Abstract: An inkjet nozzle assembly having: a nozzle chamber for containing ink, the nozzle chamber including a floor and a roof having a nozzle opening defined therein; and a plurality of moveable paddles defining part of the roof. The plurality of paddles are actuable to cause ejection of an ink droplet from the nozzle opening. Each paddle includes a thermal bend actuator, and each actuator is independently controllable via respective drive circuitry such that a direction of droplet ejection from the nozzle opening is controllable by independent movement of each paddle.

Abstract: A thermal bend actuator includes: an active beam for connection to drive circuitry; and a passive beam mechanically cooperating with the active beam, such that when a current is passed through the active beam, the active beam expands relative to the passive beam, resulting in bending of the actuator. The passive beam has first and second layers with the second layer sandwiched between the first layer and the active beam. The first layer is thicker than the second layer.

Abstract: A method of fabricating a printhead integrated circuit configured for backside electrical connections. The method comprises the steps of: (a) providing a wafer comprising a plurality of partially-fabricated nozzle assemblies on a frontside of the wafer and through-silicon connectors extending from the frontside towards a backside of the wafer; (b) depositing a conductive layer on the frontside of said wafer and etching to form an actuator for each nozzle assembly and a frontside contact pad over a head of each through-silicon connector; (c) performing further MEMS processing steps to complete formation of nozzle assemblies ink supply channels through-silicon connectors; and (d) dividing the wafer into individual printhead integrated circuits. Each printhead integrated circuit thus formed is configured for backside-connection to the drive circuitry via the through-silicon connectors the contact pads.

Abstract: A thermal bend actuator comprises an active beam for connection to drive circuitry and a passive beam mechanically cooperating with the active beam. When a current is passed through the active beam, the active beam expands relative to the passive beam resulting in bending of the actuator. The passive beam comprises a first layer comprised of silicon nitride and a second layer comprised of silicon dioxide. The second layer is sandwiched between the first layer and the active beam to provide thermal insulation for the first layer.

Abstract: An inkjet printhead assembly includes: an ink supply manifold; printhead integrated circuits attached to the ink supply manifold, each printhead integrated circuit having a frontside including drive circuitry and a plurality of inkjet nozzle assemblies disposed on the drive circuitry; and a connector film for supplying power to the drive circuitry. An integrated circuit contact positioned in a backside recessed portion of each printhead integrated circuit is connected to the connector film. The integrated circuit contact is electrically connected to the drive circuitry via a connector rod extending through the printhead integrated circuit.

Abstract: A MEMS integrated circuit includes a silicon substrate having a frontside with a drive circuitry layer and a backside. A MEMS layer is disposed on the drive circuitry layer. The MEMS layer includes a plurality of MEMS devices electrically connected to the drive circuitry layer. Connector posts extends from the drive circuitry layer to a contact pad positioned in a roof of the MEMS layer and through-silicon connectors extending linearly from the contact pad, through the drive circuitry layer and the silicon substrate, towards the backside of the silicon substrate. Each through-silicon connector terminates at a backside integrated circuit contact, such that each integrated circuit contact is electrically connected to the drive circuitry layer via the contact pad positioned in the roof of the MEMS layer.

Abstract: A MEMS integrated circuit includes a silicon substrate having a frontside with a drive circuitry layer and a backside. A MEMS layer is disposed on the drive circuitry layer. The MEMS layer includes a plurality of MEMS devices electrically connected to the drive circuitry layer. Integrated circuit contacts are positioned at a backside of the substrate. The integrated circuit contacts are electrically connected to the drive circuitry layer via respective connector rods extending through the substrate.

Abstract: A thermal bend actuator comprises an active beam for connection to drive circuitry and a passive beam mechanically cooperating with the active beam. When a current is passed through the active beam, the active beam expands relative to the passive beam resulting in bending of the actuator. The passive beam comprises a first layer comprised of silicon nitride and a second layer comprised of silicon dioxide. The second layer is sandwiched between the first layer and the active beam to provide thermal insulation for the first layer.

Abstract: A method of fabricating a thermal bend actuator comprises the steps of: (a) depositing a first layer comprised of silicon nitride onto a sacrificial scaffold; (b) depositing a second layer comprised of silicon dioxide onto the first layer; (c) depositing an active beam layer onto the second layer; (d) etching the active beam layer, the first layer and the second layer to define the thermal bend actuator; and (e) releasing the thermal bend actuator by removing the sacrificial scaffold.

