Abstract: The invention provides a B-stageable adhesive composition, based on the total weight of the adhesive composition, comprising: 13-59 wt % of an epoxy resin; 18-69 wt % of a carboxyl terminated butadiene-acrylonitrile copolymer; and 3-34 wt % of a polyterpene modified phenol-formaldehyde resin. Additionally, the B-stageable adhesive composition may further comprise a hardener, an inorganic filler including a flame retardant agent, a thermal conductive filler or the like. According to the disclosure of the application, a new B-stageable adhesive composition having a high tackiness, a high temperature resistance, a high flame resistance and a high thermal conductivity can be provided.