Patents by Inventor R. Bruce Van Dover

R. Bruce Van Dover has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11186494
    Abstract: Provided is room temperature stable ?-phase Bi2O3. Ion conductive compositions comprise at least 95 wt % ?-phase Bi2O3, and, at 25° C., the compositions are stable and have a conductivity of at least 10?7 S/cm. Related methods, electrochemical cells, and devices are also disclosed.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: November 30, 2021
    Assignee: CORNELL UNIVERSITY
    Inventors: Robert Bell, Marc Murphy, R. Bruce Van Dover, Michael O. Thompson, Peter A. Beaucage
  • Patent number: 10879539
    Abstract: A metal oxide compound of formula (I): MnxMyRu1-(x+y)O2??(I) is a single phase rutile-type structure, where M is Co, Ni, or Fe, or a combination thereof, x>0, y?0, and 0.02?(x+y)?0.30. Related electro-catalysts, devices, and processes are also provided.
    Type: Grant
    Filed: June 7, 2017
    Date of Patent: December 29, 2020
    Assignee: CORNELL UNIVERSITY
    Inventors: Marc Murphy, Ryo H. Wakabayashi, R. Bruce Van Dover, Héctor D. Abruña, Francis J. Disalvo
  • Publication number: 20200223711
    Abstract: Provided is room temperature stable ?-phase Bi2O3. Ion conductive compositions comprise at least 95 wt % ?-phase Bi2O3, and, at 25° C., the compositions are stable and have a conductivity of at least 10?7 S/cm. Related methods, electrochemical cells, and devices are also disclosed.
    Type: Application
    Filed: March 27, 2020
    Publication date: July 16, 2020
    Applicant: CORNELL UNIVERSITY
    Inventors: Robert BELL, Marc MURPHY, R. Bruce VAN DOVER, Michael O. THOMPSON, Peter A. BEAUCAGE
  • Publication number: 20190173097
    Abstract: A metal oxide compound of formula (I): MnxMyRu1-(x+y)O2 ??(I) is a single phase rutile-type structure, where M is Co, Ni, or Fe, or a combination thereof, x>0, y?0, and 0.02?(x+y)?0.30. Related electro-catalysts, devices, and processes are also provided.
    Type: Application
    Filed: June 7, 2017
    Publication date: June 6, 2019
    Applicant: CORNELL UNIVERSITY
    Inventors: Marc MURPHY, Ryo H. WAKABAYASHI, R. Bruce VAN DOVER, Héctor D. ABRUÑA, Francis J. DISALVO
  • Patent number: 7021518
    Abstract: The present invention provides a power micromagnetic integrated circuit having a ferromagnetic core, a method of manufacture therefor and a power processing circuit employing the same, that-includes: (1) a substrate; (2) an insulator coupled to the substrate and (3) a metallic adhesive that forms a bond between the insulator and the ferromagnetic core to secure the ferromagnetic core to the substrate.
    Type: Grant
    Filed: March 13, 2003
    Date of Patent: April 4, 2006
    Assignee: Agere Systems Inc.
    Inventors: Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
  • Patent number: 6696744
    Abstract: A method of manufacturing an integrated circuit and an integrated circuit employing the same. In one embodiment, the method of manufacturing the integrated circuit includes (1) conformally mapping a micromagnetic device, including a ferromagnetic core, to determine appropriate dimensions therefor, (2) depositing an adhesive over an insulator coupled to a substrate of the integrated circuit and (3) forming the ferromagnetic core of the appropriate dimensions over the adhesive.
    Type: Grant
    Filed: October 15, 2001
    Date of Patent: February 24, 2004
    Assignee: Agere Systems, Inc.
    Inventors: Anatoly Feygenson, Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
  • Patent number: 6649422
    Abstract: An integrated circuit and method of manufacturing therefor. In one embodiment, the integrated circuit includes a substrate with an insulator and a capacitor formed over the substrate. The integrated circuit further includes an adhesive formed over the insulator. The integrated circuit still further includes a micromagnetic device. The micromagnetic device includes a ferromagnetic core formed over the adhesive. The adhesive forms a bond between the insulator and the ferromagnetic core to secure the ferromagnetic core to the substrate. The micromagnetic device also includes at least one winding, located proximate the ferromagnetic core, to impart a desired magnetic property to the ferromagnetic core. The micromagnetic device is electrically coupled to the capacitor.
    Type: Grant
    Filed: June 21, 2001
    Date of Patent: November 18, 2003
    Assignee: Agere Systems Inc.
    Inventors: Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
  • Publication number: 20030150898
    Abstract: The present invention provides a power micromagnetic integrated circuit having a ferromagnetic core, a method of manufacture therefor and a power processing circuit employing the same, that-includes: (1) a substrate; (2) an insulator coupled to the substrate and (3) a metallic adhesive that forms a bond between the insulator and the ferromagnetic core to secure the ferromagnetic core to the substrate.
    Type: Application
    Filed: March 13, 2003
    Publication date: August 14, 2003
    Applicant: Agere Systems Inc.
