Patents by Inventor Quihong Zou

Quihong Zou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging structure and method for fabricating the same
    Patent number: 7755155
    Abstract: The present invention provides a packaging structure and a method for fabricating the same, the packaging structure includes a chip, a compatible pad provided on the chip, an intermediate metal layer electrically connecting with the compatible pad, a solder bump, and a redistribution metal layer electrically connecting with the solder bump, wherein the redistribution metal layer connects with the intermediate metal layer directly to form an electrical connection. Also, some connections between the redistribution metal layer and the intermediate metal layer are in a manner of concave shape, while other connections between the redistribution metal layer and the intermediate metal layer are in a manner of “-” shape, so that the number of the connections increases while the stability of connection is ensured.
    Type: Grant
    Filed: September 19, 2008
    Date of Patent: July 13, 2010
    Assignee: China Wafer Level CSP Ltd.
    Inventors: Guoping Yu, Zhiqi Wang, Guoqing Yu, Wei Wang, Quihong Zou