Patents by Inventor Quing YU

Quing YU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10871331
    Abstract: A cooling device and a motor are provided. The cooling device that cools a heating element is provided with: a cooling chamber for cooling the heating element with a first cooling medium; a radiator chamber for releasing the heat of the first cooling medium to the outside; and a first connection path and a second connection path for connecting the cooling chamber and the radiator chamber. When part of the first cooling medium in the cooling chamber is gasified, at least part of the gasified first cooling medium moves into the first connection path, thus causing a circulation in which the first cooling medium in the cooling chamber flows into the radiator chamber via the first connection path, and the first cooling medium in the radiator chamber flows into the cooling chamber via the second connection path.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: December 22, 2020
    Assignees: NIDEC CORPORATION, NATIONAL UNIVERSITY CORPORATION YOKOHAMA NATIONAL UNIVERSITY
    Inventors: Quing Yu, Tatsuya Noda, Shunichi Tanaka, Yoshinobu Nakamura, Masato Nakanishi
  • Publication number: 20180231325
    Abstract: A cooling device and a motor are provided. The cooling device that cools a heating element is provided with: a cooling chamber for cooling the heating element with a first cooling medium; a radiator chamber for releasing the heat of the first cooling medium to the outside; and a first connection path and a second connection path for connecting the cooling chamber and the radiator chamber. When part of the first cooling medium in the cooling chamber is gasified, at least part of the gasified first cooling medium moves into the first connection path, thus causing a circulation in which the first cooling medium in the cooling chamber flows into the radiator chamber via the first connection path, and the first cooling medium in the radiator chamber flows into the cooling chamber via the second connection path.
    Type: Application
    Filed: July 28, 2016
    Publication date: August 16, 2018
    Applicants: NIDEC CORPORATION, National University Corporation YOKOHAMA National University
    Inventors: Quing YU, Tatsuya NODA, Shunichi TANAKA, Yoshinobu NAKAMURA, Masato NAKANISHI