Patents by Inventor Qunwei Wu

Qunwei Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7014679
    Abstract: A process for removing oxygen from a copper plating solution is provided. The solution is passed through a degasser comprising a shell and hollow hydrophobic fiber porous membranes wherein the shell while a vacuum is drawn on the surfaces of the fibers opposite the fiber surfaces contacted by the solution. Gas passed through the fiber walls while liquid is prevented from infiltrating the fiber pores. The composition of the solution is monitored so that the composition can be retained substantially constant by adding components of the solution as needed.
    Type: Grant
    Filed: January 31, 2002
    Date of Patent: March 21, 2006
    Assignee: Mykrolis Corporation
    Inventors: Bipin Parekh, Saksatha Ly, Qunwei Wu
  • Publication number: 20060036417
    Abstract: Embodiments of the present invention provide a system and method for optimizing a thermal management system. One embodiment of the present invention can include a computer program product including computer instructions that are executable to receive a set of process parameters, including fluid parameters and heat exchanger parameters, and determine a time for a dispense fluid to reach a target temperature. Additionally, the instructions can be executable to determine a set of process parameters that result in a time to reach the target temperature of below a predefined limit.
    Type: Application
    Filed: August 11, 2004
    Publication date: February 16, 2006
    Inventors: Qunwei Wu, Joseph Smith
  • Publication number: 20050283993
    Abstract: A method and apparatus for fluid processing a workpiece are described. A gas can be used to agitate a fluid to improve cleaning and/or rinsing of a workpiece surface. The gas can reduce surface tension of the fluid to promote improved contact of the fluid with a surface of the workpiece. The surface of the workpiece can be dried by flowing gas along a portion of the workpiece surface during or after draining of the fluid.
    Type: Application
    Filed: June 16, 2005
    Publication date: December 29, 2005
    Inventors: Qunwei Wu, Arthur Keigler, Zhenqiu Liu, John Harrell, Steve Bowler
  • Publication number: 20050173243
    Abstract: A device and method for increasing the mass transport rate of a chemical or electrochemical process at the solid and fluid interface in a fluid cell. The device includes a membrane in close contact with surface of the work piece, to separate the process cell into two chambers, so that fluid velocity at the work piece is controlled separately from the main cell flow. Thus the diffusion boundary layer is controlled and minimized by the rate that fluid is withdrawn from the work piece chamber.
    Type: Application
    Filed: May 2, 2003
    Publication date: August 11, 2005
    Inventors: Qunwei Wu, Craig Brodeur, John Pillion, Jieh Shyu
  • Publication number: 20050167275
    Abstract: A method and apparatus for fluid processing a workpiece are described. The system can include a process module and a system of one or more fluid processing elements to control the fluid flow and/or the electric field distribution during the fluid processing of the workpiece. A member can be used to agitate the fluid during deposition of a film (e.g., using an oscillatory motion). A plate can be used to shape an electric field incident on a surface of a workpiece. By controlling the fluid flow and the electric field distribution, improved deposition of the film on the workpiece surface can result. Furthermore, a vertical configuration and/or a modular architecture can be employed to improve throughput, increase productivity, and reduce cost.
    Type: Application
    Filed: October 22, 2004
    Publication date: August 4, 2005
    Inventors: Arthur Keigler, John Harrell, Zhenqiu Liu, Qunwei Wu
  • Publication number: 20050160977
    Abstract: A method and apparatus for retaining a workpiece against a workpiece holder are described. A flexible member can be used to provide a substantially uniform force to securely retain the workpiece, which can allow the workpiece to be consistently positioned in a process module. In one detailed embodiment, a barrier to fluid entry is formed between the workpiece and a ring for retaining the workpiece against a workpiece holder. This provides a reliable seal during fluid processing to prevent fluid from reaching the underside of a workpiece. In various embodiments, the workpiece holder can be used to align a workpiece in a process module or to hold one or more workpieces in a configuration that allows for higher throughput.
    Type: Application
    Filed: October 22, 2004
    Publication date: July 28, 2005
    Inventors: Arthur Keigler, John Harrell, Zhenqiu Liu, Qunwei Wu
  • Publication number: 20050089645
    Abstract: A method and apparatus for retaining a workpiece against a workpiece holder are described. A flexible member can be used to provide a substantially uniform force to securely retain the workpiece, which can allow the workpiece to be consistently positioned in a process module. In one detailed embodiment, a barrier to fluid entry is formed between the workpiece and a ring for retaining the workpiece against a workpiece holder. This provides a reliable seal during fluid processing to prevent fluid from reaching the underside of a workpiece. In various embodiments, the workpiece holder can be used to align a workpiece in a process module or to hold one or more workpieces in a configuration that allows for higher throughput.
    Type: Application
    Filed: October 22, 2004
    Publication date: April 28, 2005
    Inventors: Arthur Keigler, John Harrell, Zhenqiu Liu, Qunwei Wu
  • Publication number: 20040060436
    Abstract: A process for removing oxygen from a copper plating solution is provided. The solution is passed through a degasser comprising a shell and hollow hydrophobic fiber porous membranes wherein the shell while a vacuum is drawn on the surfaces of the fibers opposite the fiber surfaces contacted by the solution. Gas passed through the fiber walls while liquid is prevented from infiltrating the fiber pores. The composition of the solution is monitored so that the composition can be retained substantially constant by adding components of the solution as needed.
    Type: Application
    Filed: August 6, 2003
    Publication date: April 1, 2004
    Inventors: Bipin Parekh, Saksatha Ly, Qunwei Wu
  • Publication number: 20030221957
    Abstract: Embodiments of the invention generally provide an electrochemical plating cell having an electrolyte container assembly configured to hold a plating solution therein, a head assembly positioned above the electrolyte container, the head assembly being configured to support a substrate during an electrochemical plating process, and an anode assembly positioned in a lower portion of the electrolyte container. The anode assembly generally includes a copper member having a substantially planar upper surface, at least one groove formed into the substantially planar upper surface, each of the at least one grooves originating in a central portion of the substantially planar anode surface and terminating at a position proximate a perimeter of the substantially planar upper surface, and at least one fluid outlet positioned at a perimeter of the substantially planar upper anode surface.
    Type: Application
    Filed: May 28, 2002
    Publication date: December 4, 2003
    Applicant: APPLIED MATERIALS, INC
    Inventors: Harald Herchen, Craig Brodeur, Qunwei Wu, Peter Kimball, Vincent Burkhart