Patents by Inventor Qun Wang

Qun Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for through silicon via filing
    Patent number: 7776741
    Abstract: A semiconductor electroplating process deposits copper into the through silicon via hole to completely fill the through silicon via in a substantially void free is disclosed. The through silicon via may be more than about 3 micrometers in diameter and more that about 20 micrometers deep. High copper concentration and low acidity electroplating solution is used for deposition copper into the through silicon vias.
    Type: Grant
    Filed: August 18, 2008
    Date of Patent: August 17, 2010
    Assignee: Novellus Systems, Inc.
    Inventors: Jonathan D. Reid, Katie Qun Wang, Mark J. Willey
  • Process For Through Silicon Via Filling
    Publication number: 20100200412
    Abstract: A semiconductor electroplating process deposits copper into the through silicon via hole to completely fill the through silicon via in a substantially void free is disclosed. The through silicon via may be more than about 3 micrometers in diameter and more that about 20 micrometers deep. High copper concentration and low acidity electroplating solution is used for deposition copper into the through silicon vias.
    Type: Application
    Filed: April 16, 2010
    Publication date: August 12, 2010
    Inventors: Jonathan D. Reid, Katie Qun Wang, Mark J. Wiley
  • Processes for reducing beer soluble iron in diatomaceous earth products, diatomaceous earth products and compositions thereof, and methods of use
    Patent number: 7767621
    Abstract: Processes for preparing diatomaceous earth filter aids having a reduced beer soluble iron content, diatomaceous earth filter aids and compositions comprising the same, and methods for using the improved diatomaceous earth filter aids are disclosed herein. Further disclosed herein are processes for reducing beer soluble iron content by saturated steam treatment of a diatomaceous earth material in an enclosed vessel.
    Type: Grant
    Filed: August 24, 2007
    Date of Patent: August 3, 2010
    Assignee: World Minerals, Inc.
    Inventors: Qun Wang, Timothy R. Smith, Jeffrey D. Taniguchi
  • Process For Through Silicon Via Filing
    Publication number: 20100041226
    Abstract: A semiconductor electroplating process deposits copper into the through silicon via hole to completely fill the through silicon via in a substantially void free is disclosed. The through silicon via may be more than about 3 micrometers in diameter and more that about 20 micrometers deep. Low copper concentration and high acidity electroplating solution is used for deposition copper into the through silicon vias.
    Type: Application
    Filed: August 18, 2008
    Publication date: February 18, 2010
    Inventors: Jonathan D. Reid, Katie Qun Wang, Mark J. Willey
  • Processes for Reducing Beer Soluble Iron in Diatomaceous Earth Products, Diatomaceous Earth Products and Compositions Thereof, and Methods of Use
    Publication number: 20090264287
    Abstract: Processes for preparing diatomaceous earth filter aids having a reduced beer soluble iron content, diatomaceous earth filter aids and compositions comprising the same, and methods for using the improved diatomaceous earth filter aids are disclosed herein. Further disclosed herein are processes for reducing beer soluble iron content by saturated steam treatment of a diatomaceous earth material in an enclosed vessel.
    Type: Application
    Filed: August 24, 2007
    Publication date: October 22, 2009
    Applicant: World Minerals, Inc.
    Inventors: Qun Wang, Timothy R. Smith, Jeffrey D. Taniguchi
  • Biodegradable Colloidal Gels as Moldable Tissue Engineering Scaffolds
    Publication number: 20090123509
    Abstract: A colloid gel can include a plurality of positive charged particles mixed and associated with a plurality of negative charged particles so as to form a three-dimensional matrix having a plurality of pores defined by and disposed between the particles. The three-dimensional matrix can have shear thinning under shear and structure stability in the absence of shear. A method of manufacturing the colloid gel can include combining the positive charged particles with the negative charged particles, in a mold or in situ, so as to form the three-dimensional matrix having the plurality of pores.
    Type: Application
    Filed: November 5, 2008
    Publication date: May 14, 2009
    Inventors: Cory Berkland, Qun Wang
  • Computer enclosure
    Patent number: D538803
    Type: Grant
    Filed: December 27, 2005
    Date of Patent: March 20, 2007
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Yun-Lung Chen, Qun Wang
  • Computer front bezel
    Patent number: D539803
    Type: Grant
    Filed: December 27, 2005
    Date of Patent: April 3, 2007
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Yun-Lung Chen, Qun Wang, Jian-Wei Shi, Da-Long Sun
  • Computer front bezel
    Patent number: D571812
    Type: Grant
    Filed: December 29, 2006
    Date of Patent: June 24, 2008
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Yun-Lung Chen, Qun Wang
  • Computer front bezel
    Patent number: D571813
    Type: Grant
    Filed: December 29, 2006
    Date of Patent: June 24, 2008
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Yun-Lung Chen, Qun Wang
  • Computer front bezel
    Patent number: D572262
    Type: Grant
    Filed: February 9, 2007
    Date of Patent: July 1, 2008
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Yun-Lung Chen, Qun Wang
  • Digital media adapter
    Patent number: D589914
    Type: Grant
    Filed: July 9, 2008
    Date of Patent: April 7, 2009
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Qun Wang, Hong-Jin Wu, Chun-Wen Wang
  • Digital media adapter
    Patent number: D590361
    Type: Grant
    Filed: July 9, 2008
    Date of Patent: April 14, 2009
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Qun Wang, Hong-Jin Wu, Chun-Wen Wang
  • All in one computer
    Patent number: D598911
    Type: Grant
    Filed: July 9, 2008
    Date of Patent: August 25, 2009
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Qun Wang, Yun-Lung Chen, Zhen Zhang, Hong-Jin Wu
  • Car
    Patent number: D599708
    Type: Grant
    Filed: November 28, 2008
    Date of Patent: September 8, 2009
    Inventors: Shufu Li, Jian Yang, Fuquan Zhao, Xianbo Wei, Jiefeng Jia, Tongguo Chen, Qun Wang, Miu Jin
  • Computer enclosure
    Patent number: D608779
    Type: Grant
    Filed: March 27, 2009
    Date of Patent: January 26, 2010
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Yun-Lung Chen, Hong-Jin Wu, Qun Wang
  • Thin client
    Patent number: D625308
    Type: Grant
    Filed: August 3, 2009
    Date of Patent: October 12, 2010
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Yun-Lung Chen, Hong-Jin Wu, Qun Wang
  • Computer enclosure
    Patent number: D643035
    Type: Grant
    Filed: November 30, 2010
    Date of Patent: August 9, 2011
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Yun-Lung Chen, Hong-Jin Wu, Qun Wang
  • Computer enclosure
    Patent number: D644220
    Type: Grant
    Filed: November 30, 2010
    Date of Patent: August 30, 2011
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Yun-Lung Chen, Hong-Jin Wu, Qun Wang
  • Computer enclosure
    Patent number: D647087
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: October 18, 2011
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Yun-Lung Chen, Hong-Jin Wu, Qun Wang