Abstract: A micro multi-color LED device includes two or more LED structures for emitting a range of colors. The two or more LED structures are vertically stacked to combine light from the two more LED structures. Light from the micro multi-color LED device is emitted horizontally from each of the LED structures and reflected upward via some reflective structures. In some embodiments, each LED structure is connected to a pixel driver and/or a common electrode. The LED structures are bonded together through bonding layers. In some embodiments, planarization layers enclose each of the LED structures or the micro multi-color LED device. In some embodiments, one or more of reflective layers, refractive layers, micro-lenses, spacers, and reflective cup structures are implemented in the device to improve the LED emission efficiency. A display panel comprising an array of the micro tri-color LED devices has a high resolution and a high illumination brightness.

Abstract: A micro multi-color LED device includes two or more LED structures for emitting a range of colors. The two or more LED structures are vertically stacked to combine light from the two more LED structures. In some embodiments, each LED structure is connected to a pixel driver and a shared P-electrode. The LED structures are bonded together through bonding layers. In some embodiments, reflection layers are implemented in the device to improve the LED emission efficiency. A display panel comprising an array of the micro tri-color LED devices has a high resolution and a high illumination brightness.

Abstract: A slicing micro-light emitting diode (LED) wafer includes a driver circuit substrate, a plurality of micro-LEDs formed on the driver circuit substrate, the plurality of micro-LEDs being made from a plurality of epitaxial layer slices arranged side-by-side on the driver circuit substrate, and a bonding layer, formed at bottoms of the plurality of epitaxial layer slices and on a top surface of the driver circuit substrate, for bonding the micro-LEDs and the driver circuit substrate.

Abstract: A slicing wafer includes a driver circuit substrate; a plurality of epitaxial layer slices arranged side-by-side on the driver circuit substrate; and a bonding layer, formed between the driver circuit substrate and the plurality of epitaxial layer slices.

Abstract: A slicing micro-light emitting diode (LED) wafer includes a driver circuit substrate, a plurality of micro-LEDs formed on the driver circuit substrate, the plurality of micro-LEDs being made from a plurality of epitaxial layer slices arranged side-by-side on the driver circuit substrate, and a bonding layer, formed at bottoms of the plurality of epitaxial layer slices and on a top surface of the driver circuit substrate, for bonding the micro-LEDs and the driver circuit substrate.

Abstract: A scan needle includes a substrate, a first color light emitting pixel array comprising a plurality of first color light emitting pixels formed on the substrate, a second color light emitting pixel array comprising a plurality of second color light emitting pixels formed on the substrate, and a third color light emitting pixel array comprising a plurality of third color light emitting pixels formed on the substrate.

Abstract: A micro multi-color LED device includes two or more LED structures for emitting a range of colors. The two or more LED structures are vertically stacked to combine light from the two more LED structures. In some embodiments, each LED structure is connected to a pixel driver and a shared P-electrode. The LED structures are bonded together through bonding layers. In some embodiments, reflection layers are implemented in the device to improve the LED emission efficiency. A display panel comprising an array of the micro tri-color LED devices has a high resolution and a high illumination brightness.

Abstract: A micro multi-color LED device includes two or more LED structures for emitting a range of colors. The two or more LED structures are vertically stacked to combine light from the two more LED structures. In some embodiments, each LED structure is connected to a pixel driver and a shared P-electrode. The LED structures are bonded together through bonding layers. In some embodiments, reflection layers are implemented in the device to improve the LED emission efficiency. A display panel comprising an array of the micro tri-color LED devices has a high resolution and a high illumination brightness.

Abstract: A scan needle includes a substrate, a first color light emitting pixel array comprising a plurality of first color light emitting pixels formed on the substrate, a second color light emitting pixel array comprising a plurality of second color light emitting pixels formed on the substrate, and a third color light emitting pixel array comprising a plurality of third color light emitting pixels formed on the substrate. The first color light emitting pixel array is parallel to the second color light emitting pixel array, and the second color light emitting pixel array is parallel to the third color light emitting pixel array.

Abstract: A method for fabricating a micro-light emitting diode (LED) display panel, including: forming a stack structure on a wafer substrate, the stack structure including a first metal layer, a first type of light emitting layer, a second metal layer, and a second type of light emitting layer in an order from bottom to top; forming a plurality of trenches in the stack structure, the plurality of trenches defining a plurality of micro LED display panel areas; patterning the second type of light emitting layer and the second metal layer; selectively etching the stack structure to expose a side surface of the first metal layer, thereby forming a plurality of first LEDs and a plurality of second LEDs in each micro LED display panel area; and cutting the wafer substrate to form a plurality of micro LED display panels.

Abstract: A multi-color light emitting pixel unit includes a substrate, and a light emitting transistor formed on the substrate. The light emitting transistor includes a bottom conductive layer formed on the substrate and a top conductive layer formed over the bottom conductive layer, an upper light emitting layer formed between the top conductive layer and the bottom conductive layer, at least one lower light emitting layer formed between the upper light emitting layer and the bottom conductive layer, and an electrical connector electrically connecting the at least one lower light emitting layer and the bottom conductive layer.