    Inventors: Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
  • Patent number: 6440750
    Abstract: A method of manufacturing an integrated circuit and an integrated circuit employing the same. In one embodiment, the method of manufacturing the integrated circuit includes (1) conformally mapping a micromagnetic device, including a ferromagnetic core, to determine appropriate dimensions therefor, (2) depositing an adhesive over an insulator coupled to a substrate of the integrated circuit and (3) forming the ferromagnetic core of the appropriate dimensions over the adhesive.
    Type: Grant
    Filed: February 23, 2000
    Date of Patent: August 27, 2002
    Assignee: Agere Systems Guardian Corporation
    Inventors: Anatoly Feygenson, Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
  • Publication number: 20020037434
    Abstract: A method of manufacturing an integrated circuit and an integrated circuit employing the same. In one embodiment, the method of manufacturing the integrated circuit includes (1) conformally mapping a micromagnetic device, including a ferromagnetic core, to determine appropriate dimensions therefor, (2) depositing an adhesive over an insulator coupled to a substrate of the integrated circuit and (3) forming the ferromagnetic core of the appropriate dimensions over the adhesive.
    Type: Application
    Filed: October 15, 2001
    Publication date: March 28, 2002
    Inventors: Anatoly Feygenson, Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
  • Publication number: 20010036702
    Abstract: An integrated circuit and method of manufacturing therefor. In one embodiment, the integrated circuit includes a substrate with an insulator and a capacitor formed over the substrate. The integrated circuit further includes an adhesive formed over the insulator. The integrated circuit still further includes a micromagnetic device. The micromagnetic device includes a ferromagnetic core formed over the adhesive. The adhesive forms a bond between the insulator and the ferromagnetic core to secure the ferromagnetic core to the substrate. The micromagnetic device also includes at least one winding, located proximate the ferromagnetic core, to impart a desired magnetic property to the ferromagnetic core. The micromagnetic device is electrically coupled to the capacitor.
    Type: Application
    Filed: June 21, 2001
    Publication date: November 1, 2001
    Inventors: Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
  • Patent number: 6255714
    Abstract: An integrated circuit and method of manufacturing therefor. In one embodiment, the integrated circuit includes a substrate with an insulator and a capacitor formed over the substrate. The integrated circuit further includes an adhesive formed over the insulator. The integrated circuit still further includes a micromagnetic device. The micromagnetic device includes a ferromagnetic core formed over the adhesive. The adhesive forms a bond between the insulator and the ferromagnetic core to secure the ferromagnetic core to the substrate. The micromagnetic device also includes at least one winding, located proximate the ferromagnetic core, to impart a desired magnetic property to the ferromagnetic core. The micromagnetic device is electrically coupled to the capacitor.
    Type: Grant
    Filed: June 22, 1999
    Date of Patent: July 3, 2001
    Assignee: Agere Systems Guardian Corporation
    Inventors: Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
  • Patent number: 6191495
    Abstract: For use with an integrated circuit having a substrate and an insulator coupled to the substrate, a micromagnetic device and method of manufacturing therefor. In one embodiment, the micromagnetic device includes an adhesive coupled to the insulator and a ferromagnetic core, coupled to the adhesive that forms a bond between the insulator and the ferromagnetic core, having an anisotropic property.
    Type: Grant
    Filed: April 16, 1999
    Date of Patent: February 20, 2001
    Assignee: Lucent Technologies Inc.
    Inventors: Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
  • Patent number: 6163234
    Abstract: A data transmission micromagnetic integrated circuit having a ferromagnetic core, a method of manufacture therefor and a data transmission circuit employing the same. In one embodiment, the micromagnetic integrated circuit includes: (1) a substrate; (2) an insulator coupled to the substrate and (3) a metallic adhesive that forms a bond between the insulator and the ferromagnetic core to secure the ferromagnetic core to the substrate.
    Type: Grant
    Filed: July 2, 1998
    Date of Patent: December 19, 2000
    Assignee: Lucent Technologies Inc.
    Inventors: Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
  • Patent number: 6160721
    Abstract: The present invention provides a power micromagnetic integrated circuit having a ferromagnetic core, a method of manufacture therefor and a power processing circuit employing the same, that includes: (1) a substrate; (2) an insulator coupled to the substrate and (3) a metallic adhesive that forms a bond between the insulator and the ferromagnetic core to secure the ferromagnetic core to the substrate.
    Type: Grant
    Filed: January 24, 2000
    Date of Patent: December 12, 2000
    Assignee: Lucent Technologies Inc.
    Inventors: Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
  • Patent number: 6118351
    Abstract: The present invention provides a power micromagnetic integrated circuit having a ferromagnetic core, a method of manufacture therefor and a power processing circuit employing the same, that includes: (1) a substrate; (2) an insulator coupled to the substrate and (3) a metallic adhesive that forms a bond between the insulator and the ferromagnetic core to secure the ferromagnetic core to the substrate.
    Type: Grant
    Filed: June 10, 1997
    Date of Patent: September 12, 2000
    Assignee: Lucent Technologies Inc.
    Inventors: Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover