Abstract: The invention relates to an electrical assembly (10) having multi-zone temperature monitoring, comprising: a heat-generating electrical device (12); a measurement circuit (18) having a plurality of temperature-dependent electrical shunt resistors (20, 20?, 20?, 20a-20h), wherein the shunt resistors (20, 20?, 20?, 20a-20h) are positioned in mutually spaced temperature-measurement regions (22a-22h) of the heat-generating electrical device (12); and an analysis device (28) which has a measurement channel (26) for detecting measurement values, wherein the shunt resistors (20, 20?, 20?, 20a-20h) are electrically conductively connected to the measurement channel (26) of the analysis device (28) via a common measurement line (24), and the analysis device (28) is designed to determine a temperature and/or a temperature limit value being exceeded in at least one of the temperature-measurement regions (22a-22h) by analyzing the signal at the measurement channel (26).

Abstract: The invention relates to a surface temperature-controlling device, in particular for use in vehicles, comprising a first air-distributing layer which has multiple air inlets extending through the first air-distributing layer and multiple air outlets extending through the first air-distributing layer, and a second air-distributing layer which fluidically connects air inlets and air outlets of the first air-distributing layer, wherein the air inlets are designed to introduce pre-heated or pre-cooled air into the second air-distributing layer, and the air outlets are designed to discharge air out of the second air-distributing layer.

Abstract: A purification device for cleaning one or more surfaces of a vehicle, the purification device configured to apply a purification process onto the one or more surfaces of the vehicle, the purification device includes a heating device for increasing a temperature of the surface.

Abstract: A heating device for a vehicle seat, that includes at least one heating surface that is at least in sections permeable to heat radiation; and at least one heat generator arranged at least partially behind the at least one heating surface. The at least one heat generator is configured to generate the heat radiation and to emit the generated heat radiation in a direction of at least one heating surface. The at least one heating surface has a plurality of emission zones that are spaced apart from one another, for emitting the heat radiation.

Abstract: A circuit module comprising at least one integrated semiconductor circuit which is enclosed or encapsulated in an isolating housing and has a plurality of electrical terminal contacts which are led out of the isolating housing, and which are connected in an electrically conductive manner to contact surfaces of a planar intermediate carrier. The integrated semiconductor circuit together with its housing lies on or against a first side of the planar intermediate carrier. The planar intermediate carrier has edge-side outer contacts on a second side opposite the first side. The outer contacts are connected to corresponding terminal contacts of a film-like line carrier in an electrically conductive manner. The planar intermediate carrier having connection lines between the contact surfaces and the outer contacts.

Abstract: The invention relates to a surface temperature-controlling device, in particular for use in vehicles, comprising a first air-distributing layer which has multiple air inlets extending through the first air-distributing layer and multiple air outlets extending through the first air-distributing layer, and a second air-distributing layer which fluidically connects air inlets and air outlets of the first air-distributing layer, wherein the air inlets are designed to introduce pre-heated or pre-cooled air into the second air-distributing layer, and the air outlets are designed to discharge air out of the second air-distributing layer.

Abstract: A heating device for a vehicle seat, that includes at least one heating surface that is at least in sections permeable to heat radiation; and at least one heat generator arranged at least partially behind the at least one heating surface. The at least one heat generator is configured to generate the heat radiation and to emit the generated heat radiation in a direction of at least one heating surface. The at least one heating surface has a plurality of emission zones that are spaced apart from one another, for emitting the heat radiation.

Abstract: The invention relates to a thermoelectric device (10) with several, differently-doped and electrically-conductively interconnected semiconductors (12), at least one carrier substrate (14) arranged on a first side of the semiconductors (12), and at least one carrier substrate (16a-16d) arranged on a second side, opposite the first side, of the semiconductors (12), wherein at least one carrier substrate (14, 16a-16d) arranged on the first side or the second side of the semiconductors (12) has at least one recess (18a-18d, 20a-20d) which extends through the carrier substrate (14, 16a-16d) and is surrounded by substrate material, and which is designed to receive a fastening means (22a-22d).

Abstract: A thermoelectric module assembly for thermally conditioning a component includes first and second heat spreaders that are spaced apart from one another and configured to respectively provide cold and hot sides. An insulator plate is arranged between the first and second heat spreaders. The insulator plate has a compression limiter. A thermoelectric device is arranged with—in the insulator plate and operatively engaged with the first and second heat spreaders. A fastening element secures the first and second heat spreaders to one another about the insulator plate in an assembled condition. The compression limiters are configured to maintain a predetermined spacing between the first and second heat spreaders in the assembled condition.

Abstract: A device (20) for converting electrical energy into thermal energy is disclosed. The device (20) for converting electrical energy into thermal energy includes at least one layer (6) of multiple semiconductor elements (4), at least one enclosure (22), formed from at least two parts (26, 28), between whose oppositely situated broadside surfaces (26?, 28?) the at least one layer (6) of multiple semiconductor elements (4) is accommodated, wherein at least one of the two parts (26, 28) forming the enclosure (22) laterally protrudes beyond the layer (6) of multiple semiconductor elements (4), and wherein a portion (30) of the respective part (26, 28) protruding laterally beyond the layer (6) of multiple semiconductor elements (4) is a functional section (32).

Abstract: The present teachings relates to a manufacturing method for a thermoelectric device having the steps: providing a first carrier layer which is made of a metal or a metal alloy in at least some sections; providing a first dielectric oxide layer on the surface of the first carrier layer, providing a first electrically conductive bridge layer on the first dielectric oxide layer and arranging a plurality of differently doped semiconductors on the first electrically conductive bridge layer such that the semiconductors are each electrically connected to the first bridge layer on the first side.

Abstract: A thermoelectric assembly includes a thermoelectric device that has varying distribution of p-n pellets in an in-plane direction that is configured to provide non-uniform thermal conditioning. The thermoelectric device includes a first set of p-n pellets arranged in a first packing density in a first area. A second set of p-n pellets is arranged in a second packing density in a second area that is a different packing density than the first packing density.

Abstract: A cooling system for thermally conditioning a component is provided. The cooling system includes a battery providing a first side and a cold plate assembly providing a second side. A clamping support is provided, and a thermoelectric device is positioned between the first and second sides. A clamping structure is secured to the clamping support and cooperates with the battery to generate a clamping load on the thermoelectric device through the battery and with the first and second sides.

Abstract: A thermoelectric module assembly for thermally conditioning a component includes first and second members that are spaced apart from one another and are configured to respectively provide cold and hot sides. An insulator plate is arranged between the first and second members. A thermoelectric device is arranged within the insulator plate and is operatively engaged with the first and second members. A fastening element secures the first and second members to one another about the insulator plate in an assembled condition. A thermal insulator is provided in one of the first and the second members and is configured to receive the fastening element.

Abstract: A thermoelectric module assembly for thermally conditioning a component includes first and second members that are spaced apart from one another and are configured to respectively provide cold and hot sides. An insulator plate is arranged between the first and second members. A thermoelectric device is arranged within the insulator plate and is operatively engaged with the first and second members. A fastening element secures the first and second members to one another about the insulator plate in an assembled condition. The fastening element includes a temporarily compressible material that provides a compression limiter.