Patents by Inventor Quim Muntal Diaz
Quim Muntal Diaz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12109761Abstract: In an example, a method may include obtaining a first measurement of a first object generated using additive manufacturing apparatus based on object model data and obtaining a second measurement of a second object generated using the additive manufacturing apparatus based on object model data to which a first geometrical compensation parameter has been applied. An effect of the first geometrical compensation parameter may be determined based on the first and second measurements and, based on the determined effect, the first geometrical compensation parameter may be evaluated.Type: GrantFiled: April 30, 2019Date of Patent: October 8, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Enrique Gurdiel Gonzalez, Manuel Freire Garcia, Quim Muntal Diaz
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Patent number: 11993022Abstract: In an example a tangible machine-readable medium stores instructions which, when executed by a processor, cause the processor to determine an object generation arrangement for additive manufacturing based on a separation distance between objects, wherein the separation distance varies based on an intended location of object generation.Type: GrantFiled: March 29, 2019Date of Patent: May 28, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Quim Muntal Diaz, Jordi Sanroma Garrit, Manuel Freire Garcia
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Patent number: 11954413Abstract: In an example, a tangible machine-readable medium stores instructions which, when executed by a processor, cause the processor to evaluate a plurality of possible object generation arrangements based on a default separation distance and an enhanced separation distance, wherein the enhanced separation distance is used to assess predefined object sub-portions.Type: GrantFiled: December 14, 2018Date of Patent: April 9, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Quim Muntal Diaz, Manuel Freire Garcia, Enrique Gurdiel Gonzalez
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Publication number: 20220288862Abstract: In an example, a method includes determining a training dataset for an inference model to evaluate spatial arrangements of objects to be generated in additive manufacturing. Determining the training dataset may include obtaining, by at least one processor, a temperature distribution for each of a plurality of spatial arrangements of objects to be generated in additive manufacturing. The method may further include obtaining, using at least one processor, an indication of thermal interaction for each spatial arrangement based on the obtained temperature distribution.Type: ApplicationFiled: October 30, 2019Publication date: September 15, 2022Inventors: Quim MUNTAL DIAZ, Jordi SANROMA GARRIT, Josep M. ASENSIO BUCHACA
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Patent number: 11348313Abstract: Examples of the present disclosure relate to a method for packing three dimensional (3D) models. The method comprises identifying a plurality of sections of each 3D model according to curvature profiles of the sections; associating a build material layer thickness to each section of the plurality of sections, whereby each associated build material layer thickness is one of a set of pre-established build material layer thicknesses; packing the plurality of 3D models according to each associated build material layer thickness, whereby packing comprises spatially arranging at least some 3D models in the 3D virtual build volume according to one or more criteria, such that at least some of the sections of different 3D models associated to a same build material layer thickness are arranged in a same region of the 3D virtual build volume.Type: GrantFiled: March 27, 2019Date of Patent: May 31, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Jordi Roca Vila, Sergio Gonzalez Martin, Quim Muntal Diaz
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Publication number: 20220075347Abstract: An example method includes acquiring, by at least one processor, (i) an indication of measured dimensions of objects generated in a common additive manufacturing build operation, wherein the objects include at least one instance of a first object generated based on first object model data and at least one instance of a second object based on second object model data; and (ii) an indication of the orientation of the measured dimensions. Vector components for each of the measured dimensions may be determined based on the indication of the orientation. A first geometrical compensation for use in modifying the first object model data may be determined based on the measured dimensions and the vector components relating to the first object and a second geometrical compensation for use in modifying the second object model data may be determined based on the measured dimensions and the vector components relating to the second object.Type: ApplicationFiled: April 30, 2019Publication date: March 10, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Enrique Gurdiel Gonzalez, Jordi Sanroma Garrit, Quim Muntal Diaz
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Publication number: 20220016845Abstract: In an example, a method may include obtaining a first measurement of a first object generated using additive manufacturing apparatus based on object model data and obtaining a second measurement of a second object generated using the additive manufacturing apparatus based on object model data to which a first geometrical compensation parameter has been applied. An effect of the first geometrical compensation parameter may be determined based on the first and second measurements and, based on the determined effect, the first geometrical compensation parameter may be evaluated.Type: ApplicationFiled: April 30, 2019Publication date: January 20, 2022Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Enrique Gurdiel Gonzalez, Manuel Freire Garcia, Quim Muntal Diaz
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Publication number: 20220009171Abstract: In an example a tangible machine-readable medium stores instructions which, when executed by a processor, cause the processor to determine an object generation arrangement for additive manufacturing based on a separation distance between objects, wherein the separation distance varies based on an intended location of object generation.Type: ApplicationFiled: March 29, 2019Publication date: January 13, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Quim Muntal Diaz, Jordi Sanroma Garrit, Manuel Freire Garcla
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Publication number: 20220012944Abstract: Examples of the present disclosure relate to a method for packing three dimensional (3D) models. The method comprises identifying a plurality of sections of each 3D model according to curvature profiles of the sections; associating a build material layer thickness to each section of the plurality of sections, whereby each associated build material layer thickness is one of a set of pre-established build material layer thicknesses; packing the plurality of 3D models according to each associated build material layer thickness, whereby packing comprises spatially arranging at least some 3D models in the 3D virtual build volume according to one or more criteria, such that at least some of the sections of different 3D models associated to a same build material layer thickness are arranged in a same region of the 3D virtual build volume.Type: ApplicationFiled: March 27, 2019Publication date: January 13, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Jordi Roca Vila, Sergio Gonzalez Martin, Quim Muntal Diaz
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Publication number: 20210294941Abstract: In an example, a tangible machine-readable medium stores instructions which, when executed by a processor, cause the processor to evaluate a plurality of possible object generation arrangements based on a default separation distance and an enhanced separation distance, wherein the enhanced separation distance is used to assess predefined object sub-portions.Type: ApplicationFiled: December 14, 2018Publication date: September 23, 2021Applicant: Hewlett-Packard Development Company, L.P.Inventors: Quim Muntal Diaz, Manuel Freire Garcia, Enrique Gurdiel Gonzalez