Abstract: An IOL includes an optic configured to be positioned along the optical axis of a patient's eye and a plurality of haptics extending from a periphery of the optic. Each of the plurality of haptics includes a proximal region extending from the periphery of the optic, an intermediate region extending from a distal end of the proximal region, and a distal region extending from a distal end of the intermediate region. The thickness of the distal region of each haptic is greater that the thickness of the intermediate region.

Abstract: A connection formed by a copper wire (112) alloyed with a noble metal in a first concentration bonded to a terminal pad (101) of a semiconductor chip; the end of the wire being covered with a zone (302) including an alloy of copper and the noble metal in a second concentration higher than the first concentration. When the noble metal is gold, the first concentration may range from about 0.5 to 2.0 weight %, and the second concentration from about 1.0 to 5.0 weight %. The zone of the alloy of the second concentration may have a thickness from about 20 to 50 nm.

Abstract: A metallic interconnect structure (200) for connecting a gold bump (205) and a contact pad (212), as used for example in semiconductor flip-chip assembly. A first region (207) of binary AuSn2 intermetallic is adjacent to the gold bump. A region (208) of binary AuSn4 intermetallic is adjacent to the first AuSn2 region. Then, a region (209) of binary gold-tin solid solution is adjacent to the AuSn4 region, and a second region (210) of binary AuSn2 intermetallic is adjacent to the solid solution region. The second AuSn2 region is adjacent to a nickel layer (213) (preferred thickness about 0.08 ?m), which covers the copper pad. The nickel layer insures that the gold/tin intermetallics and solutions remain substantially free of copper and thus avoid ternary compounds, providing stabilized gold bump/solder connections.

Abstract: A metallic interconnect structure (200) for connecting a gold bump (205) and a copper pad (212), as used for example in semiconductor flip-chip assembly. A first region (207) of binary AuSn2 intermetallic is adjacent to the gold bump. A region (208) of binary AuSn4 intermetallic is adjacent to the first AuSn2 region. Then, a region (209) of binary gold-tin solid solution is adjacent to the AuSn4 region, and a second region (210) of binary AuSn2 intermetallic is adjacent to the solid solution region. The second AuSn2 region is adjacent to a nickel layer (213) (preferred thickness about 0.08 ?m), which covers the copper pad. The nickel layer insures that the gold/tin intermetallics and solutions remain substantially free of copper and thus avoid ternary compounds, providing stabilized gold bump/solder connections.

Abstract: A metallic interconnect structure (200) for connecting a gold bump (205) and a copper pad (212), as used for example in semiconductor flip-chip assembly. A first region (207) of binary AuSn2 intermetallic is adjacent to the gold bump. A region (208) of binary AuSn4 intermetallic is adjacent to the first AuSn2 region. Then, a region (209) of binary gold-tin solid solution is adjacent to the AuSn4 region, and a second region (210) of binary AuSn2 intermetallic is adjacent to the solid solution region. The second AuSn2 region is adjacent to a nickel layer (213) (preferred thickness about 0.08 ?m), which covers the copper pad. The nickel layer insures that the gold/tin intermetallics and solutions remain substantially free of copper and thus avoid ternary compounds, providing stabilized gold bump/solder connections.

Abstract: A metallic interconnect structure (200) for connecting a gold bump (205) and a copper pad (212), as used for example in semiconductor flip-chip assembly. A first region (207) of binary AuSn2 intermetallic is adjacent to the gold bump. A region (208) of binary AuSn4 intermetallic is adjacent to the first AuSn2 region. Then, a region (209) of binary gold-tin solid solution is adjacent to the AuSn4 region, and a second region (210) of binary AuSn2 intermetallic is adjacent to the solid solution region. The second AuSn2 region is adjacent to a nickel layer (213) (preferred thickness about 0.08 ?m), which covers the copper pad. The nickel layer insures that the gold/tin intermetallics and solutions remain substantially free of copper and thus avoid ternary compounds, providing stabilized gold bump/solder connections.