Abstract: A micro multi-color LED device includes two or more LED structures for emitting a range of colors. The two or more LED structures are vertically stacked to combine light from the two more LED structures vertically, and/or horizontally and reflected upward via some reflective structures. In some embodiments, each LED structure is connected to a pixel driver and/or a common electrode. The LED structures are bonded together through bonding layers. In some embodiments, planarization layers enclose each of the LED structures or the micro multi-color LED device. In some embodiments, one or more of reflective layers, refractive layers, micro-lenses, spacers, and reflective cup structures are implemented in the device to improve the LED emission efficiency. A display panel comprising an array of the micro tri-color LED devices has a high resolution and a high illumination brightness.

Abstract: A slicing wafer includes a driver circuit substrate; a plurality of epitaxial layer slices arranged side-by-side on the driver circuit substrate; and a bonding layer, formed between the driver circuit substrate and the plurality of epitaxial layer slices.

Abstract: A slicing micro-light emitting diode (LED) wafer includes a driver circuit substrate, a plurality of micro-LEDs formed on the driver circuit substrate, the plurality of micro-LEDs being made from a plurality of epitaxial layer slices arranged side-by-side on the driver circuit substrate, and a bonding layer, formed at bottoms of the plurality of epitaxial layer slices and on a top surface of the driver circuit substrate, for bonding the micro-LEDs and the driver circuit substrate.

Abstract: A multi-color light emitting pixel unit includes a substrate, and a light emitting transistor formed on the substrate. The light emitting transistor includes a bottom conductive layer formed on the substrate and a top conductive layer formed over the bottom conductive layer, an upper light emitting layer formed between the top conductive layer and the bottom conductive layer, at least one lower light emitting layer formed between the upper light emitting layer and the bottom conductive layer, and an electrical connector electrically connecting the at least one lower light emitting layer and the bottom conductive layer.

Abstract: A scan display system includes a picture receiving unit, a scan needle, a picture display screen having first and second opposing surfaces, and a driving unit. The picture receiving unit is configured to receive picture data and transmits the picture data to the scan needle. The driving unit is configured to perform a picture scanning process by moving the scan needle to scan in a horizontal direction relative to the first of the picture display screen at a predetermined frequency. The scan needle is configured to emit light, representative of the picture data, to the first surface of the picture display screen to project image lines, each image line being formed by the scan needle during the scan. The picture display screen is configured to receive the emitted light on the first surface and display an image comprising the image lines on the second surface.

Abstract: A scan display system includes a picture receiving unit, a scan needle, a picture display screen having first and second opposing surfaces, and a driving unit. The picture receiving unit is configured to receive picture data and transmit the picture data to the scan needle. The driving unit is configured to perform a picture scanning process by moving the scan needle to scan in a vertical direction relative to the first surface of the picture display screen at a predetermined frequency. The scan needle is configured to emit light, representative of the picture data, to the first surface of the picture display screen to project image lines, each image line being projected by the scan needle during the scan. The picture display screen is configured to receive the emitted light on the first surface and display an image comprising the image lines on the second surface.

Abstract: A scan display system includes a picture receiving unit, a scan needle, a picture display screen having first and second opposing surfaces, and a driving unit. The picture receiving unit is configured to receive picture data and transmit the picture data to the scan needle. The driving unit is configured to perform a picture scanning process by moving the scan needle to scan in a horizontal direction and in a vertical direction relative to the surface of the picture display screen at a predetermined frequency. The scan needle is configured to emit light, representative of the picture data, to the first surface of the picture display screen to project image portions, each image portion being formed by the scan needle during the scan. The picture display screen is configured to receive the emitted light on the first surface and display an image comprising the image portions on the second surface.

Abstract: A scan display system includes a picture receiving unit, a scan needle, a picture display screen having first and second opposing surfaces, and a driving unit. The scan needle includes a substrate, a first color light emitting pixel array comprising a plurality of first color light emitting pixels, a second color light emitting pixel array comprising a plurality of second color light emitting pixels, and a third color light emitting pixel array comprising a plurality of third color light emitting pixels. The first color light emitting pixel array is parallel to the second color light emitting pixel array, and the second color light emitting pixel array is parallel to the third color light emitting pixel array. The first color light emitting pixel array, the second color light emitting pixel array, and the third color light emitting pixel array extend in the horizontal direction.

Abstract: A scan display system includes a picture receiving unit, a scan needle, a picture display screen having first and second opposing surfaces, a projecting unit, and a driving unit. The picture receiving unit is configured to receive picture data and transmit the picture data to the scan needle. The scan needle is configured to emit light representative of the picture data. The projecting unit is configured to project the light emitted from the scan needle to the first surface of the picture display screen. The driving unit is configured to perform a picture scanning process to form a plurality of image lines. The picture display screen is configured to receive the projected light on the first surface and display an image comprising the image lines on the second surface.