Abstract: A filament for use as a feedstock in three-dimensional printing of an optical device has a strand-like structure for continuous feeding into a printing nozzle of a three-dimensional printer. The strand-like structure includes one or more of elongated side-by-side core/cladding sections each having an optically transmissive inner core surrounded by a lower-index optically transmissive outer cladding for corresponding light guiding in the optical device. In embodiments, the core may be a solid material or an air core, and in the case of solid material may include scintillation material or other enhancements. Other variations and specifics are disclosed.

Abstract: The invention concerns a compound comprising a combination of two crystal phases. The first crystal phase corresponds to the formula: AaEbVcModPeOfHg wherein A is an alkali-metal; E is Te, Sb or Bi; and 0?a?3, 0<b?3, 0?c?3, 0<d?13, 0<e?2, 0?g?3. The second crystal phase corresponds to the formula ZgMohXiOj wherein: Z is selected among trivalent rare earths; X is selected among the elements V, Ga, Fe, Bi, Ce, Ti, Sb, Mn, Zn, Te; and 0<g?3, 0?h?3, 0?i?1. The indices f and j represent the number of oxygen atoms required for satisfying the relative valency and atomic proportions of the elements present. The invention also concerns the method for preparing said compound, and its use in particular as catalyst for oxidizing alkanes.

Abstract: The invention concerns a compound comprising a combination of two crystal phases. The first crystal phase corresponds to the formula: AaEbVcModPeOfHg wherein A is an alkali-metal; E is Te, Sb or Bi; and 0?a?3, 0<b?3, 0?c?3, 0<d?13, 0<e?2, 0?g?3. The second crystal phase corresponds to the formula ZgMohXiOj wherein: Z is selected among trivalent rare earths; X is selected among the elements V, Ga, Fe, Bi, Ce, Ti, Sb, Mn, Zn, Te; and 0<g?3, 0?h?3, 0?i?1. The indices f and j represent the number of oxygen atoms required for satisfying the relative valency and atomic proportions of the elements present. The invention also concerns the method for preparing said compound, and its use in particular as catalyst for oxidizing alkanes.

Abstract: A cost effective method is provided for assembly of hybrid optoelectronic circuits requiring flip-chip bonding of multiple active optoelectronic devices onto common substrate or optical bench platform with fine pitch and high accuracy “after-bonding” alignment to the alignment features on substrate and/or to other elements of the hybrid circuit. A Flip-Chip Bonder equipped with high precision Bonding Arm and optical and mechanical system, heated substrate chuck and heated pick-up tool may be used both for alignment and thermal bonding of active component dies to corresponding bonding pads on the common substrate using gold-tin (Au—Sn) solder disposed between die bonding pad and the corresponding substrate bonding pad.

Abstract: A cost effective method is provided for assembly of hybrid optoelectronic circuits requiring flip-chip bonding of multiple active optoelectronic devices onto common substrate or optical bench platform with fine pitch and high accuracy “after-bonding” alignment to the alignment features on substrate and/or to other elements of the hybrid circuit. A Flip-Chip Bonder equipped with high precision Bonding Arm and optical and mechanical system, heated substrate chuck and heated pick-up tool may be used both for alignment and thermal bonding of active component dies to corresponding bonding pads on the common substrate using gold-tin (Au—Sn) solder disposed between die bonding pad and the corresponding substrate bonding pad.

Abstract: A cost effective method is provided for assembly of hybrid optoelectronic circuits requiring flip-chip bonding of multiple active optoelectronic devices onto common substrate or optical bench platform with fine pitch and high accuracy “after-bonding” alignment to the alignment features on substrate and/or to other elements of the hybrid circuit. A Flip-Chip Bonder equipped with high precision Bonding Arm and optical and mechanical system, heated substrate chuck and heated pick-up tool may be used both for alignment and thermal bonding of active component dies to corresponding bonding pads on the common substrate using gold-tin (Au—Sn) solder disposed between die bonding pad and the corresponding substrate bonding pad.