Abstract: A metal interconnection for two workplaces such as a semiconductor chip and an insulating substrate. The first workpiece (101) has a first contact pad (201) with a gold stud (110); the second workplace (103) is covered with an insulating layer (213) and a window in the layer to a second contact pad (211). The interconnection between the second pad and the gold stud is a 278° C. eutectic structure (111) with about 80 weight percent gold and about 20 weight percent tin. The eutectic structure has a Young's modulus of 59.2 GPa and a lamellar micro-structure of the phases Au5Sn and AuSn. There is substantially no metallic tin at the second contact pad.

Abstract: A two-optic accommodative lens system. The first lens has a negative power and is located posteriorly against the posterior capsule. The periphery of the first optic contains a pair of clasps. The second optic is located anteriorly to the first optic and is of a positive power. The peripheral edge of the second optic contains a pair of locking arms that fit into the clasps contained on the periphery of the first optic to lock the second optic onto the first optic, but allow for rotation of the arms within the clasps. Hinge structures on the locking arms allow the second optic to move relative to the first optic along the optical axis of the lens system in reaction to movement of the ciliary muscle.

Abstract: A two-optic accommodative lens system. The first lens has a negative power and is located posteriorly against the posterior capsule. The periphery of the first optic contains a pair of clasps. The second optic is located anteriorly to the first optic and is of a positive power. The peripheral edge of the second optic contains a pair of locking arms that fit into the clasps contained on the periphery of the first optic to lock the second optic onto the first optic, but allow for rotation of the arms within the clasps. Hinge structures on the locking arms allow the second optic to move relative to the first optic along the optical axis of the lens system in reaction to movement of the ciliary muscle.

Abstract: A two-optic accommodative lens system. The first lens has a negative power and is located posteriorly against the posterior capsule. The periphery of the first optic contains a pair of clasps. The second optic is located anteriorly to the first optic and is of a positive power. The peripheral edge of the second optic contains a pair of locking arms that fit into the clasps contained on the periphery of the first optic to lock the second optic onto the first optic, but allow for rotation of the arms within the clasps. Hinge structures on the locking arms allow the second optic to move relative to the first optic along the optical axis of the lens system in reaction to movement of the ciliary muscle.

Abstract: A two-optic accommodative lens system. The first lens has a negative power and is located posteriorly against the posterior capsule. The periphery of the first optic contains a pair of clasps. The second optic is located anteriorly to the first optic and is of a positive power. The peripheral edge of the second optic contains a pair of locking arms that fit into the clasps contained on the periphery of the first optic to lock the second optic onto the first optic, but allow for rotation of the arms within the clasps. Hinge structures on the locking arms allow the second optic to move relative to the first optic along the optical axis of the lens system in reaction to movement of the ciliary muscle.

Abstract: A two-optic accommodative lens system. The first lens has a negative power and is located posteriorly against the posterior capsule. The periphery of the first optic contains a pair of clasps. The second optic is located anteriorly to the first optic and is of a positive power. The peripheral edge of the second optic contains a pair of locking arms that fit into the clasps contained on the periphery of the first optic to lock the second optic onto the first optic, but allow for rotation of the arms within the clasps. Hinge structures on the locking arms allow the second optic to move relative to the first optic along the optical axis of the lens system in reaction to movement of the ciliary muscle.

Abstract: A two-optic accommodative lens system. The first lens has a negative power and is located posteriorly against the posterior capsule. The periphery of the first optic contains a pair of clasps. The second optic is located anteriorly to the first optic and is of a positive power. The peripheral edge of the second optic contains a pair of locking arms that fit into the clasps contained on the periphery of the first optic to lock the second optic onto the first optic, but allow for rotation of the arms within the clasps. Hinge structures on the locking arms allow the second optic to move relative to the first optic along the optical axis of the lens system in reaction to movement of the ciliary muscle.