Patents by Inventor Quinwei Wu

Quinwei Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Anode impedance control through electrolyte flow control
    Patent number: 6855235
    Abstract: Embodiments of the invention generally provide an electrochemical plating cell having an electrolyte container assembly configured to hold a plating solution therein, a head assembly positioned above the electrolyte container, the head assembly being configured to support a substrate during an electrochemical plating process, and an anode assembly positioned in a lower portion of the electrolyte container. The anode assembly generally includes a copper member having a substantially planar upper surface, at least one groove formed into the substantially planar upper surface, each of the at least one grooves originating in a central portion of the substantially planar anode surface and terminating at a position proximate a perimeter of the substantially planar upper surface, and at least one fluid outlet positioned at a perimeter of the substantially planar upper anode surface.
    Type: Grant
    Filed: May 28, 2002
    Date of Patent: February 15, 2005
    Assignee: Applied Materials, Inc.
    Inventors: Harald Herchen, Craig Brodeur, Quinwei Wu, Peter Kimball, Vincent Burkhart