Abstract: An inkjet printhead for ejection of an ejectable fluid. The printhead has an ink ejection face coated with a polymeric material incorporating nanoparticles. The nanoparticles impart predetermined characteristics to the ink ejection face, which complement an inherent property of the ejectable fluid, a printhead maintenance regime associated with the printhead or a type of nozzle actuator.

Abstract: A printhead integrated circuit has a frontside comprising drive circuitry and inkjet nozzle assemblies, a backside for attachment to an ink supply manifold and ink supply channels providing fluid communication between the backside and the inkjet nozzle assemblies. The backside has a recessed portion for accommodating part of a connector film, which supplies power to the drive circuitry.

Abstract: A printhead having an ink ejection face coated with a hydrophobic polymeric material. The polymeric material is comprised of a polysilsesquioxane, such as poly(methylsilsesquioxane) or poly(phenylsilsesquioxane). The printhead is compatible with various printhead maintenance operations requiring contact with the ink ejection face.

Abstract: A method of fabricating a printhead integrated circuit configured for backside electrical connections. The method comprises the steps of: (a) providing a wafer comprising a plurality of partially-fabricated nozzle assemblies on a frontside of the wafer and through-silicon connectors extending from the frontside towards a backside of the wafer; (b) depositing a conductive layer on the frontside of said wafer and etching to form an actuator for each nozzle assembly and a frontside contact pad over a head of each through-silicon connector; (c) performing further MEMS processing steps to complete formation of nozzle assemblies ink supply channels through-silicon connectors; and (d) dividing the wafer into individual printhead integrated circuits. Each printhead integrated circuit thus formed is configured for backside-connection to the drive circuitry via the through-silicon connectors the contact pads.

Abstract: A printhead integrated circuit comprising a silicon substrate defining a frontside and a backside, inkjet nozzle assemblies positioned at the frontside, drive circuitry for supplying power to the inkjet nozzle assemblies and through-silicon connectors extending from the frontside towards the backside. The through-silicon connectors provides electrical connections between the drive circuitry and corresponding integrated circuit contacts. The integrated circuit contacts are positioned for connection to a backside-mounted connector film supplying power to the drive circuitry.

Abstract: A printhead having an ink ejection face, wherein at least part of the ink ejection face is coated with a polymeric material. The polymeric material is comprised of a polymerized siloxane incorporating nanoparticles. The printhead may be compatible with various printhead maintenance operations, ink characteristics and inkjet nozzle types.

Abstract: A method of fabricating an inkjet printhead assembly having backside electrical connections. The method comprises the steps of: (a) providing printhead integrated circuits, each having a backside recessed edge portion and connectors extending through the integrated circuit, each connector having a head connected to frontside drive circuitry and a base in the recessed edge portion; (b) positioning a connection end of a connector film in the recessed edge portion; (c) connecting each film contact to the base of a corresponding connector; and (d) attaching the backside of each printhead integrated circuit together with the connector film to an ink supply manifold so as to provide the inkjet printhead assembly having backside electrical connections.

Abstract: An inkjet printhead assembly comprising an ink supply manifold; printhead integrated circuits and a connector film for supplying power to drive circuitry in the printhead integrated circuits. Each printhead integrated circuit has a frontside comprising the drive circuitry and inkjet nozzle assemblies, a backside attached to the ink supply manifold, and ink supply channels providing fluid communication between the backside and the inkjet nozzle assemblies. A connection end of the connector film is sandwiched between part of the ink supply manifold and the printhead integrated circuits.

Abstract: A digital micro-mirror device comprising an array of micro-mirror assemblies positioned on a substrate. Each micro-mirror assembly comprises: a mirror spaced apart from the substrate; a stem supporting the mirror; and first and second electrodes positioned on either side of the stem. The stem is comprised of a resiliently flexible material, such that the mirror can tilt either towards the first electrode or towards the second electrode by an electrostatic force. The digital micro-mirror device may be used in data projectors and the like.

Abstract: A method of fabricating a micro-mirror assembly. The method comprises the steps of: (a) forming a pair of electrodes spaced apart on a surface of a substrate; (b) depositing a layer of sacrificial material over the electrodes and the substrate; (c) defining a stem opening in the sacrificial material so as to form a scaffold; (d) depositing a layer of resiliently flexible material over the scaffold; (e) depositing a metal layer over the flexible layer; (f) etching through the metal layer and the flexible layer to define an individual micro-mirror; and (g) removing the sacrificial material to provide the micro-mirror assembly. The method produces a micro-mirror assembly with minimal number of MEMS fabrication steps.