Abstract: Semiconductor device packages and methods of manufacture are described. In one example, a semiconductor device package includes a flange, a frame secured to a major surface of the flange, with the frame forming an air cavity bounded in part by a surface of the flange, and at least one conductive lead that extends from outside the frame, through a portion of the frame, and is exposed within the air cavity for wire bonding. Other packages without air cavities are also described. The flange can incorporate a composite core material including diamond particles distributed in metal. The flange offers improved thermal conductivity, for greater heat dissipation from and additional performance of semiconductor devices within the packages. The flange exhibits thermal conductivity greater than that of Copper and other materials. The flange also exhibits a coefficient of thermal expansion suitable for bonding semiconductor die including GaN and SiC materials to the flange.

Abstract: A leadframe and air cavity packages formed using the leadframe are described. Using the leadframe, several air cavity packages can be quickly formed at one time. A method of manufacture using the leadframe can include forming the leadframe from a strip conductive material, where the leadframe includes conductive leads and downset facets. The method can also include forming slugs from conductive material, and arranging the slugs into respective positions relative to the downset facets of the leadframe. The method can also include fastening the slugs to the leadframe using the downset facets, and forming plastic packages around the leadframe and the slugs, where each of the plastic packages includes an air cavity in which at least a portion of a respective one of the slugs and at least a portion of a respective one of the conductive leads is exposed.

Abstract: A leadframe and air cavity packages formed using the leadframe are described. Using the leadframe, several air cavity packages can be quickly formed at one time. A method of manufacture using the leadframe can include forming the leadframe from a strip conductive material, where the leadframe includes conductive leads and downset facets. The method can also include forming slugs from conductive material, and arranging the slugs into respective positions relative to the downset facets of the leadframe. The method can also include fastening the slugs to the leadframe using the downset facets, and forming plastic packages around the leadframe and the slugs, where each of the plastic packages includes an air cavity in which at least a portion of a respective one of the slugs and at least a portion of a respective one of the conductive leads is exposed.

Abstract: A leadframe and air cavity packages formed using the leadframe are described. Using the leadframe, several air cavity packages can be quickly formed at one time. Further, electrical components can be placed within and interconnected with the air cavity packages easily by repositioning several devices at a time using the leadframe. After assembly, the air cavity packages can be separated from the leadframe. The air cavity packages can include a slug, a plastic frame that surrounds the slug and forms an air cavity, and a cover that encloses the air cavity. The air cavity package further includes one or more conductive leads of the leadframe that extend through the plastic frame and are exposed within the air cavity. The conductive leads can be relied upon to bond out components secured within the air cavity. Finally, the cover can be secured to enclose the air cavity.

Abstract: A leadframe and air cavity packages formed using the leadframe are described. Using the leadframe, several air cavity packages can be quickly formed at one time. Further, electrical components can be placed within and interconnected with the air cavity packages easily by repositioning several devices at a time using the leadframe. After assembly, the air cavity packages can be separated from the leadframe. The air cavity packages can include a slug, a plastic frame that surrounds the slug and forms an air cavity, and a cover that encloses the air cavity. The air cavity package further includes one or more conductive leads of the leadframe that extend through the plastic frame and are exposed within the air cavity. The conductive leads can be relied upon to bond out components secured within the air cavity. Finally, the cover can be secured to enclose the air cavity.