Abstract: A wafer test and burn-in fixture and methodology including a wafer probe having flexible tabs and a load board coupled to the wafer probe using the flexible tabs. The fixture also includes a bladder which biases the wafer probe to contact a wafer. A temperature control apparatus is provided to control the temperature of the wafer probe and the wafer. Tests are performed on the wafer using built-in self tests or wrap wiring tests.

Abstract: A microelectronic module comprising at least two chips mounted to a chip receiving surface. Each chip having an edge including at least one chip input and one chip output. The chips are arranged such that the edge of one chip is opposite the edge of the other chip. The chips are spaced apart by a predetermined distance. Each chip includes at least one optical transmitter attached to the edge of the chip. The transmitter has an input coupled to the chip output and a transmission portion for generating optical signals at a predetermined angle and that are representative of signals inputted to the transmitter input. The microelectronic module further includes at least one optical receiver attached to the edge of the chip. The optical receiver has an output coupled to the chip input and a receiving portion for directly receiving optical signals generated by a corresponding optical transmitter of the other chip. The optical receiver and the corresponding optical transmitter form a transmitter/receiver pair.

Abstract: A heat sink is placed in a heat transfer relationship with a substrate such as an integrated chip, chip carrier, or other electronic package, without imparting stressful forces to the substrate by connecting the heat sink to a frame which is connected to a support such as a printed circuit board or other suitable carrier on which the substrate is positioned. The heat sink extends through an aperture in the frame and is in heat transfer relationship with a surface of the substrate; however, it is mechanically decoupled from the substrate. The invention has particular application in thermally connecting large heat sinks to substrates that are surface mounted on the support using technologies such as ceramic ball or column grid arrays, plastic ball or column grid arrays, or solder balls or columns.

Abstract: A chip package includes a substrate formed from a first die and its attendant wiring interconnections, having a first thermal coefficient of expansion. The first die includes primary input/output (I/O) interconnections for the chip package. Also provided is a second die that includes escape wiring formed on that die and coupled to the primary I/O interconnections through the first die. The second die has a second thermal coefficient of expansion similar to the first thermal coefficient of expansion. The chip package also includes connectors that couple the primary I/O interconnections of the first die to a second level package. An interposer may be provided to couple the primary I/O interconnections to the second level package. The second die is smaller than the first die. The peripheral area of the first die is left exposed when the second die is coupled to the first die so that sufficient I/O interconnections may be formed for the primary I/O interconnections on the first die.

Abstract: Method for replacing a coolant containing PCB in electrical induction apparatus having a tank containing the PCB-containing coolant, an electrical winding and porous solid cellulosic electrical insulation immersed in, and impregnated with, the PBC-containing coolant with a substantially PCB-free permanent coolant to convert said electrical apparatus into one in which the rate of elution of PCB into the PCB-free coolant is below the maximum allowable rate of elution into the coolant of an electrical apparatus rated as non-PCB comprising steps of: (a) draining the PCB-containing coolant from said tank; (b) filling the tank with an interim dielectric cooling liquid; (c) electrically operating the apparatus; (d) thereafter draining the interim dielectric cooling liquid containing the eluted PCB from the tank; (e) repeating the cycle of steps (b), (c) and (d) a sufficient number of times until the PCB elution rate does not exceed the rate of 50 ppm PCB based on the weight of the permanent coolant after 90 days of

Abstract: Method of replacing a PCB-containing coolant in electrical induction apparatus having a vessel containing said PCB-containing coolant, an electrical winding and porous solid cellulosic electrical insulation immersed in, and impregnated with, said PCB-containing coolant with a substantially PCB-free high boiling dielectric permanent coolant into which any residual PCBs elute at no greater than a selected target rate comprising steps of (a) draining the PCB-containing coolant from the vessel, (b) filling the vessel with an interim dielectric coolant, (c) electrically operating the apparatus, (d) removing interim coolant containing eluted PCB, (e) repeating steps (b), (c) and (d) a sufficient number of times until the PCB elution rate does not exceed 5 times a selected target rate, (f) filling the vessel with PCB-free high boiling dielectric silicone oil as coolant, (g) electrically operating the apparatus, (h) thereafter removing the silicone oil coolant containing eluted PCB, (i) repeating steps (f), (g) and (

Abstract: A regenerable process for scrubbing SO.sub.2 from effluent gases using an aqueous alkanolamine and the corresponding sulfite as the solvent, such amine having a boiling point below about 250.degree. C. at one atmosphere pressure and wherein the alkanolamine solutions containing heat stable salts (HSS) is regenerated by alkali addition, crystallization and vacuum distillation of the amine.

Abstract: Method for scrubbing SO.sub.2 from effluent gases using aqueous monoethanolamine and the corresponding sulfite as the solvent. The method is especially useful where the effluent gases contain an abundance of CO.sub.2 relative to SO.sub.2.

Abstract: Improvement in processes for the selective removal of sulfur dioxide with respect to carbon dioxide from a gas mixture containing same wherein the gas mixture is contacted with an aqueous absorbent solution, such as alkanolamine, alkali metal hydroxide, ammonium hydroxide or sulfites thereof, to remove sulfur dioxide from the gas mixture and form a SO.sub.2 -rich aqueous absorbent solution which is moved to a stripping zone where sulfur dioxide is driven off to form a SO.sub.2 -depleted aqueous absorbent solution which is recycled and re-contacted with the gas mixture, the improvement comprising removing sulfur oxyanions of heat stable salts which accumulate in the aqueous absorbent solution by contacting a portion of it with an anion exchange resin having hydroxyl anions displaceable by the heat stable sulfur oxyanions whereby the hydroxyl anions of the resin are replaced by the heat stable divalent sulfur oxyanions which are thus taken out of the solution.