Abstract: The present invention provides chaperonin polypeptides which are modified to include N-terminal and C-terminal ends that are relocated from the central pore region to various different positions in the polypeptide which are located on the exterior of the folded modified chaperonin polypeptide. In the modified chaperonin polypeptide, the naturally-occurring N-terminal and C-terminal ends are joined together directly or with an intervening linker peptide sequence. The relocated N-terminal or C-terminal ends can be covalently joined to, or bound with another molecule such as a nucleic acid molecule, a lipid, a carbohydrate, a second polypeptide, or a nanoparticle. The modified chaperonin polypeptides can assemble into double-ringed chaperonin structures. Further, the chaperonin structures can organize into higher order structures such as nanofilaments or nanoarrays which can be used to produce nanodevices and nanocoatings.

Abstract: The following application relates to nanotemplates, nanostructures, nanoarrays and nanodevices formed from wild-type and mutated chaperonin polypeptides, methods of producing such compositions, methods of using such compositions and particular chaperonin polypeptides that can be utilized in producing such compositions.

Abstract: An apparatus for sensing mis-alignment between an aircraft inertial reference frame and a reference frame of an attached sensor is disclosed. The apparatus includes a first laser mounted on the sensor and in the center of and normal to a first measuring surface; and, a second laser also mounted on the sensor perpendicular to the first laser and in the center of and normal to a second measuring surface. A first reflector is mounted to and aligned with the inertial reference frame of the aircraft and is disposed for reflecting a beam of light from the first laser, whereby misalignment in roll and yaw between the sensor and the aircraft is reflected on the first measuring surface.

Abstract: An apparatus for sensing mis-alignment between an aircraft inertial reference frame and a reference frame of an attached sensor is disclosed. The apparatus includes a first laser mounted on the sensor and in the center of and normal to a first measuring surface; and, a second laser also mounted on the sensor perpendicular to the first laser and in the center of and normal to a second measuring surface. A first reflector is mounted to and aligned with the inertial reference frame of the aircraft and is disposed for reflecting a beam of light from the first laser, whereby misalignment in roll and yaw between the sensor and the aircraft is reflected on the first measuring surface.

Abstract: A low-cost printed circuit board for a semiconductor package having the footprint of a ball grid array package has an integral heat sink, or “slug,” for the mounting of one or more semiconductor chips, capable of efficiently conducting away at least five watts from the package in typical applications. It is made by forming an opening through a sheet, or substrate, of B-stage epoxy/fiberglass composite, or “pre-preg,” then inserting a slug of a thermally conductive material having the same size and shape as the opening into the opening. The slug-containing composite is sandwiched between two thin layers of a conductive metal, preferably copper, and the resulting sandwich is simultaneously pressed and heated between the platen of a heated press.

Abstract: A low-cost printed circuit board for a semiconductor package having the footprint of a ball grid array package has an integral heat sink, or “slug,” for the mounting of one or more semiconductor chips, capable of efficiently conducting away at least five watts from the package in typical applications. It is made by forming an opening through a sheet, or substrate, of B-stage epoxy/fiberglass composite, or “pre-preg,” then inserting a slug of a thermally conductive material having the same size and shape as the opening into the opening. The slug-containing composite is sandwiched between two thin layers of a conductive metal, preferably copper, and the resulting sandwich is simultaneously pressed and heated between the platen of a heated press.

Abstract: A low-cost printed circuit board for a semiconductor package having the footprint of a ball grid array package has an integral heat sink, or “slug,” for the mounting of one or more semiconductor chips, capable of efficiently conducting away at least five watts from the package in typical applications. It is made by forming an opening through a sheet, or substrate, of B-stage epoxy/fiberglass composite, or “pre-preg,” then inserting a slug of a thermally conductive material having the same size and shape as the opening into the opening. The slug-containing composite is sandwiched between two thin layers of a conductive metal, preferably copper, and the resulting sandwich is simultaneously pressed and heated between the platen of a heated press.

Abstract: A socket for a ball grid array chip carrier package containing a die which is electrically interconnected. Individual spring elements in the socket are utilized for interconnecting each ball of the ball grid array. The individual spring elements provide upward pressure against individual sections of a substrate in direct contact with the balls of the ball grid array. The individual sections of the substrate are formed into individual beam members that are permitted to flex in response to pressure from the underlying spring elements.

Abstract: A thermoplastic chip carrier cavity package for one or more semi-conductor integrated circuit chips. A circuit substrate is formed of a suitable thermoplastic such as PPS or LCP. A casing is further formed atop the substrate with the casing being made of the suitable thermoplastic and being chemically fused to a portion of the circuit substrate to create a moisture seal therebetween. An encapsulant for filling the cavity within the casing and a lid may also be utilized to further secure and seal the chip mounted therein from moisture.

