Abstract: A socket assembly with liquid cooling frame for a semiconductor integrated circuit (IC) chip is provided. The socket assembly includes a liquid cooling socket frame including a metallic frame body defining an opening sized to receive the semiconductor IC chip, wherein the frame body includes one or more channels transversely positioned through the frame body and positioned in an interior of the frame body, the channels defining a fluid path. The socket assembly also includes a socket cartridge including a metallic cartridge body defining a plurality of cavities each sized to receive a test probe therein, the socket frame covering a portion of the socket cartridge and exposing the plurality of cavities at the opening.

Abstract: A test socket for an IC chip includes a retainer positioned adjacent a load board, the retainer defining a plurality of apertures corresponding to contact pads on the load board; a plurality of contacts disposed in the plurality of apertures, the plurality of contacts configured to electrically couple the IC chip to the contact pads; a housing defining a chamber in fluid communication with an inlet, a liquid outlet, and a vapor outlet. The housing includes a body structure defining a plurality of cavities corresponding to the plurality of apertures and configured to receive the plurality of contacts therein, and a guide structure configured to receive the IC chip and position the IC chip in the chamber when engaged with the plurality of contacts. The chamber receives a two phase fluid coolant via the inlet to at least partially submerges the plurality of contacts in the two phase fluid coolant.

Abstract: A test socket for an IC chip includes a retainer positioned adjacent a load board, the retainer defining a plurality of apertures corresponding to contact pads on the load board; a plurality of contacts disposed in the plurality of apertures, the plurality of contacts configured to electrically couple the IC chip to the contact pads; a housing defining a chamber in fluid communication with an inlet, a liquid outlet, and a vapor outlet. The housing includes a body structure defining a plurality of cavities corresponding to the plurality of apertures and configured to receive the plurality of contacts therein, and a guide structure configured to receive the IC chip and position the IC chip in the chamber when engaged with the plurality of contacts. The chamber receives a two phase fluid coolant via the inlet to at least partially submerges the plurality of contacts in the two phase fluid coolant.

Abstract: A socket assembly with liquid cooling frame for a semiconductor integrated circuit (IC) chip is provided. The socket assembly includes a liquid cooling socket frame including a metallic frame body defining an opening sized to receive the semiconductor IC chip, wherein the frame body includes one or more channels transversely positioned through the frame body and positioned in an interior of the frame body, the channels defining a fluid path. The socket assembly also includes a socket cartridge including a metallic cartridge body defining a plurality of cavities each sized to receive a test probe therein, the socket frame covering a portion of the socket cartridge and exposing the plurality of cavities at the opening.