Patents by Inventor Qunchao FENG

Qunchao FENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11966749
    Abstract: A processor includes at least one socket and at least one memory. Each socket includes a first die and a second die. The first die receives a boot-enable signal and an internal boot-enable signal to execute a boot procedure, and outputs a boot-completion signal after completing the boot procedure. The second die receives the internal boot-enable signal and the boot-completion signal from the first die to execute the boot procedure. The second die is electrically connected to the first die through a communication bus. The memory is electrically connected to the second die. When the first die executes the boot procedure, the first die accesses the memory through the communication bus and the second die.
    Type: Grant
    Filed: May 5, 2022
    Date of Patent: April 23, 2024
    Assignee: SHANGHAI ZHAOXIN SEMICONDUCTOR CO., LTD.
    Inventors: Wenting Wu, Xiaoliang Ji, Xiuli Guo, Yanliang Liu, Qunchao Feng
  • Publication number: 20230116107
    Abstract: A processor includes at least one socket and at least one memory. Each socket includes a first die and a second die. The first die receives a boot-enable signal and an internal boot-enable signal to execute a boot procedure, and outputs a boot-completion signal after completing the boot procedure. The second die receives the internal boot-enable signal and the boot-completion signal from the first die to execute the boot procedure. The second die is electrically connected to the first die through a communication bus. The memory is electrically connected to the second die. When the first die executes the boot procedure, the first die accesses the memory through the communication bus and the second die.
    Type: Application
    Filed: May 5, 2022
    Publication date: April 13, 2023
    Inventors: Wenting WU, Xiaoliang JI, Xiuli GUO, Yanliang LIU, Qunchao FENG
  • Patent number: 11216284
    Abstract: A multi-die and multi-core computing platform in which multiple dies share the same storage device for firmware code storage is shown. After a slave die loads #1 firmware code from the storage device through a bus, the right to use the bus is released by the slave die and the slave die outputs a #0 enable signal to a master die. According to the #0 enable signal, the master die gains the right to use the bus. Through the bus, the master die loads #0 firmware code from the storage device. The slave die executes the #1 firmware code and the master die executes the #0 firmware code to initialize a link between the master and slave dies.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: January 4, 2022
    Assignee: SHANGHAI ZHAOXIN SEMICONDUCTOR CO., LTD.
    Inventors: Jinglong Liu, Qunchao Feng, Yankui Niu, Yongfeng Song, Jintao Wang, Jiangbo Wang
  • Patent number: 11216282
    Abstract: A booting technology for a multi-die and multi-core computing platform is shown. A storage device stores number 1 firmware code and number 0 firmware code. A master die is coupled to the storage device through a bus and accesses the number 1 firmware code from the storage device through the bus. A first slave die is also coupled to the storage device through the bus. However, instead of accessing the storage device for the number 1 firmware code, the first slave die monitors the bus and retrieves the number 1 firmware code, accessed by the master die, from the bus. The master die further accesses the number 0 firmware code from the storage device through the bus. The master die executes the number 0 firmware code to operate the master die and the first slave die to boot the system and start up the platform.
    Type: Grant
    Filed: July 8, 2020
    Date of Patent: January 4, 2022
    Assignee: SHANGHAI ZHAOXIN SEMICONDUCTOR CO., LTD.
    Inventors: Qunchao Feng, Yankui Niu, Jinglong Liu, Yongfeng Song, Jiangbo Wang, Jintao Wang
  • Publication number: 20210109766
    Abstract: A multi-die and multi-core computing platform in which multiple dies share the same storage device for firmware code storage is shown. After a slave die loads #1 firmware code from the storage device through a bus, the right to use the bus is released by the slave die and the slave die outputs a #0 enable signal to a master die. According to the #0 enable signal, the master die gains the right to use the bus. Through the bus, the master die loads #0 firmware code from the storage device. The slave die executes the #1 firmware code and the master die executes the #0 firmware code to initialize a link between the master and slave dies.
    Type: Application
    Filed: September 29, 2020
    Publication date: April 15, 2021
    Inventors: Jinglong LIU, Qunchao FENG, Yankui NIU, Yongfeng SONG, Jintao WANG, Jiangbo WANG
  • Publication number: 20210109762
    Abstract: A booting technology for a multi-die and multi-core computing platform is shown. A storage device stores number 1 firmware code and number 0 firmware code. A master die is coupled to the storage device through a bus and accesses the number 1 firmware code from the storage device through the bus. A first slave die is also coupled to the storage device through the bus. However, instead of accessing the storage device for the number 1 firmware code, the first slave die monitors the bus and retrieves the number 1 firmware code, accessed by the master die, from the bus. The master die further accesses the number 0 firmware code from the storage device through the bus. The master die executes the number 0 firmware code to operate the master die and the first slave die to boot the system and start up the platform.
    Type: Application
    Filed: July 8, 2020
    Publication date: April 15, 2021
    Inventors: Qunchao FENG, Yankui NIU, Jinglong LIU, Yongfeng SONG, Jiangbo WANG, Jintao WANG