Patents by Inventor R. Allen Hill

R. Allen Hill has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10790094
    Abstract: A method of forming a leadless stack comprising multiple components is provided. The method comprises forming an MLCC comprising a first capacitor external termination and a second capacitor external termination and forming an electronic element is formed comprising a first element external termination and a second element external termination. The MLCC and electronic component are are arranged in a stack with a TLPS bond between the first capacitor external termination and the first element external termination.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: September 29, 2020
    Assignee: KEMET Electronics Corporation
    Inventors: John E. McConnell, Garry L. Renner, John Bultitude, R. Allen Hill, Galen W. Miller
  • Publication number: 20190318877
    Abstract: An electronic component is described wherein the electronic component comprises a stack of electronic elements comprising a transient liquid phase sintering adhesive between and in electrical contact with each said first external termination of adjacent electronic elements
    Type: Application
    Filed: June 28, 2019
    Publication date: October 17, 2019
    Inventors: John E. McConnell, Garry L. Renner, John Bultitude, R. Allen Hill, Galen W. Miller
  • Patent number: 10381162
    Abstract: An electronic component is described wherein the electronic component comprises a stack of electronic elements comprising a transient liquid phase sintering adhesive between and in electrical contact with each said first external termination of adjacent electronic elements.
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: August 13, 2019
    Assignee: KEMET Electronics Corporation
    Inventors: John E. McConnell, Garry L. Renner, John Bultitude, R. Allen Hill, Galen W. Miller
  • Patent number: 10068708
    Abstract: A method of forming a stacked electronic component, and an electronic component formed by the method wherein the method includes: providing a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination; providing a first lead frame plate and a second lead frame plate wherein the first lead frame plate and the second lead frame plate comprises barbs and leads; providing a molded case comprising a cavity and a bottom; and forming a sandwich of electronic components in an array between the first lead frame plate and the second lead frame plate with the barbs protruding towards the electronic components and the leads extending through the bottom.
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: September 4, 2018
    Assignee: KEMET Electronics Corporation
    Inventors: Maurice Perea, R Allen Hill, Reggie Phillips
  • Patent number: 9847175
    Abstract: A method of forming a stacked electronic component, and an electronic component formed by the method wherein the method includes: providing a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination; providing a first lead frame plate and a second lead frame plate wherein the first lead frame plate and the second lead frame plate comprises barbs and leads; providing a molded case comprising a cavity and a bottom; and forming a sandwich of electronic components in an array between the first lead frame plate and the second lead frame plate with the barbs protruding towards the electronic components and the leads extending through the bottom.
    Type: Grant
    Filed: January 10, 2014
    Date of Patent: December 19, 2017
    Assignee: KEMET Electronics Corporation
    Inventors: Maurice Perea, R Allen Hill, Reggie Phillips
  • Publication number: 20170358397
    Abstract: An electronic component is described wherein the electronic component comprises a stack of electronic elements comprising a transient liquid phase sintering adhesive between and in electrical contact with each said first external termination of adjacent electronic elements
    Type: Application
    Filed: August 7, 2017
    Publication date: December 14, 2017
    Inventors: John E. McConnell, Garry L. Renner, John Bultitude, R. Allen Hill, Galen W. Miller
  • Patent number: 9799449
    Abstract: A capacitor with improved lead frame attachment is described wherein the improved lead frame attachment mitigates defects. The capacitor comprises parallel conductive internal electrodes of alternating polarity with a dielectric between the conductive internal electrodes. A first copper undercoat is in electrical contact with the conductive internal electrodes of a first polarity and a second copper undercoat is in electrical contact with conductive internal electrodes of a second polarity. A first lead is in electrical contact with the first copper undercoat with a first solder between the first lead and the first copper undercoat. A second lead is in electrical contact with the second copper undercoat with a second solder between the second lead and the second copper undercoat.
    Type: Grant
    Filed: September 26, 2014
    Date of Patent: October 24, 2017
    Assignee: KEMET Electronics Corporation
    Inventors: R. Allen Hill, Philip M. Lessner, Reggie Phillips, Keith Brown, James B. Byrd
  • Publication number: 20160141106
    Abstract: A method of forcing a stacked electronic component, and an electronic component formed by the method, therein the method includes: providing a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination; providing a first lead frame plate and a second lead frame plate wherein the first lead frame plate and the second lead frame plate comprises barbs and leads; providing a molded case comprising a cavity and a bottom; and terming a sandwich of electronic components in an array between the first lead frame plate and the second lead frame plate which the barbs protruding towards the electronic components and the leads extending through the bottom.
    Type: Application
    Filed: January 27, 2016
    Publication date: May 19, 2016
    Inventors: Maurice Perea, R Allen Hill, Reggie Phillips
  • Publication number: 20150036263
    Abstract: A capacitor with improved lead frame attachment is described wherein the improved lead frame attachment mitigates defects. The capacitor comprises parallel conductive internal electrodes of alternating polarity with a dielectric between the conductive internal electrodes. A first copper undercoat is in electrical contact with the conductive internal electrodes of a first polarity and a second copper undercoat is in electrical contact with conductive internal electrodes of a second polarity. A first lead is in electrical contact with the first copper undercoat with a first solder between the first lead and the first copper undercoat. A second lead is in electrical contact with the second copper undercoat with a second solder between the second lead and the second copper undercoat.
    Type: Application
    Filed: September 26, 2014
    Publication date: February 5, 2015
    Inventors: R. Allen Hill, Philip M. Lessner, Reggie Phillips, Keith Brown, James B. Byrd
  • Publication number: 20140123453
    Abstract: A method of forming a stacked electronic component, and an electronic component formed by the method wherein the method includes: providing a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination; providing a first lead frame plate and a second lead frame plate wherein the first lead frame plate and the second lead frame plate comprises barbs and leads; providing a molded case comprising a cavity and a bottom; and forming a sandwich of electronic components in an array between the first lead frame plate and the second lead frame plate with the barbs protruding towards the electronic components and the leads extending through the bottom.
    Type: Application
    Filed: January 10, 2014
    Publication date: May 8, 2014
    Applicant: Kemet Electronics Corporation
    Inventors: Maurice Perea, R. Allen Hill, Reggie Phillips
  • Publication number: 20130107419
    Abstract: A capacitor with improved lead frame attachment is described wherein the improved lead frame attachment mitigates defects. The capacitor comprises parallel conductive internal electrodes of alternating polarity with a dielectric between the conductive internal electrodes. A first copper undercoat is in electrical contact with the conductive internal electrodes of a first polarity and a second copper undercoat is in electrical contact with conductive internal electrodes of a second polarity. A first lead is in electrical contact with the first copper undercoat with a first solder between the first lead and the first copper undercoat. A second lead is in electrical contact with the second copper undercoat with a second solder between the second lead and the second copper undercoat.
    Type: Application
    Filed: October 28, 2011
    Publication date: May 2, 2013
    Applicant: KEMET ELECTRONICS CORPORATION
    Inventors: R. Allen Hill, Philip M. Lessner, Reggie Phillips, Keith Brown, James B. Byrd