Abstract: An electronic device. The electronic device includes a first electrode and a coating layer. The electronic device is fabricated on a substrate; the substrate has a cavity created in a top surface of the substrate; and the first electrode is electrically coupled to the substrate. The coating layer coats at least part of a substrate surface in the cavity, and the presence of the coating layer results in a mitigation of at least one parasitic leakage path between the first electrode and an additional electrode fabricated on the substrate.

Abstract: A fluidic device is provided that includes a body and a contiguous electrically conductive layer. The body has interior and exterior surfaces. The interior surface defines at least a well and a fluid-transporting feature, e.g., a microfeature in fluid-communication with the well. The well has a sidewall and an exterior opening terminating at the exterior surface. The contiguous electrically conductive layer is located on at least the sidewall of the well and selected regions of the interior and exterior surfaces so as to form a contact pad region on the exterior surface in electrical communication with any fluid within the fluid-transporting feature. Also provided is a method for forming a fluidic device.

Abstract: Monolithic devices that include an acoustic resonator vertically integrated with electronic circuitry are described. In one aspect, a monolithic integrated device includes a substrate, electronic circuitry supported by the substrate, an acoustic isolator over the electronic circuitry, and an acoustic resonator on the acoustic isolator. A method of fabricating the monolithic device also is described.

Abstract: A resonator structure (FBAR) made of electrodes sandwich a piezoelectric material. The intersection of the two conducting electrodes defines the active area of the acoustic resonator. The active area is divided into two concentric areas; a perimeter or frame, and a central region. An annulus is added to one of the two conducting electrodes to improve the electrical performance (in terms of Q).

Abstract: A method of fabricating an apparatus including a sealed cavity and an apparatus embodying the method are disclosed. To fabricate the apparatus, a device chip including a substrate and at least one circuit element on the substrate is fabricated. Also, a cap is fabricated. Next, the device chip and the cap are bonded such that a sealed cavity is formed by the device chip and the cap. The bond is accomplished using thermo compression technique. Gold or other suitable metal can be used as a bonding agent. Then or at the same time, caulking agent is reflowed over the bonding agent, over portions of the cap, or both to further seal the cavity. In the resultant device, the sealed cavity is sealed by the bonding agent, the caulking agent, or both. The caulking agent increases hermeticity of the cavity and provides for even higher level of protection of the cavity against adverse environmental conditions.