetoacetoxy functional monomer and a silane monomer. By using phthalate-free constituents in the formulation, a further 10% increase in strength and durability of the resins at standard temperatures may be realized after curing at low temperatures. Improvements in the adhesive compositions that relate to increased shelf life are also presented.
    Type: Grant
    Filed: October 7, 2014
    Date of Patent: August 16, 2016
    Assignee: Simpson Strong-Tie Company, Inc.
    Inventor: Quentin Lewis Hibben
  • Low Temperature Curable Adhesive Compositions
    Publication number: 20150020965
    Abstract: The present disclosure is concerned with improved curable adhesive compositions for anchoring elements in a structural body that exhibit low temperature versus standard temperature degree of cures that are at least 50% or higher. The compositions include, in a first portion, a reactive resin, an acetoacetoxy functional monomer and a silane monomer. By using phthalate-free constituents in the formulation, a further 10% increase in strength and durability of the resins at standard temperatures may be realized after curing at low temperatures. Improvements in the adhesive compositions that relate to increased shelf life are also presented.
    Type: Application
    Filed: October 7, 2014
    Publication date: January 22, 2015
    Applicant: Simpson Strong-Tie Company. Inc.
    Inventor: Quentin Lewis Hibben
  • Low temperature curable adhesive compositions
    Patent number: 8552119
    Abstract: The present invention is concerned with curable adhesive compositions for anchoring elements in a structural body that exhibit low temperature versus standard temperature degree of cures that are at least 50% or higher. The compositions include, in a first component, a reactive resin, an acetoacetoxy functional monomer and a silane monomer. By using phthalate-free constituents in the formulation, a further 10% increase in strength and durability of the resins at standard temperatures may be realized after curing at low temperatures.
    Type: Grant
    Filed: December 17, 2012
    Date of Patent: October 8, 2013
    Assignee: Simpson Strong-Tie Company, Inc.
    Inventor: Quentin Lewis Hibben
  • LOW TEMPERATURE CURABLE ADHESIVE COMPOSITIONS
    Publication number: 20130172486
    Abstract: The present invention is concerned with curable adhesive compositions for anchoring elements in a structural body that exhibit low temperature versus standard temperature degree of cures that are at least 50% or higher. The compositions include, in a first component, a reactive resin, an acetoacetoxy functional monomer and a silane monomer.
    Type: Application
    Filed: December 17, 2012
    Publication date: July 4, 2013
    Applicant: Simpson Strong-Tie Company, Inc.
    Inventor: Quentin Lewis Hibben
  • Low temperature curable adhesive compositions
    Patent number: 8334346
    Abstract: The present invention is concerned with curable adhesive compositions for anchoring elements in a structural body that exhibit low temperature versus standard temperature degree of cures that are at least 50% or higher. The compositions include, in a first component, a reactive resin, an acetoacetoxy functional monomer and a silane monomer. By using phthalate-free constituents in the formulation, a further 10% increase in strength and durability of the resins at standard temperatures may be realized after curing at low temperatures.
    Type: Grant
    Filed: January 16, 2011
    Date of Patent: December 18, 2012
    Inventor: Quentin Lewis Hibben
  • Low Temperature Curable Adhesive Compositions
    Publication number: 20120184681
    Abstract: The present invention is concerned with curable adhesive compositions for anchoring elements in a structural body that exhibit low temperature versus standard temperature degree of cures that are at least 50% or higher. The compositions include, in a first component, a reactive resin, an acetoacetoxy functional monomer and a silane monomer. By using phthalate-free constituents in the formulation, a further 10% increase in strength and durability of the resins at standard temperatures may be realized after curing at low temperatures.
    Type: Application
    Filed: January 16, 2011
    Publication date: July 19, 2012
    Applicant: Simpson Strong-Tie Company, Inc.
    Inventor: Quentin Lewis Hibben