Abstract: In one embodiment, a matrix elimination apparatus for eliminating an acidic matrix includes: at least one column packed with a weak anion exchange resin; a source of samples, each sample having an acidic matrix; a basic solution source; a weakly acidic metal complexing reagent source, and an at least one pump, wherein the matrix elimination apparatus is configured such that the at least one pump can sequence through the acts of: a) pumping the basic solution through the column to regenerate the column, b) pumping the weakly acid metal complexing reagent through the column to activate the column; and c) pumping one of the samples through the activated column to provide a processed sample whose acidic matrix is eliminated.

Abstract: A modular exponentiator is adapted to receive a first communicated signal and derive a second signal therefrom by computation of a modular exponentiation of the form be mod n based on the first signal. The modular exponentiator divides the modular exponentiation according to the Chinese remainder theorem into first and second portions respectively having modulus values p and q of approximately half of an original modulus value n of the modular exponentiation. Each portion of the modular exponentiation is factored into respective pluralities of smaller modular exponentiations having precalculated exponent values. The respective pluralities of smaller modular exponentiations are then multiplied together to provide respective intermediate products. The intermediate products are then recombined to yield the modular exponentiation result.

Abstract: An apparatus for increasing the ozone concentration in the output of an ozone-generating system is disclosed. The invention reduces the concentration of O.sup.+ ions, which would otherwise react with ozone to form diatomic oxygen, by means of an ionic filter. In one embodiment, a gas-permeable electrode within a gas conduit attached to the output of an ozonator is negatively charged to several kilovolts with respect to the distribution line. This electrode attracts the positively charged oxygen ions, removing them before they can react with the ozone. This provides a higher ozone concentration that does not vary as much with distance from the ozone generator.

Abstract: The present invention provides an apparatus and methods for controlling gas pressure within a semiconductor process chamber. The apparatus comprises a throttle valve 32 positioned downstream of the process chamber outlet for controlling gas flow therethrough. The throttle valve includes a valve body 41 having a through-hole and a plug 44 movably disposed within the valve body for controlling gas flow through the through-hole. The throttle valve incorporates an abrasive element 86 disposed within the valve body in abrading contact with an exposed surface 89 of the plug. The abrasive element effectively removes gas deposited onto the exposed surface of the valve plug during operation of the throttle valve.

Abstract: A system for controlling pressure flow and concentration Of O.sub.3 /O.sub.2 positions a thermal MFC upstream from an ozone generator to avoid the adverse effects of ozone on the thermal MFC. A flow restrictor diverts a precise amount of flow to an ozone monitor so that the flow to a CVD chamber is precisely controlled. In other embodiments a full-flow ozone monitor and non-thermal MFC are utilized.

Abstract: A remote source of partially ionized plasma gas having ions and excited neutral atom species therein is provided. A chamber having a metallic outer shell and an inner insulative tube, is operated as a microwave resonant cavity, preferably having a diameter of about one quarter of the operating wavelength. A waveguide couples microwave energy from a source to a slot cut into the metallic outer shell of the cavity. Microwave energy passes through the inner energy transparent tube and excites reactant gases supplied from an input tube. Plasma is conducted from the cavity by a plasma output tube coupled into a processing chamber and controlled pressure pumping system.

Abstract: The present invention provides a method and apparatus for introducing gases into a processing chamber and cleaning isolated surfaces thereof. In one embodiment, the apparatus provides a gas distribution system which comprises a face plate and a blocker plate located adjacent the face plate wherein the blocker plate is electrically insulated from the face plate. An RF power source is electrically connected to the face plate and a switch that selectively connects the blocker plate to the RF power source or grounds the blocker plate. When the power source is applied to the faceplate and the blocker plate is grounded, an energy potential is formed between the face plate and the blocker plate. The energy potential is sufficient to strike a plasma from cleaning gases introduced into the gas distribution system to clean the apertures and surfaces of both the face plate and the blocker plate.