Abstract: A solder machine that can automatically solder a fiber optic cable to a package. The solder machine includes a fixture for supporting the cable and the package. The machine has a gas heater that emits a heated inert gas. The gas heats at least a portion of the package to a soldering temperature. The machine also includes a solder dispenser that dispenses solder into the heated package. The solder attaches the fiber optic cable to the package. The inert gas prevents undesirable oxidation at the solder site. The use of an inert gas eliminates the need for solder flux. The heating, gassing and dispensing steps can be controlled by a computer to automate the entire process. The package and fiber optic cable can be supported by a pallet that is loaded and then unloaded from the machine to further improve the ease of operation and decrease the cost associated with the solder process.

Abstract: A solder machine that can automatically solder a fiber optic cable to a package. The solder machine includes a fixture for supporting the cable and the package. The machine has a gas heater that emits a heated inert gas. The gas heats at least a portion of the package to a soldering temperature. The machine also includes a solder dispenser that dispenses solder into the heated package. The solder attaches the fiber optic cable to the package. The inert gas prevents undesirable oxidation at the solder site. The use of an inert gas eliminates the need for solder flux. The heating, gassing and dispensing steps can be controlled by a computer to automate the entire process. The package and fiber optic cable can be supported by a pallet that is loaded and then unloaded from the machine to further improve the ease of operation and decrease the cost associated with the solder process.

Abstract: A solder machine that can automatically solder a fiber optic cable to a package. The solder machine includes a fixture for supporting the cable and the package. The machine has a gas heater that emits a heated inert gas. The gas heats at least a portion of the package to a soldering temperature. The machine also includes a solder dispenser that dispenses solder into the heated package. The solder attaches the fiber optic cable to the package. The inert gas prevents undesirable oxidation at the solder site. The use of an inert gas eliminates the need for solder flux. The heating, gassing and dispensing steps can be controlled by a computer to automate the entire process. The package and fiber optic cable can be supported by a pallet that is loaded and then unloaded from the machine to further improve the ease of operation and decrease the cost associated with the solder process.

Abstract: An electro-optical transducer module assembly has a substrate on which is secured a guided-wave transducer having an optical waveguide and electrode structure formed on one surface thereof with the waveguide surface in a facing relationship with the substrate. Spacers are provided to position the transducer above the substrate surface and means are provided to electrically connect the electrode structure with the substrate. Optical waveguides are affixed to the substrate adjacent to the transducer for coupling an optical signal into and out of the transducer.

Abstract: An optical connector in accordance with the invention includes a body to which an optical fiber supporting ferrule is mounted. A photo diode is rigidly mounted to the connector such that the photo active portion of the photo diode is optically coupled to the optical fiber. An interface is provided between the photo diode and an electronic circuit. In one form of the invention, the electronic circuit is mounted to the optical connector to facilitate this interface. Alternately, the circuit may be remote from the connector. In this case, the connector includes at least one electrically conductive wire lead for connecting the photo diode to the electronic circuit. An apertured substrate may be used to mount the photo diode to the ferrule with the photo diode optically coupled to the optical fiber through the aperture. The structure may be capped for protection against the environment, or alternatively, the circuit board itself may provide protection to the opto-electronic interface.

Abstract: A new and efficient method for attaching an optical fiber to a substrate to form a structurally secure optical fiber package is disclosed. The method first involves coating an optical fiber with an external layer of gold. A silicon retaining member is then provided having a groove therein sized to retain and receive the coated optical fiber. The silicon retaining member and optical fiber are then positioned on a substrate preferably constructed of alumina. Deposited on the substrate is at least one metal pad having an external gold layer on which the silicon retaining member is placed. The optical fiber, silicon retaining member, and substrate are then heated at a temperature sufficient to form a silicon/gold eutectic alloy between th silicon of the retaining member and the gold layers of the optical fiber and pad. Such heating involves a temperature of at least 370.degree. C. Heating is preferably accomplished using a resistor secured to the underside of the substrate.