Patents by Inventor R. David Hopkins
R. David Hopkins has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9472498Abstract: A multiple access Proximity Communication system in which electrical elements on an integrated circuit chip provide the multiplexing of multiple signals to a single electrical receiving element on another chip. Multiple pads formed on one chip and receiving separate signals may be capacitively coupled to one large pad on the other chip. Multiple inductive coils on one chip may be magnetically coupled to one large coil on another chip or inductive coils on three or more chips may be used for either transmitting or receiving. The multiplexing may be based on time, frequency, or code.Type: GrantFiled: November 18, 2014Date of Patent: October 18, 2016Assignee: ORACLE INTERNATIONAL CORPORATIONInventors: Alex Chow, R. David Hopkins, II, Robert J. Drost
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Patent number: 9209165Abstract: An assembly component and a technique for assembling a chip package using the assembly component are described. This chip package includes a set of semiconductor dies that are arranged in a stack in a vertical direction, which are offset from each other in a horizontal direction to define a stepped terrace at one side of the vertical stack. Moreover, the chip package may be assembled using the assembly component. In particular, the assembly component may include a pair of stepped terraces that approximately mirror the stepped terrace of the chip package and which provide vertical position references for an assembly tool that positions the set of semiconductor dies in the vertical stack during assembly of the chip package.Type: GrantFiled: October 21, 2013Date of Patent: December 8, 2015Assignee: ORACLE INTERNATIONAL CORPORATIONInventors: Michael H. S. Dayringer, R. David Hopkins, Alex Chow
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Publication number: 20150108615Abstract: An assembly component and a technique for assembling a chip package using the assembly component are described. This chip package includes a set of semiconductor dies that are arranged in a stack in a vertical direction, which are offset from each other in a horizontal direction to define a stepped terrace at one side of the vertical stack. Moreover, the chip package may be assembled using the assembly component. In particular, the assembly component may include a pair of stepped terraces that approximately mirror the stepped terrace of the chip package and which provide vertical position references for an assembly tool that positions the set of semiconductor dies in the vertical stack during assembly of the chip package.Type: ApplicationFiled: October 21, 2013Publication date: April 23, 2015Applicant: Oracle International CorporationInventors: Michael H. S. Dayringer, R. David Hopkins, Alex Chow
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Publication number: 20150069636Abstract: A multiple access Proximity Communication system in which electrical elements on an integrated circuit chip provide the multiplexing of multiple signals to a single electrical receiving element on another chip. Multiple pads formed on one chip and receiving separate signals may be capacitively coupled to one large pad on the other chip. Multiple inductive coils on one chip may be magnetically coupled to one large coil on another chip or inductive coils on three or more chips may be used for either transmitting or receiving. The multiplexing may be based on time, frequency, or code.Type: ApplicationFiled: November 18, 2014Publication date: March 12, 2015Inventors: Alex Chow, R. David Hopkins, II, Robert J. Drost
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Patent number: 8975752Abstract: A multiple access Proximity Communication system in which electrical elements on an integrated circuit chip provide the multiplexing of multiple signals to a single electrical receiving element on another chip. Multiple pads formed on one chip and receiving separate signals may be capacitively coupled to one large pad on the other chip. Multiple inductive coils on one chip may be magnetically coupled to one large coil on another chip or inductive coils on three or more chips may be used for either transmitting or receiving. The multiplexing may be based on time, frequency, or code.Type: GrantFiled: January 9, 2008Date of Patent: March 10, 2015Assignee: Oracle America, Inc.Inventors: Alex Chow, R. David Hopkins, Robert J. Drost
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Patent number: 8097869Abstract: A diversity proximity communication system formed on two juxtaposed chips, one having a two-dimensional array of transmit elements, the other having a two-dimensional array of receive elements. The receive and transmit elements need not be aligned and may have nominal alignment of one transmit element overlapping the corners of four receive elements. The elements may be electrical pads capacitively coupled across the interface. Signals of four different multiplexing groups, e.g., time-multiplexed, are supplied to transmitting elements in a 2×2 array. Signals from four receive elements in a 2×2 array are amplified, combined, and demultiplexed for the selected multiplexing group. The gains for the four signals to be combined are differentially controlled to increase the signal-to-noise ratio. The amplification may be determined by the overlap between each of the receive elements and the transmit element of the selected multiplexing group.Type: GrantFiled: May 6, 2008Date of Patent: January 17, 2012Assignee: Oracle America, Inc.Inventors: Alex Chow, R. David Hopkins, Robert J. Drost
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Publication number: 20090279571Abstract: A diversity proximity communication system formed on two juxtaposed chips, one having a two-dimensional array of transmit elements, the other having a two-dimensional array of receive elements. The receive and transmit elements need not be aligned and may have nominal alignment of one transmit element overlapping the corners of four receive elements. The elements may be electrical pads capacitively coupled across the interface. Signals of four different multiplexing groups, e.g., time-multiplexed, are supplied to transmitting elements in a 2×2 array. Signals from four receive elements in a 2×2 array are amplified, combined, and demultiplexed for the selected multiplexing group. The gains for the four signals to be combined are differentially controlled to increase the signal-to-noise ratio. The amplification may be determined by the overlap between each of the receive elements and the transmit element of the selected multiplexing group.Type: ApplicationFiled: May 6, 2008Publication date: November 12, 2009Applicant: SUN MICROSYSTEMS, INC.Inventors: Alex Chow, R. David Hopkins, Robert J. Drost
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Publication number: 20090176450Abstract: A multiple access Proximity Communication system in which electrical elements on an integrated circuit chip provide the multiplexing of multiple signals to a single electrical receiving element on another chip. Multiple pads formed on one chip and receiving separate signals may be capacitively coupled to one large pad on the other chip. Multiple inductive coils on one chip may be magnetically coupled to one large coil on another chip or inductive coils on three or more chips may be used for either transmitting or receiving. The multiplexing may be based on time, frequency, or code.Type: ApplicationFiled: January 9, 2008Publication date: July 9, 2009Applicant: SUN MICROSYSTEMS, INC.Inventors: Alex Chow, R. David Hopkins, Robert J. Drost
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Patent number: 7129712Abstract: An electrical circuit for determining a capacitance is described. The electrical circuit includes a first device, a rectifying circuit and a feedback circuit. The first device has a first terminal and a second terminal. The first device has a first unknown capacitance and the first terminal may be configured to receive a time-varying voltage signal. The rectifying circuit has an input terminal, an output terminal and a feedback terminal. The input terminal may be coupled to the second terminal and the output terminal may be configured for coupling to an output electrical circuit. The feedback circuit may selectively couple the output terminal to the input terminal using the feedback terminal such that the output terminal and the input terminal are substantially at a common voltage.Type: GrantFiled: October 24, 2005Date of Patent: October 31, 2006Assignee: Sun Microsystems, Inc.Inventors: Robert J. Drost, R. David Hopkins, Ronald Ho