Abstract: Semiconductor wafers having patterns of steps and grooves defining microcircuit elements thereon are coated with metallic film by supporting the wafers individually adjacent a respective ring-shaped sputtering source in stationary relationship thereto. To effectuate such individual wafer processing on a continuous basis and preserve the evacuated argon environment, a vacuum chamber sputter coating apparatus is provided which has a number of work stations therein, at least one of which includes said ring-shaped sputtering source. Also included is a load lock; and an intermittently rotating vertical plate-like wafer carrier means therewithin positioned closely adjacent the chamber entrance, and carrying wafers in turn from the load lock to the work stations. The carrier includes apertures each accepting a wafer therewithin in an upright position, with the wafers edgewise resiliently supported by clip means, without the use of any externally-originating supports such as platens.

Abstract: A replicator (10) having an impregnation head (32) utilizing a plurality of floating pins (42) is the subject of this patent application. The pins (42) extend slidably through a platen (34) of the head (32) so that, as lower ends of the pins (42) engage an upper surface (24) of a test medium (14) to deposit broths (20) containing test isolates thereon, the pins (42) will slide upwardly relative to the platen (34) so that recesses are not formed in the surface (24) of the test medium (14).

Abstract: Various metals including cobalt nickel and copper can be recovered from a roasted ground ore or waste and particularly from tailings of a pyritic gold ore by leaching with sulphuric acid, oxidizing the separated leach liquor, filtering and partially neutralizing the liquor. In an improved process, the oxidation is effected with peroxomonosulphuric acid and the neutralization with a 60:40 to 40:60 mixture of calcium and sodium hydroxide/oxide. By so doing, it is possible to minimize the number of process stages by elimination of either or both solid/liquid separations and to combine the leach and oxidation stage, or to improve the separation of metals from impurities.