Abstract: A thermally enhanced chip carrier package with a built-in heat sink for semi-conductor integrated circuit chips. A circuit substrate is formed of a suitable thermoplastic such as PPS or LCP with a center opening and a metal attachment ring for attaching a heat sink to either the top or bottom thereof with solder. A casing is further formed on the substrate outwardly of the aperture and the heat sink mounted thereacross, the casing being comprised of the suitable thermoplastic and being chemically fused to a portion of the circuit substrate to create a moisture seal therebetween. An encapsulant for filling the cavity within the casing and a lid may also be utilized to further secure and seal the chip mounted to the heat sink secured therein.

Abstract: A system for determining whether information broadcast by a general transmitter is relevant to a particular user based on the location, velocity and/or time of an object of interest includes a remote terminal, a general broadcasting unit, a transmitter at the general broadcasting unit for broadcasting messages including a segment comprising a region, a velocity and/or a time corresponding to an event, as well as an event specific tag, and storage for storing selection criteria including current position, time and/or velocity information of the user and/or manually entered data of interest. The selection criteria may also include event specific tags. The receiver at the remote terminal receives the messages from the transmitter at the general broadcasting unit. A navigational receiver may also be used to acquire navigational information from an appropriate external source.

Abstract: An implement is coupled to the forward ends of a pair of loader lift arms through the medium of an attachment assembly comprising a pair of implement carriers respectively vertically pivotally mounted to the pair of loader lift arms by a connector rod that extends through aligned holes provided in lower locations of the carriers, the connector rod being releasably fastened to each of the carriers so that the latter are pivoted in unison by hydraulic cylinders connected between the lift arms and upper locations of the carriers. The attachment assembly further includes a pair of downwardly opening hooks welded to upper locations of the back side of the implement and including arcuate portions respectively receiving cylindrical bars defining upper ends of the pair of carriers. Also fixed to the back side of the implement are a pair of rearwardly projecting, tapered connecting pins that are respectively received in holes provided in mounting plates forming lower forward portions of the carriers.

Abstract: A pulse generator for producing high-energy, subnanosecond electromagnetic pulses. The generator comprises a pulsed cathode assembly (160) which includes a microchannel-plate electron multiplier (150) triggered by a low-intensity, pulsed electron beam. An intense, pulsed electron beam obtained from the cathode assembly is directed through aperture (71) in waveguiding structure (170). It generates electromagnetic pulses, which are carried by the waveguiding structure to load (130).

Abstract: A parking stand for an agricultural loader particularly well suited for use with tractors having mid-mounted mowers or similar tools carried beneath the tractor. The stand includes a pair of legs for each mast, the legs being adapted to fold between a stored position adjacent the mast and a supporting position extending laterally from the mast.

Abstract: A compact radiation source is obtainable by cascade ionization of a high pressure gas jet as it emerges into a vacuum. The high frequency electric field causing the ionization can be supplied by either microwave or infra-red means. The radiation produced includes ions, atoms, plasma or light, in particular, vacuum ultraviolet radiation.

Abstract: An improved crossed-beam charge-exchange ion gun in which a synthetic plasma is formed by injecting an electron beam into a collimated molecular beam just before the molecules are ionized by charge exchange with a crossed primary ion beam, thereby forming a secondary ion beam from the ionized but space-charge-neutralized and substantially undeflected molecular beam. The plasma thus formed extends to an aperture stop in an aperture tube which extends upstream from an anode downstream of which anode a cathode is placed. A field is formed within the cathode/anode space and within the aperture tube into which the plasma extends. The sheath edge of the plasma within the tube is curved by the field to form a meniscus, and the aperture, being smaller in area than the secondary ion beam upstream of the aperture, both collimates the secondary ion beam and acts as a lens stop for the subsequent immersion lens formed by the meniscus and the field region.

Abstract: A wire holder system and method of positioning and maintaining a bundle of wires. The wire holding system comprises a first wire holder for elastically holding a bundle of wires having a generally circular shape; a second wire holder which disperses the individual wires in the wire bundle and maintains the generally circular shape of the wire bundle; and a third wire holder for layering and spacing the dispersed wires exiting the second wire holder. The method of positioning and maintaining a bundle of wires includes passing the bundle through an elastic zone of the first wire holer; dispersing the individual wires in the bundle by passing them through the second wire holder; and layering and spacing the dispersed wires from the second wire holder by passing the dispersed wires through the third wire holder.

Abstract: A wire holder for holding a bundle of wires having a base, a rim integrally bound to the base, and a plurality of overlapping elastic members mounted in the rim for receiving and holding the bundle of wires.

Abstract: Structure for detachably mounting a loader to a tractor or other mobile vehicle. An upright pedestal is carried at the rearward end of each loader boom arm for positioning in a receiving support carried on respective sides of the vehicle. Guide and following surfaces provided between the lower portions of each pedestal and support facilitate quick, positive engagement of the pedestal with its support. A transverse pin at the lower end of each receiving support provides a pivotable support for a downwardly opening bracket which is carried on each pedestal and is guided onto the pin by the guide and following surfaces. Engagement of the bracket on the pin horizontally locates the pedestal relative to the support and vertically positions alignable and releasable fastening structure carried between each pedestal and support.