Patents by Inventor R. Allen Hill
R. Allen Hill has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10790094Abstract: A method of forming a leadless stack comprising multiple components is provided. The method comprises forming an MLCC comprising a first capacitor external termination and a second capacitor external termination and forming an electronic element is formed comprising a first element external termination and a second element external termination. The MLCC and electronic component are are arranged in a stack with a TLPS bond between the first capacitor external termination and the first element external termination.Type: GrantFiled: June 28, 2019Date of Patent: September 29, 2020Assignee: KEMET Electronics CorporationInventors: John E. McConnell, Garry L. Renner, John Bultitude, R. Allen Hill, Galen W. Miller
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Publication number: 20190318877Abstract: An electronic component is described wherein the electronic component comprises a stack of electronic elements comprising a transient liquid phase sintering adhesive between and in electrical contact with each said first external termination of adjacent electronic elementsType: ApplicationFiled: June 28, 2019Publication date: October 17, 2019Inventors: John E. McConnell, Garry L. Renner, John Bultitude, R. Allen Hill, Galen W. Miller
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Patent number: 10381162Abstract: An electronic component is described wherein the electronic component comprises a stack of electronic elements comprising a transient liquid phase sintering adhesive between and in electrical contact with each said first external termination of adjacent electronic elements.Type: GrantFiled: August 7, 2017Date of Patent: August 13, 2019Assignee: KEMET Electronics CorporationInventors: John E. McConnell, Garry L. Renner, John Bultitude, R. Allen Hill, Galen W. Miller
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Patent number: 10068708Abstract: A method of forming a stacked electronic component, and an electronic component formed by the method wherein the method includes: providing a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination; providing a first lead frame plate and a second lead frame plate wherein the first lead frame plate and the second lead frame plate comprises barbs and leads; providing a molded case comprising a cavity and a bottom; and forming a sandwich of electronic components in an array between the first lead frame plate and the second lead frame plate with the barbs protruding towards the electronic components and the leads extending through the bottom.Type: GrantFiled: January 27, 2016Date of Patent: September 4, 2018Assignee: KEMET Electronics CorporationInventors: Maurice Perea, R Allen Hill, Reggie Phillips
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Patent number: 9847175Abstract: A method of forming a stacked electronic component, and an electronic component formed by the method wherein the method includes: providing a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination; providing a first lead frame plate and a second lead frame plate wherein the first lead frame plate and the second lead frame plate comprises barbs and leads; providing a molded case comprising a cavity and a bottom; and forming a sandwich of electronic components in an array between the first lead frame plate and the second lead frame plate with the barbs protruding towards the electronic components and the leads extending through the bottom.Type: GrantFiled: January 10, 2014Date of Patent: December 19, 2017Assignee: KEMET Electronics CorporationInventors: Maurice Perea, R Allen Hill, Reggie Phillips
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Publication number: 20170358397Abstract: An electronic component is described wherein the electronic component comprises a stack of electronic elements comprising a transient liquid phase sintering adhesive between and in electrical contact with each said first external termination of adjacent electronic elementsType: ApplicationFiled: August 7, 2017Publication date: December 14, 2017Inventors: John E. McConnell, Garry L. Renner, John Bultitude, R. Allen Hill, Galen W. Miller
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Patent number: 9799449Abstract: A capacitor with improved lead frame attachment is described wherein the improved lead frame attachment mitigates defects. The capacitor comprises parallel conductive internal electrodes of alternating polarity with a dielectric between the conductive internal electrodes. A first copper undercoat is in electrical contact with the conductive internal electrodes of a first polarity and a second copper undercoat is in electrical contact with conductive internal electrodes of a second polarity. A first lead is in electrical contact with the first copper undercoat with a first solder between the first lead and the first copper undercoat. A second lead is in electrical contact with the second copper undercoat with a second solder between the second lead and the second copper undercoat.Type: GrantFiled: September 26, 2014Date of Patent: October 24, 2017Assignee: KEMET Electronics CorporationInventors: R. Allen Hill, Philip M. Lessner, Reggie Phillips, Keith Brown, James B. Byrd
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Publication number: 20160141106Abstract: A method of forcing a stacked electronic component, and an electronic component formed by the method, therein the method includes: providing a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination; providing a first lead frame plate and a second lead frame plate wherein the first lead frame plate and the second lead frame plate comprises barbs and leads; providing a molded case comprising a cavity and a bottom; and terming a sandwich of electronic components in an array between the first lead frame plate and the second lead frame plate which the barbs protruding towards the electronic components and the leads extending through the bottom.Type: ApplicationFiled: January 27, 2016Publication date: May 19, 2016Inventors: Maurice Perea, R Allen Hill, Reggie Phillips
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Publication number: 20150036263Abstract: A capacitor with improved lead frame attachment is described wherein the improved lead frame attachment mitigates defects. The capacitor comprises parallel conductive internal electrodes of alternating polarity with a dielectric between the conductive internal electrodes. A first copper undercoat is in electrical contact with the conductive internal electrodes of a first polarity and a second copper undercoat is in electrical contact with conductive internal electrodes of a second polarity. A first lead is in electrical contact with the first copper undercoat with a first solder between the first lead and the first copper undercoat. A second lead is in electrical contact with the second copper undercoat with a second solder between the second lead and the second copper undercoat.Type: ApplicationFiled: September 26, 2014Publication date: February 5, 2015Inventors: R. Allen Hill, Philip M. Lessner, Reggie Phillips, Keith Brown, James B. Byrd
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Publication number: 20140123453Abstract: A method of forming a stacked electronic component, and an electronic component formed by the method wherein the method includes: providing a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination; providing a first lead frame plate and a second lead frame plate wherein the first lead frame plate and the second lead frame plate comprises barbs and leads; providing a molded case comprising a cavity and a bottom; and forming a sandwich of electronic components in an array between the first lead frame plate and the second lead frame plate with the barbs protruding towards the electronic components and the leads extending through the bottom.Type: ApplicationFiled: January 10, 2014Publication date: May 8, 2014Applicant: Kemet Electronics CorporationInventors: Maurice Perea, R. Allen Hill, Reggie Phillips
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Publication number: 20130107419Abstract: A capacitor with improved lead frame attachment is described wherein the improved lead frame attachment mitigates defects. The capacitor comprises parallel conductive internal electrodes of alternating polarity with a dielectric between the conductive internal electrodes. A first copper undercoat is in electrical contact with the conductive internal electrodes of a first polarity and a second copper undercoat is in electrical contact with conductive internal electrodes of a second polarity. A first lead is in electrical contact with the first copper undercoat with a first solder between the first lead and the first copper undercoat. A second lead is in electrical contact with the second copper undercoat with a second solder between the second lead and the second copper undercoat.Type: ApplicationFiled: October 28, 2011Publication date: May 2, 2013Applicant: KEMET ELECTRONICS CORPORATIONInventors: R. Allen Hill, Philip M. Lessner, Reggie Phillips, Keith Brown, James B. Byrd